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RGBW LED 3.5x3.7x2.6mm 3.4V 68mW Full Color SMD LED - Technical Specification

Complete technical specification for RGBW LED SMD package 3.5x3.7x2.6mm. Includes electrical, optical, mechanical, packaging, and handling guidelines. IPX6 waterproof, wide viewing angle, RoHS compliant.
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PDF Document Cover - RGBW LED 3.5x3.7x2.6mm 3.4V 68mW Full Color SMD LED - Technical Specification

1. Product Overview

1.1 General Description

This device is a special SMD LED package integrating four LED chips: Red (R), Green (G), Blue (B), and White (W). The compact size of 3.5mm x 3.7mm x 2.6mm makes it ideal for high-density full-color display applications. The package features a matte surface to reduce glare and is water-resistant with IPX6 rating, allowing use in outdoor and harsh environments. It is also RoHS compliant and lead-free.

1.2 Features

1.3 Applications

1.4 Package Dimension

The package dimensions are 3.5mm (length) x 3.7mm (width) x 2.6mm (height). The bottom view shows 8 solder pads with polarity markings. The top view includes a pin-mark indicator. All dimensions have a tolerance of ±0.1mm unless otherwise noted.

2. Technical Parameters

2.1 Electrical and Optical Characteristics (Ts=25°C)

ParameterRedGreenBlueWhite
Forward Voltage (min)1.7V2.7V2.7V2.7V
Forward Voltage (max)2.4V3.4V3.4V3.4V
Dominant Wavelength617-628nm520-545nm460-475nm
Bandwidth5nm per bin4nm per bin4nm per bin
Luminous Intensity (min)550mcd1450mcd320mcd1750mcd
Luminous Intensity (avg)825mcd2180mcd485mcd2600mcd
Luminous Intensity (max)1240mcd3250mcd720mcd3900mcd
Viewing Angle110 degrees

Note: Tolerance of forward voltage ±0.1V, dominant wavelength ±1nm, luminous intensity ±10%.

2.2 Absolute Maximum Ratings

ParameterRedGreenBlueWhiteUnit
Forward Current25202020mA
Reverse Voltage5555V
Operating Temp.-30 to +70°C
Storage Temp.-40 to +100°C
Power Dissipation60686868mW
Junction Temp.115°C
ESD (HBM)1000V

2.3 CIE Color Coordinates

The white LED is available in three CIE bins: 50A, 50B, and 50C. The exact coordinates should be referred to the product label. All measurements are under standardized conditions at 25°C.

2.4 Binning Information

Luminous intensity binning follows a 1:1.4 ratio. Wavelength binning is 5nm per bin for red and 4nm per bin for green and blue. Forward voltage binning is not explicitly defined but specified by min/max limits.

3. Performance Curves

3.1 Forward Voltage vs. Forward Current

Figure 1-7 shows the relationship between forward voltage and forward current for each color at 25°C. The curves illustrate a typical diode behavior with increasing voltage required for higher currents.

3.2 Forward Current vs. Relative Intensity

Figure 1-8 demonstrates that relative intensity increases with forward current. At 20mA, each color reaches its nominal intensity. The curves are approximately linear within the operating range.

3.3 Luminous Intensity vs. Ambient Temperature

Figure 1-9 shows that luminous intensity decreases as ambient temperature rises. At 70°C, the intensity can drop significantly, emphasizing the need for proper thermal management.

3.4 Solder Temperature vs. Forward Current Derating

Figure 1-10 provides a derating curve: as solder temperature increases, the maximum allowed forward current decreases. At 100°C, the current should be reduced to near zero to avoid damage.

3.5 Spectrum Distribution

Figure 1-11 shows the relative emission intensity vs. wavelength for all colors. The red peak is around 620nm, green around 530nm, blue around 470nm, and white has a broad spectrum covering 4000K and 5000K options.

3.6 Radiation Diagram

Figure 1-12 displays the radiation pattern, confirming a wide viewing angle of 110 degrees with approximately 50% relative intensity at ±55 degrees.

4. Mechanical and Packaging Information

4.1 Package Drawing

The LED package is shown with a top view, side view, bottom view, and polarity diagram. Pin 1 is marked. The soldering pattern (recommended PCB land pattern) is also provided. Glue filling is applied to protect the wire bonds.

4.2 Carrier Tape and Reel Dimensions

Each reel contains 4000 pieces. Carrier tape dimensions: the drawing shows detailed measurements. The reel has an A dimension of 100.0±0.4mm, B dimension of 14.3±0.3mm, etc. Detailed dimensions are available in the specification.

4.3 Label Information

The label includes Part Number, Lot Number (including packing machine, serial number, bin, quantity), IV, VF, Wd, IF, QTY, and Date. This ensures traceability.

4.4 Moisture Resistant Packing

The product is shipped in anti-static and moisture-proof aluminum foil bags with desiccant and a humidity indicator card (CF-HIC). The bag is then sealed.

4.5 Cardboard Box

The reels are packed in a sturdy cardboard box for transportation. The box size is not specified but designed to protect the reels.

5. Reliability Testing

5.1 Test Items and Conditions

The product has been qualified through various reliability tests: Resistance to Soldering Heat (260°C, 3 cycles), Thermal Shock (-40°C to 100°C, 15 min each, 500 cycles), Moisture Resistance (85°C/85% RH, 12h then 260°C reflow), High Temperature Storage (100°C, 1000h), Low Temperature Storage (-40°C, 1000h), Room Temperature Operating Life (25°C, 20mA, 1000h), High Temperature High Humidity Life (85°C/85% RH, 10mA, 500h), Temperature Humidity Storage (85°C/85% RH, 1000h), Low Temperature Life (-40°C, 20mA, 1000h). All tests performed with 22 samples, acceptance criteria 0/1 failure.

5.2 Failure Criteria

After testing, the following changes are acceptable: forward voltage change within ±10% of initial, reverse current ≤10µA at 5V, average luminous intensity degradation ≤30%, and no physical damage such as cracks, delamination, or non-illumination.

6. Soldering and Assembly

6.1 Reflow Soldering Profile

Recommended profile: Average ramp-up rate ≤4°C/s; preheat from 150°C to 200°C for 60-120 seconds; time above 217°C (T_L) ≤60 seconds; peak temperature 245°C with time within 5°C of peak ≤30 seconds and time at peak (T_P) ≤10 seconds; cooling rate ≤6°C/s; total time from 25°C to peak ≤8 minutes. Only one reflow soldering is allowed. Mid-temperature solder paste is recommended.

6.2 Hand Soldering and Repair

If hand soldering is necessary, keep iron temperature below 300°C for less than 3 seconds. Only one hand solder attempt. For repair, use a double-head soldering iron to remove the LED gently. Cleaning is allowed only with alcohol; avoid water, benzene, thinner, and ionic liquids containing Cl or S.

7. Handling and Storage

7.1 Storage Conditions

Before opening: store at ≤30°C and ≤60% RH for up to 6 months. After opening: use within 12 hours under ≤30°C/≤60% RH. Unused parts should be stored at ≤30°C/≤10% RH and baked at 65±5°C for 24 hours before next use. Baking conditions depend on production date and moisture exposure.

7.2 Static Electricity Precautions

This LED is sensitive to ESD. Proper grounding of equipment and use of anti-static wrist straps, pads, uniforms, and containers are required.

7.3 Reverse Voltage Protection

The internal LED chip can be damaged by continuous reverse voltage above 5V. Design circuits to ensure reverse voltage is below the absolute maximum rating, especially in matrix driving scenarios.

7.4 Safe Operating Temperature

To ensure long life, it is recommended that the LED surface temperature be kept below 55°C and the leg temperature below 75°C during operation. Proper heat sinking and PCB design are critical.

7.5 Directions for Use

Always drive each chip with constant current. Do not exceed the absolute maximum forward current per chip. When multiple chips are on, the total power dissipation of the package must be under the limit (sum of individual PDs). Avoid applying voltage when the LED is off. For matrix displays, ensure reverse voltage is controlled. Aging at 20% power for initial period is recommended if humidity is a concern.

8. Application Guidance

Typical applications include outdoor full-color video walls, decorative lighting, and amusement park attractions. When designing, pay attention to thermal management: use adequate PCB copper area, ensure proper spacing between LEDs, and consider ambient temperature derating. Use constant current drivers for uniform brightness. For rental applications, select LEDs from the same bin for color consistency.

9. Technology Comparison

Compared to traditional RGB LEDs, this device integrates an additional white chip for improved color rendering and white balance. The IPX6 water resistance provides enhanced durability for outdoor use. The wide 110-degree viewing angle ensures uniform appearance from all directions. The MSL 5a rating requires careful handling but allows flexible manufacturing.

10. Common Questions (FAQs)

Q: What is the storage life before opening? A: 6 months under ≤30°C and ≤60% RH.

Q: Can the LED be cleaned with water? A: No, only alcohol is recommended. Avoid water, benzene, thinner, and ionic liquids.

Q: What is the maximum reverse voltage allowed? A: 5V. Continuous reverse voltage may damage the chip.

Q: How many reflow cycles are permitted? A: Only one reflow soldering is allowed.

Q: What is the maximum junction temperature? A: 115°C.

11. Practical Use Cases

An example of deployment: a large outdoor video screen using an array of these RGBW SMD LEDs can achieve high brightness and vivid colors even under direct sunlight. The IPX6 rating allows installation in locations exposed to rain and splashing water. For decorative lighting, the small package size enables compact fixture designs.

12. Principle of RGBW LED

An RGBW LED combines three primary color chips (Red, Green, Blue) and a separate white chip. The white chip can be a phosphor-converted blue LED or a direct white LED (typically a blue chip with yellow phosphor). By mixing the four channels, a wider color gamut and better white balance can be achieved compared to RGB-only solutions. The white chip provides a baseline brightness, while the RGB chips add color saturation.

13. Development Trends

The LED display industry is moving toward higher resolution (smaller pixel pitch), higher brightness, and better environmental protection. Products like this RGBW SMD LED with IPX6 rating address the demand for reliable outdoor displays. Future trends include even lower power consumption, higher luminous efficacy, and integration with smart control systems.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.