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LTS-2801AKS 0.28-inch Yellow LED Display Datasheet - Digit Height 7.0mm - Forward Voltage 2.6V - Power 70mW - English Technical Document

Complete technical specifications and application guide for the LTS-2801AKS, a 0.28-inch single-digit seven-segment AlInGaP yellow LED display with common anode configuration.
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PDF Document Cover - LTS-2801AKS 0.28-inch Yellow LED Display Datasheet - Digit Height 7.0mm - Forward Voltage 2.6V - Power 70mW - English Technical Document

1. Product Overview

The LTS-2801AKS is a single-digit, seven-segment alphanumeric LED display module. It is designed to provide clear, high-contrast numeric and limited alphanumeric character representation in a compact form factor. The core technology utilizes Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material deposited on a Gallium Arsenide (GaAs) substrate, which is engineered to emit light in the yellow wavelength spectrum. This specific material choice offers advantages in efficiency and luminous intensity for the target color. The device features a gray-colored faceplate with white segment delineations, enhancing contrast and readability under various lighting conditions. Its primary design purpose is for integration into electronic equipment where space is constrained but clear numeric indication is required, such as in instrumentation panels, consumer electronics displays, and industrial control interfaces.

1.1 Key Features and Advantages

1.2 Device Identification

The part number LTS-2801AKS specifically denotes a yellow-emitting AlInGaP LED display with a common anode electrical configuration and includes a right-hand decimal point. This naming convention allows for precise identification of the device's optical and electrical characteristics.

2. Mechanical and Package Information

The display is housed in a standard LED package designed for through-hole mounting on printed circuit boards (PCBs). Detailed dimensional drawings are provided in the datasheet, specifying the overall footprint, segment placement, and lead (pin) positions. Critical mechanical notes include tolerances of ±0.25mm on most dimensions, specifications regarding allowable cosmetic imperfections (such as foreign material or bubbles within the segment area), and pin positional tolerances. The manufacturer recommends a PCB hole diameter of 1.0 mm for optimal mechanical fit and solder joint reliability.

3. Electrical Configuration and Pinout

3.1 Internal Circuit Diagram

The device employs a common anode configuration. This means the anode terminals (positive side) of all LED segments and the decimal point are connected internally to common pins. Each individual segment (A through G) and the decimal point (D.P.) has its own dedicated cathode (negative) pin. This configuration is typical for multiplexed driving circuits, where the common anodes are selectively powered while the appropriate cathode pins are grounded to illuminate specific segments.

3.2 Pin Connection Table

The 10-pin device has the following pinout configuration: Pin 1: Cathode for segment E; Pin 2: Cathode for segment D; Pin 3: Common Anode; Pin 4: Cathode for segment C; Pin 5: Cathode for Decimal Point (D.P.); Pin 6: Cathode for segment B; Pin 7: Cathode for segment A; Pin 8: Common Anode (second connection); Pin 9: Cathode for segment G; Pin 10: Cathode for segment F. The dual common anode pins (3 and 8) are internally connected and provide design flexibility for current distribution.

4. Absolute Maximum Ratings and Characteristics

4.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. They are not intended for normal operation. Key limits include: Maximum power dissipation per segment: 70 mW; Peak forward current per segment (under pulsed conditions: 1/10 duty cycle, 0.1ms pulse width): 60 mA; Continuous forward current per segment: 25 mA at 25°C, derating linearly above this temperature; Reverse voltage per segment: 5 V (Note: this is for test purposes only, continuous reverse bias operation is not supported); Operating and storage temperature range: -35°C to +105°C. The datasheet also specifies soldering conditions, limiting the temperature at the seating plane to a maximum of 260°C for 5 seconds during assembly.

4.2 Electrical and Optical Characteristics

These parameters are measured under typical conditions (Ta=25°C) and define the expected performance. Key specifications include: Average Luminous Intensity per Segment (Iv): 500 ucd (min), 1400 ucd (typ) at a forward current (If) of 1 mA; Peak Emission Wavelength (λp): 588 nm (typ) at If=20mA; Spectral Line Half-Width (Δλ): 15 nm (typ); Dominant Wavelength (λd): 587 nm (typ); Forward Voltage per Chip (Vf): 2.0 V (min), 2.60 V (typ) at If=20mA; Reverse Current per Segment (Ir): 100 µA (max) at Vr=5V; Luminous Intensity Matching Ratio: 2:1 (max) for segments within the same device. Important notes clarify that luminous intensity is measured with a CIE-standard eye-response filter and that the specified reverse voltage is solely for leakage current testing, not for functional operation.

5. Performance Curves and Graphical Data

The datasheet includes a section for typical performance curves. These graphs visually represent the relationship between key parameters, providing designers with a deeper understanding of device behavior beyond the tabulated minimum, typical, and maximum values. While the specific curves are not detailed in the provided text, typical plots for such a device would include: Forward Current (If) vs. Forward Voltage (Vf), showing the diode's IV characteristic; Relative Luminous Intensity vs. Forward Current (If), indicating how light output scales with drive current; Relative Luminous Intensity vs. Ambient Temperature (Ta), demonstrating the thermal dependence of brightness; and possibly a spectral distribution graph showing the intensity of emitted light across wavelengths, centered around the 588 nm peak.

6. Reliability Testing and Qualifications

The device undergoes a comprehensive suite of reliability tests based on established industry standards (MIL-STD, JIS). This ensures its robustness and longevity in the field. The test regimen includes: Operation Life (RTOL): 1000 hours of continuous operation at maximum rated current under room temperature conditions. Environmental Stress Tests: High Temperature High Humidity Storage (65°C, 90-95% RH for 500Hrs), High Temperature Storage (105°C for 1000Hrs), Low Temperature Storage (-35°C for 1000Hrs). Mechanical Stress Tests: Temperature Cycling (30 cycles between -35°C and 105°C) and Thermal Shock (30 cycles between -35°C and 105°C with rapid transitions). Process Validation Tests: Solder Resistance (260°C for 10 seconds) and Solderability (245°C for 5 seconds) to verify the integrity of the package leads during assembly.

7. Soldering and Assembly Guidelines

7.1 Automated Soldering Process

For wave or reflow soldering processes, the recommendation is to limit the temperature at a point 1/16 inch (approximately 1.6 mm) below the seating plane (where the package body meets the PCB) to a maximum of 260°C for a duration not exceeding 5 seconds. This profile helps prevent thermal damage to the internal LED chips and the epoxy package material.

7.2 Manual Soldering Process

When using a hand soldering iron, care must be taken to localize heat. The guideline is to apply the iron tip 1/16 inch below the seating plane for a maximum of 5 seconds, with the iron tip temperature controlled to 350°C ±30°C. Using a temperature-controlled iron and a skilled operator is crucial to avoid exceeding these limits.

8. Critical Application Cautions and Design Considerations

This section contains vital information for the design engineer to ensure safe and reliable operation of the display. Key cautions include: Intended Use: The display is designed for ordinary electronic equipment. Applications requiring exceptional reliability or where failure could jeopardize safety (aviation, medical, etc.) require prior consultation. Adherence to Ratings: Operation outside the Absolute Maximum Ratings voids responsibility for damage. Thermal and Current Management: Exceeding recommended drive currents or operating temperatures can cause severe light output degradation or premature failure. The safe operating current must be derated for high ambient temperatures. Drive Circuit Design: Constant current driving is strongly recommended for consistent brightness and longevity. The circuit must be designed to accommodate the full range of forward voltage (Vf) specified to ensure the target current is delivered. Furthermore, the circuit should incorporate protection against reverse voltages and voltage transients that may occur during power cycling. Reverse bias operation should be strictly avoided.

9. Application Notes and Design Insights

9.1 Typical Application Scenarios

The LTS-2801AKS is ideally suited for applications requiring a compact, single-digit numeric readout. Common uses include: panel meters for voltage, current, or temperature display; digital clocks and timers; appliance control panels (e.g., microwave ovens, washing machines); test and measurement equipment interfaces; and industrial controller status displays. Its yellow color offers good visibility and is often chosen for cautionary or status indicators.

9.2 Circuit Design Considerations

Designing with this display requires attention to several factors. Due to its common anode configuration, a suitable driver IC (like a 7-segment decoder/driver) or microcontroller GPIO pins configured as current sinks are needed. Current-limiting resistors must be calculated based on the supply voltage, the LED forward voltage (using the maximum Vf for worst-case design), and the desired forward current. For multiplexing multiple digits, the peak current per segment can be higher than the DC rating, but the average current must remain within the continuous forward current limit, considering the duty cycle. Heat dissipation should be considered if operating near maximum ratings or in high ambient temperatures.

9.3 Comparison and Selection Guidance

When selecting a display, compare key parameters: digit height (0.28\" is relatively small), color (yellow AlInGaP vs. red GaAsP or green/blue InGaN), brightness (luminous intensity bin), forward voltage (impacts driver design and power consumption), and viewing angle. The LTS-2801AKS's advantages lie in its efficient AlInGaP technology for yellow light, good brightness, and RoHS compliance. Designers should verify that its optical and electrical characteristics align with the specific requirements of brightness, color, power budget, and available drive voltage in their application.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.