Side View Blue LED 57-11-UB0200H-AM Datasheet - PLCC-2 Package - 3.1V - 20mA - 355mcd - English Technical Document

1. Product Overview

This document details the technical specifications for a high-reliability, side-view blue LED designed primarily for automotive interior lighting applications. The component is housed in a compact PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package, offering a wide 120-degree viewing angle ideal for backlighting and indicator functions where visibility from multiple angles is required. Its key advantages include compliance with the stringent AEC-Q101 automotive qualification standard, ensuring performance and longevity under the harsh environmental conditions typical of vehicle interiors. The LED is also compliant with RoHS and REACH environmental directives. The target market is automotive electronics manufacturers requiring robust, reliable, and compact lighting solutions for dashboard switches, control panels, and other interior illumination needs.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The core performance is defined under a standard test condition of a forward current (I_F) of 20mA. The typical luminous intensity is 355 millicandelas (mcd), with a guaranteed minimum of 224 mcd and a maximum of 560 mcd. The forward voltage (V_F) typically measures 3.10V, ranging from a minimum of 2.75V to a maximum of 3.75V. This V_F range represents the 99% output tolerance band. The dominant wavelength (λ_d) is centered at 468 nm (blue spectrum), with a tight tolerance of ±1 nm, ensuring consistent color output. The viewing angle (φ), defined as the off-axis angle where intensity drops to half its peak value, is 120 degrees with a tolerance of ±5 degrees.

2.2 Absolute Maximum Ratings and Thermal Management

To ensure device integrity, absolute maximum ratings must not be exceeded. The maximum continuous forward current is 30 mA, with a peak surge current (t ≤ 10 μs) capability of 300 mA. The maximum power dissipation is 112 mW. The junction temperature (T_J) must not exceed 125°C, with an operating ambient temperature range of -40°C to +110°C. Two thermal resistance values are provided: the real thermal resistance (R_{thJS real}) from junction to solder point is ≤ 180 K/W, while the electrical method derived value (R_{thJS el}) is ≤ 140 K/W. These values are critical for calculating the junction temperature rise during operation to prevent thermal runaway and ensure luminous output stability.

2.3 Reliability and Environmental Specifications

The device is qualified to the AEC-Q101 standard, confirming its suitability for automotive applications. It features an ESD (Electrostatic Discharge) sensitivity rating of 8 kV (Human Body Model), providing good handling robustness. The moisture sensitivity level (MSL) is rated at Level 2, indicating a floor life of one year when stored at ≤ 30°C/60% relative humidity. The maximum reflow soldering temperature is 260°C for 30 seconds.

3. Performance Curve Analysis

3.1 Forward Current vs. Forward Voltage (IV Curve)

The IV curve shows the exponential relationship typical of LEDs. At 25°C, the forward voltage increases with current. This graph is essential for designing the current-limiting circuitry to ensure the LED operates within its specified voltage and current ranges.

3.2 Relative Luminous Intensity vs. Forward Current

This curve demonstrates that light output is approximately linear with current in the lower to mid-range. It helps designers understand the trade-off between drive current and light output, especially when considering power consumption and thermal management.

3.3 Temperature Dependency Characteristics

Several graphs illustrate performance changes with junction temperature (T_J). The forward voltage has a negative temperature coefficient, decreasing by approximately 2 mV/°C. The luminous intensity also decreases as temperature rises, a critical factor for maintaining consistent brightness in high-temperature automotive environments. The dominant wavelength shifts slightly with temperature, which is important for color-critical applications.

3.4 Forward Current Derating Curve

This is a vital graph for thermal design. It shows the maximum allowable continuous forward current as a function of the solder pad temperature (T_S). For example, at a T_S of 110°C, the maximum I_F is derated to 22 mA. Operation below 5mA is not recommended. This curve must be used to prevent exceeding the maximum junction temperature.

3.5 Spectral Distribution and Radiation Pattern

The relative spectral distribution graph shows a peak in the blue wavelength region (~468 nm). The radiation pattern diagram visually confirms the wide, Lambertian-like 120-degree viewing angle.

4. Binning System Explanation

The LED is available in specific performance bins to allow designers to select parts matching their application requirements for brightness and color.

4.1 Luminous Intensity Binning

A comprehensive binning table lists groups from L1 (11.2-14 mcd) up to GA (18000-22400 mcd). The highlighted bin for this specific part number (57-11-UB0200H-AM) is T1, which corresponds to a luminous intensity range of 280 to 355 mcd. This aligns with the typical value of 355 mcd stated in the characteristics table.

4.2 Dominant Wavelength Binning

The wavelength binning table includes codes for various color ranges. The relevant bin for this blue LED is 7175, covering a dominant wavelength from 471 nm to 475 nm. This encompasses the typical 468 nm value, confirming the part's placement within the blue spectrum bin.

5. Mechanical and Packaging Information

5.1 Mechanical Dimensions

The LED uses a standard PLCC-2 surface-mount package. The datasheet includes a detailed dimensional drawing specifying the package length, width, height, lead spacing, and other critical mechanical tolerances. This information is necessary for PCB footprint design and ensuring proper fit within the assembly.

5.2 Recommended Solder Pad Layout

A diagram provides the optimal PCB land pattern (solder pad geometry) for the PLCC-2 package. Following this recommendation ensures reliable solder joint formation during reflow, proper mechanical strength, and effective heat transfer from the device to the PCB.

5.3 Polarity Identification

The cathode is typically identified by a marking on the package, such as a notch, dot, or cut corner. Correct polarity orientation during assembly is crucial for the device to function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The datasheet specifies a reflow profile with a peak temperature of 260°C for a maximum duration of 30 seconds. Adherence to this profile is mandatory to prevent thermal damage to the LED chip, wire bonds, and plastic package. The profile includes preheat, soak, reflow, and cooling stages with defined ramp rates and time above liquidus.

6.2 Precautions for Use

General handling precautions include avoiding mechanical stress on the lens, preventing electrostatic discharge (ESD) by using grounded equipment, and not exceeding the absolute maximum ratings. The device should not be operated in reverse bias. Proper storage conditions per the MSL-2 rating should be observed.

7. Packaging and Ordering Information

The LEDs are supplied on tape and reel for automated pick-and-place assembly. The datasheet includes packaging specifications such as reel dimensions, tape width, pocket spacing, and orientation. The part number 57-11-UB0200H-AM follows a specific coding system that likely denotes package type (57), color/view (11-UB for side-view blue), and performance bin (0200H).

8. Application Recommendations

8.1 Typical Application Scenarios

The primary application is automotive interior lighting, including backlighting for switches, buttons, instrument clusters, infotainment controls, and ambient lighting. The side-view emission and wide angle make it suitable for applications where the LED is mounted perpendicular to the viewing surface, illuminating a light guide or a small aperture.

8.2 Design Considerations

Current Drive: A constant current driver is recommended over a constant voltage source with a series resistor for more stable light output, especially over temperature. The circuit must limit I_F to ≤ 30 mA continuous.
Thermal Management: The PCB layout should maximize copper area around the solder pads to act as a heat sink, keeping the solder point temperature (T_S) as low as possible to maximize allowable current and luminous output. Use the derating curve for design.
Optical Design: Consider the 120-degree viewing angle when designing light guides or diffusers to ensure even illumination.

9. Technical Comparison and Differentiation

Compared to standard commercial-grade LEDs, this device's key differentiators are its AEC-Q101 qualification for automotive reliability, the wide 120-degree viewing angle in a side-view package, and its specific binning for consistent color and brightness. The 8kV ESD rating and MSL-2 classification further enhance its robustness for industrial and automotive manufacturing processes.

10. Frequently Asked Questions (FAQ)

Q: What is the recommended operating current?
A: The typical operating condition is 20mA, providing 355 mcd. It can be driven up to 30mA maximum, but thermal derating must be applied per the derating curve.
Q: How do I interpret the luminous intensity bin T1?
A: Bin T1 guarantees the luminous intensity will be between 280 mcd and 355 mcd when measured at I_F=20mA and T_J=25°C.
Q: Can this LED be used in non-automotive applications?
A: Yes, its high reliability makes it suitable for industrial controls, consumer electronics, and appliances where long life and stable performance are needed, though it may be cost-optimized for automotive volumes.
Q: Why is there a minimum current specification (5mA)?
A: Operating below this minimum current may lead to unstable or non-uniform light emission from the semiconductor junction.

11. Design and Usage Case Study

Scenario: Backlighting for an Automotive Climate Control Panel. A designer needs to illuminate several membrane switches and a small rotary encoder. Space is extremely limited behind the panel. They choose this side-view blue LED for its compact PLCC-2 package. Multiple LEDs are placed along the edge of a thin acrylic light guide. The 120-degree viewing angle efficiently couples light into the guide. The designer uses a constant-current LED driver IC set to 18mA per LED to ensure longevity and account for potential high ambient temperatures inside the dashboard. The PCB layout includes generous thermal relief pads connected to a ground plane. The AEC-Q101 qualification gives confidence in the product's lifespan over the vehicle's lifetime across varying climatic conditions.

12. Operational Principle

This is a semiconductor light-emitting diode. When a forward voltage exceeding its bandgap energy is applied, electrons and holes recombine in the active region of the semiconductor chip (typically based on InGaN materials for blue light). This recombination process releases energy in the form of photons (light). The specific composition of the semiconductor layers determines the dominant wavelength (color) of the emitted light. The plastic package incorporates a molded lens that shapes the radiation pattern to achieve the specified 120-degree viewing angle.

13. Technology Trends

The trend in automotive and general illumination LEDs is towards higher efficiency (more lumens per watt), which reduces power consumption and thermal load. There is also a drive for higher reliability and longer lifetimes. In packaging, the trend is towards miniaturization while maintaining or improving optical performance and thermal dissipation. For side-view LEDs, advancements include improved light extraction efficiency from the chip and more precise optical control from the package lens to create specific beam patterns for light guide applications. The integration of driver circuitry and multiple LED chips into single modules is also an ongoing development.