3011-UG0201H-AM Side View LED Datasheet - PLCC-2 Package - 3.0V - 20mA - Green - English Technical Document

1. Product Overview

The 3011-UG0201H-AM is a compact, high-brightness side-view LED designed primarily for space-constrained applications requiring illumination from the side of the component. It utilizes a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package, which offers good thermal performance and mechanical stability for automated assembly processes. The device emits a green light with a typical dominant wavelength of 523 nm. A key feature is its wide 120-degree viewing angle, making it suitable for applications where light needs to be dispersed over a broad area rather than focused into a narrow beam. The product is qualified to the stringent AEC-Q101 standard for automotive components, ensuring reliability under harsh environmental conditions. It is also compliant with RoHS and REACH environmental directives and exhibits sulfur robustness, which is critical for longevity in certain automotive and industrial atmospheres.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its compact side-view form factor, high luminous intensity for its size, and automotive-grade reliability. The combination of a wide viewing angle and consistent green output makes it ideal for backlighting and indicator functions where space is at a premium. The target market is overwhelmingly the automotive industry, specifically for interior lighting applications such as backlighting for switches, buttons, instrument clusters, and other control panels. Its robustness also makes it a candidate for industrial control panels and consumer electronics where reliable indicator lighting is required.

2. Technical Parameter Deep-Dive

This section provides an objective and detailed analysis of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Photometric and Electrical Characteristics

The central operating point for this LED is defined at a forward current (I_F) of 20 mA. At this current, the typical luminous intensity is 850 millicandelas (mcd), with a minimum of 710 mcd and a maximum of 1800 mcd. The forward voltage (V_F) at 20 mA is typically 3.0 volts, ranging from a minimum of 2.75V to a maximum of 3.75V. It is crucial for circuit designers to account for this V_F range to ensure proper current regulation across all units. The dominant wavelength is typically 523 nm (green), with a range from 520 nm to 535 nm. The viewing angle, defined as the off-axis angle where intensity drops to half its peak value, is 120 degrees with a tolerance of ±5 degrees.

2.2 Absolute Maximum Ratings and Thermal Management

The device has an absolute maximum forward current rating of 30 mA and a power dissipation limit of 112 mW. Exceeding these limits can cause permanent damage. The junction temperature (T_J) must not exceed 125°C. The thermal resistance from the junction to the solder point is specified in two ways: an electrical method (R_{th JS el}) with a maximum of 160 K/W, and a real method (R_{th JS real}) with a maximum of 200 K/W. This parameter is vital for thermal design; for example, at the full 30 mA and a typical V_F of 3.0V (90 mW power), the junction temperature rise above the solder pad could be up to 18°C (90mW * 200K/W). The operating and storage temperature range is from -40°C to +110°C. The device is ESD sensitive and requires appropriate handling precautions.

3. Binning System Explanation

The datasheet outlines a comprehensive binning structure for luminous intensity and dominant wavelength, which is standard practice for ensuring color and brightness consistency in production.

3.1 Luminous Intensity Bins

Luminous intensity is categorized into bins denoted by a letter-number code (e.g., L1, V2, AA). Each bin defines a specific range of minimum and maximum intensity in millicandelas (mcd). For the 3011-UG0201H-AM, the highlighted possible output bins are V1 (710-900 mcd) and V2 (900-1120 mcd), which align with the typical 850 mcd specification. The binning table extends far beyond these ranges, indicating the same package can be used for LEDs with different chip technologies or performance grades.

3.2 Dominant Wavelength Bins

Similarly, the dominant wavelength is binned. The specific bin for this part is 5963, which corresponds to a wavelength range of 520-535 nm. The tolerance for wavelength measurement is ±1 nm. This binning ensures the emitted green color is consistent from one LED to another within the defined batch.

4. Performance Curve Analysis

The provided graphs offer deep insight into the LED's behavior under varying conditions.

4.1 IV Curve and Relative Intensity

The Forward Current vs. Forward Voltage graph shows a classic exponential diode relationship. The voltage rises sharply at very low currents and then increases more linearly above ~2.8V. The Relative Luminous Intensity vs. Forward Current graph is nearly linear from 0 to 20 mA, showing that light output is directly proportional to current in this region, which is ideal for analog dimming.

4.2 Temperature Dependence

The temperature characteristics are critical for automotive applications. The Relative Forward Voltage vs. Junction Temperature graph shows a negative temperature coefficient; V_F decreases linearly as temperature increases (approximately -2 mV/°C). This can be used for indirect temperature sensing. The Relative Luminous Intensity vs. Junction Temperature graph shows intensity decreasing as temperature rises. At 110°C, the intensity is only about 70% of its value at 25°C. This must be factored into designs to ensure sufficient brightness at high ambient temperatures. The wavelength also shifts with temperature (approx. +0.1 nm/°C).

4.3 Derating and Pulse Handling

The Forward Current Derating Curve dictates the maximum allowable continuous current based on the solder pad temperature. For example, at a pad temperature of 110°C, the maximum current is 20 mA. The Permissible Pulse Handling Capability graph shows the LED can handle much higher pulsed currents (up to 300 mA for very short, low-duty-cycle pulses) without damage, which is useful for strobe or high-visibility signaling applications.

5. Mechanical and Package Information

The LED is housed in a PLCC-2 package. The mechanical drawing would typically show a top-view and side-view with critical dimensions such as overall length, width, height, lead spacing, and the position of the optical lens. The side-view design means the primary light emission is parallel to the PCB surface. The package includes a thermal pad (solder point) which is essential for heat dissipation. Polarity is indicated by the cathode mark, which is a visual identifier on the package body.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The device is rated for reflow soldering with a peak temperature of 260°C for a maximum of 30 seconds. The recommended soldering profile should follow standard IPC/JEDEC guidelines for surface-mount devices, including a preheat ramp, soak, reflow, and cooling phases. The Moisture Sensitivity Level (MSL) is 2, meaning the component must be baked if exposed to ambient air for more than one year before use, to prevent \"popcorning\" during reflow.

6.2 Recommended Solder Pad Design

A recommended land pattern (solder pad footprint) is provided to ensure reliable soldering and proper alignment. This pattern typically includes pads for the two electrical leads and a larger pad for the thermal connection to the PCB. Following this design optimizes solder joint strength, self-alignment during reflow, and thermal performance.

7. Packaging and Ordering Information

The components are supplied on tape and reel for automated pick-and-place assembly. The packaging information specifies the reel dimensions, tape width, pocket spacing, and orientation of the components on the tape. The part number 3011-UG0201H-AM follows a likely internal coding system where \"3011\" may refer to the package size/style, \"UG\" to the color (Ultra Green), and \"0201H\" to specific performance bins or features. Ordering would be based on this full part number.

8. Application Suggestions and Design Considerations

8.1 Typical Application Circuits

In a typical application, the LED is driven by a constant current source or through a current-limiting resistor connected to a voltage supply. The resistor value is calculated as R = (V_supply - V_F) / I_F. Using the maximum V_F (3.75V) for calculation ensures the current does not exceed the desired level even with unit-to-unit variation. For automotive 12V systems, a series resistor is common, but for precision or dimming, a dedicated LED driver IC is recommended.

8.2 Design Considerations

• Thermal Management: Ensure the PCB has adequate copper pour connected to the thermal pad to dissipate heat, especially if operating near maximum ratings or in high ambient temperatures.
• ESD Protection: Implement ESD protection on input lines and follow proper handling procedures during assembly.
• Optical Design: Consider the 120-degree viewing angle when designing light guides or diffusers to achieve uniform illumination.
• Current Derating: Use the derating curve to select an appropriate operating current for the expected maximum ambient temperature.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30 mA continuously?

A: Only if the solder pad temperature is kept at or below 25°C, which is often impractical. Refer to the derating curve; at a more realistic pad temperature of 80°C, the maximum continuous current is approximately 26 mA.

Q: Why is the luminous intensity specified at 20 mA but the max current is 30 mA?

A: 20 mA is the standard test condition that defines the typical performance. The 30 mA rating is the absolute maximum that should not be exceeded. Operating above 20 mA will produce more light but will generate more heat and reduce lifetime.

Q: How do I interpret the two different thermal resistance values?

A: R_{th JS el} (160 K/W) is derived from an electrical measurement method and is often used for theoretical calculations. R_{th JS real} (200 K/W) is considered a more realistic value for practical thermal design. Using the higher value provides a safer design margin.

10. Operating Principle and Technology Trends

10.1 Basic Operating Principle

This LED is a semiconductor device based on a p-n junction. When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The specific material composition of the semiconductor layers determines the wavelength (color) of the emitted light. The PLCC package incorporates a molded epoxy lens that shapes the light output to achieve the specified 120-degree viewing angle.

10.2 Industry Trends

The trend in such indicator and backlight LEDs is towards higher efficiency (more light output per watt), improved color consistency through tighter binning, and enhanced reliability for automotive and industrial use. There is also a drive for miniaturization while maintaining or increasing optical performance. The integration of these components into smarter modules with built-in drivers or control logic is another evolving area.