1. Product Overview
This document details the specifications for a high-performance, Cool White Side View Light Emitting Diode (LED) encapsulated in a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is engineered for reliability and performance in demanding environments, particularly within the automotive sector. Its primary design goal is to provide consistent, bright illumination in space-constrained applications where a wide viewing angle is critical.
The core advantages of this LED include its high typical luminous intensity of 3200 millicandelas (mcd) at a standard drive current of 30mA, combined with a very wide 120-degree viewing angle. This makes it highly effective for backlighting and indicator applications where visibility from multiple angles is required. A key differentiator is its qualification to the AEC-Q102 standard, which is the stress test qualification for discrete optoelectronic semiconductors in automotive applications. This certification involves rigorous testing for thermal shock, humidity resistance, high-temperature operating life, and other conditions, ensuring long-term reliability under the harsh conditions found in vehicles.
The target market is primarily automotive interior lighting, including applications such as backlighting for switches, instrument clusters, infotainment controls, and other interior panels. Its form factor and optical characteristics are also suitable for various consumer and industrial electronics requiring a reliable, side-emitting light source.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Electrical Characteristics
The electrical and optical performance is defined under standard test conditions, typically at a junction temperature (Tj) of 25°C and a forward current (IF) of 30mA.
- Forward Current (IF): The device has a wide operating range from a minimum of 6mA up to an absolute maximum of 60mA. The typical operating point is 30mA, which delivers the specified luminous intensity. Operating below 6mA is not recommended.
- Luminous Intensity (IV): The light output is specified with a minimum of 2240 mcd, a typical value of 3200 mcd, and a maximum of 4500 mcd at IF=30mA. The measurement tolerance for luminous flux is ±11%.
- Forward Voltage (VF): At 30mA, the voltage drop across the LED typically measures 2.9V, with a range from 2.75V (Min) to 3.75V (Max). The forward voltage measurement tolerance is ±0.05V. The specified range represents 99% of production output.
- Viewing Angle (φ): Defined as the off-axis angle where luminous intensity drops to half of its peak value, this LED offers a full viewing angle of 120 degrees, with a tolerance of ±5°.
- Chromaticity Coordinates (CIE x, y): The typical color coordinates for this Cool White LED are (0.29, 0.29). The tolerance for these coordinates is ±0.005, ensuring consistent color output across units.
2.2 Thermal and Reliability Parameters
- Thermal Resistance: Two values are provided. The real thermal resistance from the junction to the solder point (Rth JS real) is a maximum of 180 K/W. The electrical thermal resistance (Rth JS el), derived from electrical measurements, is a maximum of 100 K/W. Proper thermal management is crucial to maintain performance and longevity.
- Junction Temperature (Tj): The maximum allowable junction temperature is 125°C.
- Operating & Storage Temperature: The device is rated for operation and storage within a temperature range of -40°C to +110°C.
- Electrostatic Discharge (ESD) Sensitivity: The Human Body Model (HBM) ESD rating is 8 kV (R=1.5kΩ, C=100pF), providing good handling robustness.
- Sulfur Robustness: The LED meets Class B1 criteria for sulfur resistance, which is important for applications in environments with atmospheric sulfur contamination.
3. Absolute Maximum Ratings
Exceeding these limits may cause permanent damage to the device.
- Power Dissipation (Pd): 225 mW
- Forward Current (IF): 60 mA (Continuous)
- Surge Current (IFM): 250 mA (t ≤ 10 μs, Duty Cycle=0.005, Ts=25°C)
- Reverse Voltage (VR): This device is not designed for reverse operation. Applying a reverse voltage can cause immediate failure.
- Soldering Temperature: The package can withstand a reflow soldering profile with a peak temperature of 260°C for up to 30 seconds.
4. Performance Curve Analysis
The datasheet provides several graphs detailing performance under varying conditions.
4.1 Spectral and Radiation Characteristics
The Relative Spectral Distribution graph shows the emission spectrum of the Cool White LED, which is a broad curve peaking in the blue region and extending through the visible spectrum, typical for a phosphor-converted white LED. The Typical Diagram Characteristics of Radiation illustrates the spatial intensity distribution, confirming the 120° viewing angle pattern.
4.2 Electrical and Optical vs. Current
The Forward Current vs. Forward Voltage (IV Curve) graph shows the exponential relationship, essential for designing current-limiting circuitry. The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output increases sub-linearly with current, emphasizing the importance of stable current drive for consistent brightness.
4.3 Temperature Dependence
The Relative Luminous Intensity vs. Junction Temperature graph shows a negative temperature coefficient; light output decreases as the junction temperature increases. Effective heat sinking is vital to maintain brightness. The Relative Forward Voltage vs. Junction Temperature graph shows a negative temperature coefficient for VF, which can be used for junction temperature monitoring in some applications. The Chromaticity Coordinates Shift vs. Junction Temperature graph indicates minimal color shift with temperature, which is desirable for consistent appearance.
4.4 Derating and Pulsed Operation
The Forward Current Derating Curve is critical for thermal design. It shows the maximum permissible continuous forward current as a function of the solder pad temperature (Ts). For example, at Ts=110°C, the maximum current is derated to 23mA. The Permissible Pulse Handling Capability graph defines the peak pulse current (IFP) allowable for a given pulse width (tp) and duty cycle (D), useful for multiplexing or strobe applications.
5. Binning System Explanation
To manage production variations, LEDs are sorted into bins based on key parameters.
5.1 Luminous Intensity Binning
The datasheet provides an extensive binning table for luminous intensity, ranging from very low output (L1, 11.2-14 mcd) to very high output (GA, 18000-22400 mcd). For this specific part number (57-11-C70300H-AM), the possible output bins are highlighted, corresponding to the min/typ/max values stated in the characteristics table (2240-4500 mcd). This corresponds to bins in the BA to CB range.
5.2 Color Binning
A standard white color bin structure chart and a specific Cool White color bin coordinates table are included. The bins (e.g., FK0, GK0, HK0, IK0, FL0, GL0) define small quadrilaterals on the CIE 1931 chromaticity diagram. The typical coordinates (0.29, 0.29) fall within one of these predefined bins, ensuring the purchased LEDs have a consistent white color point within a specified tolerance.
6. Mechanical, Packaging & Assembly Information
6.1 Mechanical Dimensions
The datasheet includes a detailed mechanical drawing (Section 7) specifying the exact physical dimensions of the PLCC-2 package, including length, width, height, lead spacing, and tolerances. This is essential for PCB footprint design and ensuring proper fit within the assembly.
6.2 Recommended Soldering Pad & Polarity
Section 8 provides a recommended PCB land pattern (solder pad layout) to ensure reliable soldering and proper alignment. The polarity is indicated by the package shape and/or a marking on the component; the cathode is typically identified.
6.3 Reflow Soldering Profile
Section 9 defines the recommended reflow soldering temperature profile. Adherence to this profile (preheat, soak, reflow peak of 260°C max, cooling) is necessary to prevent thermal damage to the LED package and internal die while achieving a reliable solder joint.
6.4 Packaging Information
Details on how the LEDs are supplied are found in Section 10. This typically includes reel packaging specifications (tape width, pocket spacing, reel diameter) compatible with automated pick-and-place assembly equipment.
7. Application Guidelines & Design Considerations
7.1 Typical Application Scenarios
- Automotive Interior Lighting: Backlighting for power window switches, climate control panels, steering wheel controls, and dashboard indicators.
- Consumer Electronics: Side-illumination for buttons on remote controls, gaming peripherals, or audio equipment.
- Industrial Panels: Status indicators on control panels where a wide viewing angle is beneficial.
7.2 Critical Design Considerations
- Current Drive: Always use a constant current driver or a current-limiting resistor in series with a voltage source. Do not connect directly to a voltage source. Operate at or below the recommended 30mA for optimal lifetime.
- Thermal Management: The maximum junction temperature must not be exceeded. Use sufficient copper area on the PCB under and around the LED's thermal pad to act as a heat sink. Refer to the derating curve.
- ESD Precautions: Standard ESD handling procedures should be followed during assembly, as specified in the precautions section (Section 11).
- Sulfur Environment: For applications in environments with high sulfur content (e.g., certain industrial or geographical areas), the Class B1 sulfur robustness rating should be verified as sufficient for the application's lifetime requirements.
8. Compliance and Environmental Standards
This product is compliant with several important industry and environmental standards:
- RoHS (Restriction of Hazardous Substances): Compliant, meaning it contains restricted substances like lead, mercury, and cadmium below defined thresholds.
- REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals): Compliant with the EU REACH regulation.
- Halogen-Free: Compliant with halogen-free requirements (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm).
- AEC-Q102: Qualified, confirming its suitability for automotive applications.
9. Ordering and Part Number Information
The part number for this device is 57-11-C70300H-AM. Section 5 and 6 likely detail the part number structure and ordering information, which may include options for different bins, packaging quantities, or tape and reel specifications. Designers should consult the full datasheet or supplier for available variants.
10. FAQ Based on Technical Parameters
Q: Can I drive this LED at 60mA continuously?
A: While the Absolute Maximum Rating is 60mA, continuous operation at this current will generate significant heat and likely exceed the maximum junction temperature unless exceptional cooling is provided. The recommended operating point is 30mA. Always consult the derating curve based on your application's solder pad temperature.
Q: What is the purpose of the two different Thermal Resistance values (Rth JS real and Rth JS el)?
A> Rth JS real is measured using a physical temperature sensor and represents the actual thermal resistance. Rth JS el is calculated from the change in forward voltage with temperature (a known characteristic of the LED junction itself) and is often easier to measure in practice. For worst-case thermal design, the higher value (180 K/W) should be used.
Q: The viewing angle is 120°. Does this mean light is emitted evenly across this cone?
A: No. The viewing angle is defined where intensity falls to 50% of the peak value. The radiation pattern graph shows the actual distribution, which is typically a Lambertian or side-emission pattern where intensity is highest at the center (0°) and decreases towards the edges.
Q: Is a reverse protection diode necessary?
A: Yes. The datasheet explicitly states the device is "Not designed for reverse operation."> Applying any significant reverse voltage will damage it. If there is any possibility of reverse voltage in the circuit (e.g., from inductive loads, incorrect power connection), an external blocking diode in series or a shunt diode across the LED is mandatory.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |