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Side View LED PLCC-2 Cool White Datasheet - Automotive Grade - 3200mcd @ 30mA - 2.9V - 120° Viewing Angle - English Technical Document

Technical datasheet for a high-brightness, AEC-Q102 qualified, Cool White Side View LED in PLCC-2 package. Features include 3200mcd typical luminous intensity, 120° viewing angle, and compliance with automotive and environmental standards.
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PDF Document Cover - Side View LED PLCC-2 Cool White Datasheet - Automotive Grade - 3200mcd @ 30mA - 2.9V - 120° Viewing Angle - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, Cool White Side View Light Emitting Diode (LED) encapsulated in a PLCC-2 (Plastic Leaded Chip Carrier) package. The device is engineered for reliability and performance in demanding environments, particularly within the automotive sector. Its primary design goal is to provide consistent, bright illumination in space-constrained applications where a wide viewing angle is critical.

The core advantages of this LED include its high typical luminous intensity of 3200 millicandelas (mcd) at a standard drive current of 30mA, combined with a very wide 120-degree viewing angle. This makes it highly effective for backlighting and indicator applications where visibility from multiple angles is required. A key differentiator is its qualification to the AEC-Q102 standard, which is the stress test qualification for discrete optoelectronic semiconductors in automotive applications. This certification involves rigorous testing for thermal shock, humidity resistance, high-temperature operating life, and other conditions, ensuring long-term reliability under the harsh conditions found in vehicles.

The target market is primarily automotive interior lighting, including applications such as backlighting for switches, instrument clusters, infotainment controls, and other interior panels. Its form factor and optical characteristics are also suitable for various consumer and industrial electronics requiring a reliable, side-emitting light source.

2. In-Depth Technical Parameter Analysis

2.1 Photometric and Electrical Characteristics

The electrical and optical performance is defined under standard test conditions, typically at a junction temperature (Tj) of 25°C and a forward current (IF) of 30mA.

2.2 Thermal and Reliability Parameters

3. Absolute Maximum Ratings

Exceeding these limits may cause permanent damage to the device.

4. Performance Curve Analysis

The datasheet provides several graphs detailing performance under varying conditions.

4.1 Spectral and Radiation Characteristics

The Relative Spectral Distribution graph shows the emission spectrum of the Cool White LED, which is a broad curve peaking in the blue region and extending through the visible spectrum, typical for a phosphor-converted white LED. The Typical Diagram Characteristics of Radiation illustrates the spatial intensity distribution, confirming the 120° viewing angle pattern.

4.2 Electrical and Optical vs. Current

The Forward Current vs. Forward Voltage (IV Curve) graph shows the exponential relationship, essential for designing current-limiting circuitry. The Relative Luminous Intensity vs. Forward Current graph demonstrates that light output increases sub-linearly with current, emphasizing the importance of stable current drive for consistent brightness.

4.3 Temperature Dependence

The Relative Luminous Intensity vs. Junction Temperature graph shows a negative temperature coefficient; light output decreases as the junction temperature increases. Effective heat sinking is vital to maintain brightness. The Relative Forward Voltage vs. Junction Temperature graph shows a negative temperature coefficient for VF, which can be used for junction temperature monitoring in some applications. The Chromaticity Coordinates Shift vs. Junction Temperature graph indicates minimal color shift with temperature, which is desirable for consistent appearance.

4.4 Derating and Pulsed Operation

The Forward Current Derating Curve is critical for thermal design. It shows the maximum permissible continuous forward current as a function of the solder pad temperature (Ts). For example, at Ts=110°C, the maximum current is derated to 23mA. The Permissible Pulse Handling Capability graph defines the peak pulse current (IFP) allowable for a given pulse width (tp) and duty cycle (D), useful for multiplexing or strobe applications.

5. Binning System Explanation

To manage production variations, LEDs are sorted into bins based on key parameters.

5.1 Luminous Intensity Binning

The datasheet provides an extensive binning table for luminous intensity, ranging from very low output (L1, 11.2-14 mcd) to very high output (GA, 18000-22400 mcd). For this specific part number (57-11-C70300H-AM), the possible output bins are highlighted, corresponding to the min/typ/max values stated in the characteristics table (2240-4500 mcd). This corresponds to bins in the BA to CB range.

5.2 Color Binning

A standard white color bin structure chart and a specific Cool White color bin coordinates table are included. The bins (e.g., FK0, GK0, HK0, IK0, FL0, GL0) define small quadrilaterals on the CIE 1931 chromaticity diagram. The typical coordinates (0.29, 0.29) fall within one of these predefined bins, ensuring the purchased LEDs have a consistent white color point within a specified tolerance.

6. Mechanical, Packaging & Assembly Information

6.1 Mechanical Dimensions

The datasheet includes a detailed mechanical drawing (Section 7) specifying the exact physical dimensions of the PLCC-2 package, including length, width, height, lead spacing, and tolerances. This is essential for PCB footprint design and ensuring proper fit within the assembly.

6.2 Recommended Soldering Pad & Polarity

Section 8 provides a recommended PCB land pattern (solder pad layout) to ensure reliable soldering and proper alignment. The polarity is indicated by the package shape and/or a marking on the component; the cathode is typically identified.

6.3 Reflow Soldering Profile

Section 9 defines the recommended reflow soldering temperature profile. Adherence to this profile (preheat, soak, reflow peak of 260°C max, cooling) is necessary to prevent thermal damage to the LED package and internal die while achieving a reliable solder joint.

6.4 Packaging Information

Details on how the LEDs are supplied are found in Section 10. This typically includes reel packaging specifications (tape width, pocket spacing, reel diameter) compatible with automated pick-and-place assembly equipment.

7. Application Guidelines & Design Considerations

7.1 Typical Application Scenarios

7.2 Critical Design Considerations

8. Compliance and Environmental Standards

This product is compliant with several important industry and environmental standards:

9. Ordering and Part Number Information

The part number for this device is 57-11-C70300H-AM. Section 5 and 6 likely detail the part number structure and ordering information, which may include options for different bins, packaging quantities, or tape and reel specifications. Designers should consult the full datasheet or supplier for available variants.

10. FAQ Based on Technical Parameters

Q: Can I drive this LED at 60mA continuously?
A: While the Absolute Maximum Rating is 60mA, continuous operation at this current will generate significant heat and likely exceed the maximum junction temperature unless exceptional cooling is provided. The recommended operating point is 30mA. Always consult the derating curve based on your application's solder pad temperature.

Q: What is the purpose of the two different Thermal Resistance values (Rth JS real and Rth JS el)?
A> Rth JS real is measured using a physical temperature sensor and represents the actual thermal resistance. Rth JS el is calculated from the change in forward voltage with temperature (a known characteristic of the LED junction itself) and is often easier to measure in practice. For worst-case thermal design, the higher value (180 K/W) should be used.

Q: The viewing angle is 120°. Does this mean light is emitted evenly across this cone?
A: No. The viewing angle is defined where intensity falls to 50% of the peak value. The radiation pattern graph shows the actual distribution, which is typically a Lambertian or side-emission pattern where intensity is highest at the center (0°) and decreases towards the edges.

Q: Is a reverse protection diode necessary?
A: Yes. The datasheet explicitly states the device is "Not designed for reverse operation."> Applying any significant reverse voltage will damage it. If there is any possibility of reverse voltage in the circuit (e.g., from inductive loads, incorrect power connection), an external blocking diode in series or a shunt diode across the LED is mandatory.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.