Table of Contents
- 1. Product Overview
- 2. In-Depth Technical Parameter Analysis
- 2.1 Photometric and Electrical Characteristics
- 2.2 Absolute Maximum Ratings and Thermal Management
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (IV Curve)
- 4.2 Relative Luminous Intensity vs. Forward Current
- 4.3 Temperature Dependence Characteristics
- 4.4 Forward Current Derating Curve
- 4.5 Permissible Pulse Handling Capability
- 4.6 Spectral and Radiation Distribution
- 5. Mechanical, Assembly, and Packaging Information
- 5.1 Mechanical Dimensions and Polarity
- 5.2 Recommended Solder Pad Design
- 5.3 Reflow Soldering Profile
- 5.4 Packaging Information
- 6. Application Guidelines and Design Considerations
- 6.1 Typical Application Scenarios
- 6.2 Critical Design Considerations
- 7. Precautions for Use
- 8. Ordering Information
- 9. FAQ Based on Technical Parameters
1. Product Overview
This document details the specifications for a high-performance, side-view emitting red LED designed primarily for automotive interior applications. The device is housed in a compact PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package, offering a balance of high luminous output and a wide viewing angle suitable for backlighting and indicator functions.
The core advantage of this component lies in its automotive-grade reliability, having qualified to the AEC-Q101 standard, which ensures performance under the stringent temperature, humidity, and vibration conditions typical in vehicle environments. Its compliance with RoHS and REACH directives makes it suitable for global markets with strict environmental regulations.
The target market is automotive electronics, with specific applications including dashboard backlighting, switch illumination, and other interior status indicators where consistent, bright, and reliable red light output is required.
2. In-Depth Technical Parameter Analysis
2.1 Photometric and Electrical Characteristics
The key operational parameters define the LED's performance under standard test conditions (Ts=25°C). The typical forward voltage (VF) is 2.00V at a forward current (IF) of 20mA, with a specified range from 1.75V to 2.75V. This relatively low voltage is compatible with common automotive power rails.
The primary photometric parameter is the luminous intensity (IV), which has a typical value of 1120 millicandelas (mcd) at 20mA. The minimum and maximum limits for this batch are 710 mcd and 1400 mcd, respectively. This high brightness is achieved while maintaining a very wide viewing angle (φ) of 120 degrees, defined as the off-axis angle where the luminous intensity drops to half of its peak value. This wide angle ensures uniform illumination over a broad area, which is critical for panel backlighting.
The dominant wavelength (λd) is centered at 622 nm (typical), defining the shade of red light emitted, with a range from 618 nm to 627 nm. The device is not designed for reverse voltage operation.
2.2 Absolute Maximum Ratings and Thermal Management
These ratings define the limits beyond which permanent damage may occur. The absolute maximum continuous forward current is 50 mA, and the maximum power dissipation is 137 mW. For short pulses (t ≤ 10 μs, duty cycle D=0.005), a surge current (IFM) of 100 mA is permissible.
Thermal management is crucial for LED longevity and performance stability. The thermal resistance from the LED junction to the solder point (RthJS) is specified with two values: 160 K/W (real, based on thermal measurement) and 120 K/W (electrical, derived from electrical parameters). This parameter indicates how effectively heat is transferred away from the semiconductor junction. The maximum allowable junction temperature (TJ) is 125°C. The operating and storage temperature range is from -40°C to +110°C, confirming its suitability for harsh automotive environments.
The device has an ESD (Electrostatic Discharge) sensitivity rating of 2 kV (Human Body Model), which is a standard level for many electronic components but requires standard ESD handling precautions during assembly.
3. Binning System Explanation
To manage production variations, LEDs are sorted into bins based on key performance parameters. This datasheet provides detailed binning information for luminous intensity and dominant wavelength.
3.1 Luminous Intensity Binning
The luminous intensity is binned using an alphanumeric code (e.g., L1, M2, V1, AA). Each bin covers a specific range of minimum and maximum luminous intensity values measured in millicandelas (mcd). The bins follow a logarithmic progression, with each step approximately corresponding to a 25% increase. For this specific part number (57-21-UR0200H-AM), the possible output bins are highlighted, with the typical value of 1120 mcd falling into the "AA" bin (1120-1400 mcd). This system allows designers to select components with consistent brightness for their application.
3.2 Dominant Wavelength Binning
Similarly, the dominant wavelength, which determines the precise color of the red light, is also binned. The bins are defined by numerical codes representing the wavelength range in nanometers (nm). The typical value of 622 nm for this LED would fall within a specific wavelength bin, ensuring color consistency across multiple units in a production run. The tolerance for dominant wavelength measurement is ±1 nm.
4. Performance Curve Analysis
The datasheet includes several graphs that illustrate the LED's behavior under varying conditions, which are essential for circuit design and thermal management.
4.1 Forward Current vs. Forward Voltage (IV Curve)
This graph shows the exponential relationship between forward current (IF) and forward voltage (VF). It is crucial for designing the current-limiting circuitry. The curve demonstrates that a small increase in voltage beyond the typical 2.0V can lead to a significant and potentially damaging increase in current, highlighting the need for constant-current drivers rather than constant-voltage supplies.
4.2 Relative Luminous Intensity vs. Forward Current
This plot shows how light output scales with drive current. While output increases with current, it is not perfectly linear, especially at higher currents where efficiency may drop due to increased heat generation.
4.3 Temperature Dependence Characteristics
Several graphs detail the impact of junction temperature (TJ):
- Relative Luminous Intensity vs. Junction Temperature: Shows that light output decreases as temperature increases. This derating must be accounted for in designs where the LED may operate at elevated ambient temperatures.
- Relative Forward Voltage vs. Junction Temperature: Demonstrates that VF has a negative temperature coefficient, decreasing by approximately 2 mV/°C. This can affect the performance of simple resistor-based current limiters.
- Relative Wavelength vs. Junction Temperature: Indicates that the dominant wavelength shifts slightly (typically increasing) with temperature, which can cause a minor color shift in the application.
4.4 Forward Current Derating Curve
This is one of the most critical graphs for reliable design. It plots the maximum allowable continuous forward current against the solder pad temperature. As the temperature at the solder point increases, the maximum safe current decreases linearly. For example, at the maximum solder pad temperature of 110°C, the maximum allowable continuous current is only 34 mA, significantly lower than the absolute maximum of 50 mA at 25°C. Designers must ensure the thermal design keeps the solder point cool enough to allow the desired drive current.
4.5 Permissible Pulse Handling Capability
This graph defines the relationship between pulse width (tp) and permissible surge forward current (IF) for various duty cycles (D). It allows designers to understand the limits for pulsed operation, such as in multiplexed lighting systems or for creating blinking effects, ensuring the LED is not subjected to current pulses that could cause degradation.
4.6 Spectral and Radiation Distribution
The relative spectral distribution graph shows the light output across the visible spectrum, peaking in the red region around 622 nm. The radiation pattern diagram (polar plot) visually confirms the 120-degree viewing angle, showing how intensity distributes spatially.
5. Mechanical, Assembly, and Packaging Information
5.1 Mechanical Dimensions and Polarity
The component uses a standard PLCC-2 surface-mount package. The mechanical drawing provides precise dimensions for the package body, lead spacing, and overall height. The polarity is clearly indicated, typically by a notch or a marker on the package and/or in the footprint diagram. Correct orientation is essential for proper operation.
5.2 Recommended Solder Pad Design
A land pattern (footprint) recommendation is provided for PCB design. This includes the dimensions and spacing for the copper pads to which the LED's leads will be soldered. Following this recommendation ensures good solder joint formation, proper alignment, and optimal thermal transfer from the device to the PCB.
5.3 Reflow Soldering Profile
The datasheet specifies a reflow soldering profile compatible with lead-free (Pb-free) solder processes. The peak temperature should not exceed 260°C, and the time above 240°C should be limited to 30 seconds maximum. Adhering to this profile is critical to prevent thermal damage to the LED's plastic package and internal wire bonds during the surface-mount assembly process.
5.4 Packaging Information
The LEDs are supplied on tape-and-reel packaging suitable for automated pick-and-place machines. The specifications include reel dimensions, tape width, pocket spacing, and orientation of components on the tape. This information is necessary for setting up assembly line equipment.
6. Application Guidelines and Design Considerations
6.1 Typical Application Scenarios
The primary application is automotive interior lighting. This includes:
- Instrument Cluster and Dashboard Backlighting: Illuminating gauges, LCD displays, and warning symbols.
- Switch and Control Illumination: Backlighting buttons for climate control, audio systems, window switches, and gear selectors.
- General Status Indicators: Power-on lights, door ajar warnings, or other functional indicators.
6.2 Critical Design Considerations
1. Drive Circuitry: Always use a constant-current driver or a current-limiting resistor in series with the LED. The value of the resistor (R) can be calculated using Ohm's Law: R = (Vsupply - VF) / IF. Ensure the resistor's power rating is sufficient (P = IF2 * R).
2. Thermal Management: This is paramount for reliability and maintaining light output. Use the derating curve to determine the maximum drive current for your expected operating temperature. Ensure adequate copper area (thermal relief) on the PCB connected to the solder pads to dissipate heat. In high-ambient-temperature environments (like near a car's engine bay electronics), additional cooling measures may be necessary.
3. ESD Protection: Implement standard ESD handling procedures during assembly. For sensitive applications, consider adding transient voltage suppression (TVS) diodes or other protection circuits on the input power lines.
4. Optical Design: The 120-degree viewing angle may require diffusers or light guides to achieve the desired uniformity and appearance in the final product. The side-view form factor is specifically chosen to couple efficiently into such optical elements.
7. Precautions for Use
The datasheet includes a standard precautions section. Key points include:
- Avoid applying reverse voltage.
- Do not exceed the absolute maximum ratings for current, power, and temperature.
- Follow the recommended reflow soldering profile to prevent package damage.
- Store in appropriate conditions to avoid moisture absorption (MSL 2 rating indicates a floor life of 1 year after the dry pack is opened, under ≤30°C/60% RH conditions).
- Clean using methods compatible with the package material (avoid ultrasonic cleaning with certain frequencies).
8. Ordering Information
The part number 57-21-UR0200H-AM follows a specific coding system. While the full breakdown may be proprietary, it typically encodes information such as package type (57-21 likely indicates PLCC-2), color (UR for red), brightness bin, and possibly other attributes. For specific bin selection or packaging options (e.g., tape-and-reel size), the ordering information section would provide the exact codes to use.
9. FAQ Based on Technical Parameters
Q: Can I drive this LED directly from a 5V or 12V automotive rail?
A: No. You must always use a series current-limiting resistor or a constant-current driver. Connecting it directly to a voltage source higher than its forward voltage will cause excessive current flow, potentially destroying the LED instantly.
Q: The datasheet shows a typical intensity of 1120mcd. Why might my measured value be different?
A: Several factors affect measured intensity: the drive current (must be exactly 20mA), the temperature of the LED during measurement, the measurement equipment's calibration, and the inherent binning variation (your sample could be from the lower or upper end of the AA bin).
Q: Is this LED suitable for exterior automotive applications like tail lights?
A: While it is AEC-Q101 qualified, its primary application is listed as interior lighting. Exterior lights often have different requirements for higher brightness, different color coordinates, and more stringent protection against weather and UV exposure. A dedicated exterior-grade LED would be more appropriate.
Q: What does MSL 2 mean for storage?
A: Moisture Sensitivity Level 2 means the package can be exposed to factory floor conditions (≤30°C/60% RH) for up to 1 year before it requires baking prior to reflow soldering. Components on tape-and-reel are shipped in a dry bag with a humidity indicator card.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |