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PD70-01B/TR10 Silicon Planar PIN Photodiode Datasheet - 2.0x1.25x0.7mm - Reverse Voltage 32V - Peak Sensitivity 940nm - English Technical Document

Complete technical datasheet for the PD70-01B/TR10 silicon planar PIN photodiode. Features include high sensitivity, low capacitance, fast switching, and a compact black package. Includes specifications, ratings, characteristics, and application guidelines.
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PDF Document Cover - PD70-01B/TR10 Silicon Planar PIN Photodiode Datasheet - 2.0x1.25x0.7mm - Reverse Voltage 32V - Peak Sensitivity 940nm - English Technical Document

1. Product Overview

The PD70-01B/TR10 is a silicon planar PIN photodiode designed for high-sensitivity light detection across a broad spectral range. Its core advantages stem from the PIN structure, which incorporates an intrinsic (I) region between the P-type and N-type semiconductor layers. This intrinsic region widens the depletion layer, resulting in several key performance benefits critical for optoelectronic applications.

Core Advantages & Target Market: The device offers high sensitivity and fast switching times due to the reduced junction capacitance and efficient carrier collection in the PIN structure. The low dark current ensures good signal-to-noise ratio. Combined with its compact size and integrated daylight filter (black lens), it is ideally suited for diverse applications including consumer electronics remote controls (TV, appliances), infrared sound transmission systems, copiers, elevator sensors, and various industrial measurement and control systems requiring reliable optical sensing.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage may occur. Operating the device continuously at these limits is not recommended.

2.2 Electro-Optical Characteristics (Ta=25°C)

These parameters define the device's performance under typical operating conditions.

3. Performance Curve Analysis

The datasheet includes typical characteristic curves which are crucial for design.

4. Mechanical and Package Information

4.1 Package Dimensions

The PD70-01B/TR10 comes in a very small surface-mount package. Key dimensions (in mm) include a body size of approximately 2.0 x 1.25, with a height of 0.7 mm. The cathode is typically identified by a marked corner or a notch on the package. Detailed dimensional drawings with tolerances of ±0.1mm are provided for PCB footprint design.

4.2 Polarity Identification

Clear polarity marking is essential for correct installation. The datasheet package diagram indicates the anode and cathode terminals. Incorrect polarity connection when applying reverse bias will forward-bias the diode, potentially causing high current flow and damage.

5. Soldering and Assembly Guidelines

Proper handling is critical for reliability.

5.1 Storage and Moisture Sensitivity

The device is moisture sensitive. Precautions include: storing in the original sealed bag at ≤30°C/90%RH; using within 1 year of shipment; after opening, storing at ≤30°C/70%RH and using within 168 hours (7 days). If exceeded, a baking treatment at 60±5°C for 24 hours is required before soldering.

5.2 Soldering Conditions

6. Packaging and Ordering Information

The standard packaging is a reel format containing 1000 pieces (1000PCS/Reel). The reel dimensions are specified for automated pick-and-place equipment handling. The label on the reel includes critical information such as Part Number (P/N), Lot Number (LOT No), quantity (QTY), and other traceability codes.

7. Application Notes and Design Considerations

7.1 Typical Application Circuits

The photodiode can be used in two primary modes:

  1. Photovoltaic Mode (Zero Bias): The photodiode generates a voltage/current when illuminated, with no external bias applied. This mode offers very low dark current and noise but has slower response speed and lower linearity.
  2. Photoconductive Mode (Reverse Bias): An external reverse voltage is applied (e.g., 5V as in the IL test condition). This mode widens the depletion region further, reducing junction capacitance and resulting in much faster switching times and higher linearity over a wider light intensity range. This is the preferred mode for high-speed detection like IR remote control receivers.

7.2 Critical Design Precautions

8. Technical Comparison and Differentiation

The PD70-01B/TR10 differentiates itself through its combination of features in a compact SMD package:

9. Frequently Asked Questions (FAQs)

Q: What is the purpose of the "daylight filter"?
A: The black lens material attenuates light in the visible spectrum (roughly 400-700 nm) while allowing near-infrared light (700-1100 nm) to pass through. This reduces the interference from ambient indoor lighting (fluorescent, LED, incandescent) which contains visible light, improving the signal-to-noise ratio for IR-based systems.

Q: Should I use this in photovoltaic or photoconductive mode for an IR remote receiver?
A> For IR remote control applications which require fast pulse detection (typically 38-56 kHz carrier), the photoconductive mode (reverse biased) is mandatory. The reduced capacitance in this mode enables the device to respond to the high-frequency modulation.

Q: How do I calculate the value of the required series resistor?
A: The resistor limits the maximum current. If applying a reverse bias VR, and the maximum expected photocurrent is Imax, a simple series resistor R can be placed. The voltage drop across it should not significantly reduce the bias on the diode. For example, with VR = 5V and Imax ~ 50μA, a resistor of 10kΩ would drop only 0.5V, leaving 4.5V across the diode. The resistor also helps protect against accidental forward bias.

10. Operational Principle

A PIN photodiode operates on the principle of the internal photoelectric effect. Photons with energy greater than the semiconductor's bandgap are absorbed in the intrinsic region, creating electron-hole pairs. The strong electric field present in the reverse-biased depletion region (which is enlarged by the intrinsic layer) swiftly separates these carriers, causing them to drift to the respective terminals. This movement of charge constitutes a photocurrent that is proportional to the incident light intensity. The wide intrinsic region is key: it increases the volume for photon absorption (improving sensitivity) and reduces the junction capacitance (enabling faster speed).

11. Industry Trends

The demand for compact, high-speed, and sensitive photodetectors continues to grow. Trends influencing devices like the PD70-01B/TR10 include:

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.