1. Product Overview
This document details the specifications for a high-brightness, Sky Blue LED in a PLCC-2 (Plastic Leaded Chip Carrier) surface-mount package. The device is engineered for reliability and performance in demanding environments, featuring a wide 120-degree viewing angle and a typical luminous intensity of 200 millicandelas (mcd) at a standard drive current of 10mA. Its primary design target is automotive interior applications, where consistent color output, durability, and compliance with industry standards are paramount. The LED is qualified to the AEC-Q101 standard for automotive-grade components and complies with RoHS and REACH environmental directives.
1.1 Core Advantages
- High Reliability: Qualified to AEC-Q101 for automotive use, ensuring performance under harsh temperature and vibration conditions.
- Consistent Color: Tightly controlled chromaticity coordinates (0.16, 0.08) for uniform sky blue appearance across production batches.
- Wide Viewing Angle: 120-degree emission pattern ideal for area illumination and indicator applications where visibility from multiple angles is required.
- Robust ESD Protection: 8kV Human Body Model (HBM) ESD rating enhances handling and assembly robustness.
- Environmental Compliance: Meets RoHS and REACH requirements, free from hazardous substances.
2. In-Depth Technical Parameter Analysis
The following section provides a detailed breakdown of the LED's key electrical, optical, and thermal characteristics.
2.1 Photometric and Electrical Characteristics
The table below lists the guaranteed minimum, typical, and maximum values for critical parameters measured under standard test conditions (Ts=25°C, IF=10mA unless noted).
- Forward Current (IF): The recommended operating current is 10mA, with an absolute maximum rating of 20mA. A minimum current of 2mA is required for operation.
- Luminous Intensity (IV): The typical output is 200 mcd, with a specified range from 112 mcd (Min) to 450 mcd (Max). Actual output is binned, as detailed in Section 4.
- Forward Voltage (VF): Typically 3.1V, ranging from 2.75V to 3.75V at 10mA. This parameter has a measurement tolerance of ±0.05V.
- Viewing Angle (2φ1/2): Defined as the full angle where intensity drops to half its peak value. This LED has a nominal 120-degree viewing angle with a tolerance of ±5 degrees.
- Chromaticity Coordinates (CIE x, y): The typical color point is x=0.16, y=0.08, with a tight tolerance of ±0.005 to ensure color consistency.
2.2 Thermal Characteristics
Effective thermal management is crucial for LED longevity and performance stability.
- Thermal Resistance (RthJS): Two values are provided: an electrical measurement of 100 K/W and a real (measured) value of 130 K/W. The higher real value should be used for accurate thermal design.
- Power Dissipation (Pd): The maximum allowable power dissipation is 75 mW.
- Junction Temperature (TJ): The maximum permissible junction temperature is 125°C.
- Operating Temperature Range (Topr): The LED is rated for operation from -40°C to +110°C, suitable for automotive environments.
3. Absolute Maximum Ratings
Stresses beyond these limits may cause permanent damage. The device is not designed for reverse voltage operation.
- Forward Current (IF): 20 mA (DC)
- Surge Current (IFM): 300 mA (tp ≤ 10μs, Duty Cycle 0.005)
- Reverse Voltage (VR): Not designed for reverse operation
- Junction Temperature (TJ): 125°C
- Storage Temperature (Tstg): -40°C to +110°C
- ESD Sensitivity (HBM): 8 kV
- Reflow Soldering Temperature: 260°C peak for 30 seconds maximum
4. Performance Curve Analysis
The datasheet includes several graphs illustrating the LED's behavior under varying conditions.
4.1 Spectral and Radiation Distribution
The Relative Spectral Distribution graph shows the LED emits in the blue wavelength region, centered around approximately 470-490nm, defining its sky blue color. The Typical Diagram of Radiation Characteristics visually confirms the Lambertian-like emission pattern that results in the 120-degree viewing angle.
4.2 Forward Current vs. Forward Voltage (I-V Curve)
This graph shows the exponential relationship typical of diodes. The forward voltage increases with current. Designers use this to calculate series resistor values or driver requirements to achieve the desired operating point (e.g., 10mA at ~3.1V).
4.3 Relative Luminous Intensity vs. Forward Current
Light output is nearly linear with current in the 0-20mA range. Driving the LED above 10mA yields proportionally higher brightness but increases power dissipation and junction temperature, which must be managed.
4.4 Temperature Dependence
Two key graphs illustrate temperature effects:
- Relative Luminous Intensity vs. Junction Temperature: Light output decreases as temperature rises. At the maximum junction temperature of 125°C, output is approximately 40-50% of its value at 25°C.
- Relative Forward Voltage vs. Junction Temperature: The forward voltage has a negative temperature coefficient, decreasing by about 2mV/°C. This can be used for junction temperature monitoring in some applications.
- Chromaticity Shift vs. Junction Temperature: The color coordinates (x, y) shift slightly with temperature, but the change is minimal within the operating range, as shown by the small Δ values on the graph.
4.5 Derating and Pulse Handling
The Forward Current Derating Curve mandates reducing the maximum allowable continuous forward current as the solder pad temperature increases. At the maximum ambient/solder point temperature of 110°C, the current must be limited to 20mA. The Permissible Pulse Handling Capability graph shows that much higher peak currents (up to 300mA) can be applied for very short pulse widths (≤10μs) at low duty cycles, useful for multiplexing or strobe applications.
5. Binning System Explanation
To manage production variations, LEDs are sorted into bins based on luminous intensity.
5.1 Luminous Intensity Binning
The device uses an alphanumeric binning code (e.g., R1, R2, S1). Each bin covers a specific range of minimum to maximum luminous intensity measured in millicandelas (mcd). For this product, the possible output bins are highlighted and range from R1 (112-140 mcd) up to T2 (355-450 mcd). The typical value of 200 mcd falls within the S1 (180-224 mcd) or S2 (224-280 mcd) bins. Designers should specify the required bin or be prepared for intensity variation within the highlighted range.
5.2 Color Binning
A standard sky blue color bin structure is referenced, ensuring all units fall within the specified CIE (0.16, 0.08) ±0.005 tolerance box on the chromaticity chart. This tight control is essential for applications requiring color matching across multiple LEDs.
6. Mechanical and Package Information
6.1 Package Dimensions
The LED is housed in a standard PLCC-2 surface-mount package. Key dimensions include a body size of approximately 3.2mm x 2.8mm and a height of 1.9mm. Detailed mechanical drawings should be consulted for exact tolerances and land pattern design.
6.2 Polarity Identification
The PLCC-2 package has a built-in polarity indicator, typically a notch or a chamfered corner on the cathode (-) side. Correct orientation is critical during assembly.
6.3 Recommended Solder Pad Layout
A land pattern recommendation is provided to ensure reliable soldering and proper mechanical stability. Following this footprint is essential for achieving good solder joint formation during reflow and preventing tombstoning.
7. Soldering and Assembly Guidelines
7.1 Reflow Soldering Profile
The LED is compatible with standard infrared or convection reflow processes. The specified profile includes a peak temperature of 260°C for a maximum of 30 seconds. The time above 220°C should be controlled. Adherence to this profile prevents thermal damage to the plastic package and the semiconductor die.
7.2 Precautions for Use
- ESD Handling: Use standard ESD precautions during handling and assembly due to the 8kV HBM rating.
- Cleaning: If cleaning is required after soldering, use compatible solvents that do not damage the plastic lens.
- Current Limiting: Always operate the LED with a series resistor or constant current driver to prevent exceeding the maximum forward current, especially considering the negative temperature coefficient of VF.
8. Packaging and Ordering Information
The LEDs are supplied on tape and reel for automated assembly. Standard reel quantities are used (e.g., 2000 or 4000 pieces per reel). The part number 67-11-SB0100L-AM encodes key attributes: likely package (67), color (SB for Sky Blue), and specific performance bin. Designers must refer to the detailed ordering information to select the correct luminous intensity bin for their application.
9. Application Suggestions
9.1 Typical Application Scenarios
- Automotive Interior Lighting: Dashboard backlighting, switch illumination, footwell lights, and ambient lighting. The AEC-Q101 qualification and wide temperature range make it ideal.
- Consumer Electronics: Status indicators, backlighting for buttons or panels in devices requiring a blue indicator.
- Industrial Indicators: Panel lights or status indicators on machinery where a clear, bright signal is needed.
9.2 Design Considerations
- Thermal Management: Use the real thermal resistance (130 K/W) for calculations. Ensure the PCB provides adequate heat sinking, especially if driving at currents above 10mA or in high ambient temperatures. The derating curve must be followed.
- Current Drive: For stable light output and long life, use a constant current driver rather than a simple resistor when possible, particularly in automotive environments where supply voltage can vary.
- Optical Design: The 120-degree viewing angle is very wide. For focused illumination, an external secondary optic (lens) may be required.
- Bin Selection: For applications requiring uniform brightness across multiple LEDs, specify a tight luminous intensity bin or implement electronic brightness calibration.
10. Technical Comparison and Differentiation
Compared to generic blue LEDs, this device offers distinct advantages for professional applications:
- vs. Non-Automotive LEDs: The AEC-Q101 qualification involves rigorous stress testing for thermal shock, humidity, and longevity that standard commercial LEDs do not undergo.
- vs. Wider Viewing Angle LEDs: A 120-degree angle offers excellent off-axis visibility compared to narrower-angle devices, reducing the number of LEDs needed for area lighting.
- vs. Loose Color Tolerance LEDs: The tight ±0.005 CIE tolerance ensures color consistency, which is critical in multi-LED arrays where color mismatch is visually apparent.
11. Frequently Asked Questions (Based on Technical Parameters)
Q: Can I drive this LED at 20mA continuously?
A: Yes, but only if the solder pad temperature is kept at or below 25°C (per the derating curve). In a real application with higher ambient temperature, you must reduce the current. At the max operating temperature of 110°C, the current must not exceed 20mA, which is the absolute maximum rating.
Q: What resistor value should I use for a 12V supply?
A: For a typical VF of 3.1V at 10mA: R = (12V - 3.1V) / 0.01A = 890 ohms. Use the nearest standard value (e.g., 910 ohms) and ensure the resistor power rating is sufficient: P = (12V-3.1V)*0.01A ≈ 0.089W (a 1/8W or 1/4W resistor is suitable).
Q: How does temperature affect brightness?
A: Brightness decreases with increasing junction temperature. Refer to the \"Relative Luminous Intensity vs. Junction Temperature\" graph. Good thermal design is essential to maintain stable light output.
Q: Is this LED suitable for exterior automotive use?
A: This datasheet specifies applications for \"Automotive interior lighting.\" Exterior use typically requires higher ingress protection (IP) ratings, different color specifications, and often different package constructions to withstand weather, UV exposure, and more extreme temperatures. Consult specific exterior-grade LED products.
12. Practical Design Case Study
Scenario: Designing an illuminated automotive gear selector panel with 5 identical sky blue LEDs.
Design Steps:
1. Electrical Design: Assuming a stable 5V rail from the vehicle body control module. Target IF = 10mA for balance of brightness and longevity. Calculate series resistor: R = (5V - 3.1V) / 0.01A = 190Ω. Use 200Ω standard resistors.
2. Thermal Analysis: Power per LED: Pd = VF * IF = 3.1V * 0.01A = 31mW. With RthJS=130 K/W, ΔTJ = 0.031W * 130 K/W ≈ 4°C rise above the solder point. If the panel's PCB temperature reaches 85°C max, TJ ≈ 89°C, well below the 125°C limit.
3. Optical/Mechanical: Place LEDs behind a diffused acrylic panel. The 120-degree viewing angle ensures even illumination across the panel surface without dark spots.
4. Procurement: Specify the required luminous intensity bin (e.g., S1 or S2) to ensure all 5 LEDs have matched brightness. Order on tape and reel for automated assembly.
13. Operating Principle Introduction
This is a semiconductor light-emitting diode (LED). When a forward voltage exceeding its bandgap voltage (approximately 3.1V for this blue LED) is applied, electrons and holes recombine in the active region of the semiconductor chip (typically based on InGaN materials for blue emission). This recombination releases energy in the form of photons (light). The specific composition of the semiconductor layers determines the wavelength (color) of the emitted light. The plastic PLCC package encapsulates the chip, provides mechanical protection, incorporates a molded lens that shapes the light output into a 120-degree pattern, and houses the leadframe for electrical connection.
14. Technology Trends
The development of LEDs like this one is part of broader trends in optoelectronics:
- Increased Efficiency: Ongoing materials science research aims to improve the luminous efficacy (lumens per watt) of blue and other color LEDs, reducing power consumption for the same light output.
- Miniaturization: While PLCC-2 is a standard package, there is a trend towards smaller chip-scale packages (CSP) for high-density applications, though often at the expense of thermal performance and ease of handling.
- Enhanced Reliability: Standards like AEC-Q101 continue to evolve, pushing for longer lifetimes and performance under even more extreme conditions for automotive and industrial markets.
- Integrated Solutions: A growing trend is the integration of the LED chip, driver IC, and control logic into single, smart modular packages, simplifying design for end-users.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |