SMD LED 16-213/BHC-AN1P2/3T Blue Datasheet - Blue Color - 5mA Forward Current - English Technical Document

1. Product Overview

The 16-213/BHC-AN1P2/3T is a surface-mount device (SMD) light-emitting diode (LED) designed for modern electronic applications requiring compact, efficient, and reliable indicator or backlighting solutions. This component utilizes InGaN (Indium Gallium Nitride) semiconductor technology to produce blue light with a typical dominant wavelength of 468 nm. Its primary design philosophy centers on miniaturization and compatibility with automated high-volume manufacturing processes.

The core advantages of this LED stem from its SMD package. Compared to traditional leaded components, it enables significant reductions in printed circuit board (PCB) size and allows for higher component packing density. This directly contributes to smaller end-product form factors. Furthermore, the lightweight nature of the package makes it ideal for portable and miniature applications where weight is a critical factor.

The target market for this LED is broad, encompassing consumer electronics, industrial controls, and telecommunications. Its typical applications include backlighting for instrument panels, switches, and keypads, as well as status indicators in devices like telephones and fax machines. It is also suitable for general-purpose illumination where a compact blue light source is required.

2. Technical Specifications and Objective Interpretation

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (I_F): 25 mA. This is the maximum continuous DC current recommended for reliable operation.
• Peak Forward Current (I_FP): 100 mA (at 1/10 duty cycle, 1 kHz). This rating allows for brief pulses of higher current, useful in multiplexed driving schemes, but sustained operation at this level is not advised.
• Power Dissipation (P_d): 95 mW. This is the maximum power the package can dissipate as heat without exceeding its thermal limits, calculated as V_F * I_F.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 150V. This indicates a moderate sensitivity to ESD. Proper handling procedures (e.g., grounded workstations, conductive foam) are necessary to prevent latent or catastrophic failures.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage). The wide range ensures functionality in harsh environments.
• Soldering Temperature: Reflow (260°C for 10 sec max) or Hand (350°C for 3 sec max). These profiles are critical for Pb-free assembly processes.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (I_F) of 5 mA, unless otherwise specified.

• Luminous Intensity (I_v): 28.5 to 72.0 mcd (millicandela). The wide range is managed through a binning system (detailed in Section 3). The typical value is not stated, implying selection is based on the specific bin code.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its peak value. A 120° angle provides a very wide emission pattern, suitable for area illumination rather than focused beams.
• Peak Wavelength (λ_p): 468 nm (typical). This is the wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λ_d): 464.5 to 476.5 nm. This is the single-wavelength perception of the LED's color by the human eye and is also subject to binning.
• Spectral Bandwidth (Δλ): 35 nm (typical). This defines the range of wavelengths emitted, centered around the peak wavelength. A narrower bandwidth indicates a more spectrally pure color.
• Forward Voltage (V_F): 2.7V to 3.7V, with a typical value of 3.3V at I_F=5mA. This parameter has a tolerance of ±0.05V. The V_F is crucial for designing the current-limiting circuitry.
• Reverse Current (I_R): Maximum 50 µA at V_R=5V. A low reverse current is desirable.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins. This device uses two independent binning parameters.

3.1 Luminous Intensity Binning

The luminous intensity is categorized into four bins (N1, N2, P1, P2), each covering a specific range. The total spread from the lowest (N1 min: 28.5 mcd) to the highest (P2 max: 72.0 mcd) is significant. Designers must specify the required bin to guarantee a minimum brightness level for their application. The tolerance within a bin is ±11%.

3.2 Dominant Wavelength Binning

The dominant wavelength, which determines the perceived blue hue, is sorted into four bins (A9, A10, A11, A12). These bins span from 464.5 nm (bluer, shorter wavelength) to 476.5 nm (slightly greener, longer wavelength). Specifying a bin ensures color uniformity across multiple LEDs in a product. The tolerance within a bin is ±1 nm.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are essential for understanding the LED's behavior under different operating conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The curve shows the exponential relationship typical of a diode. At the recommended operating current of 5-20 mA, the forward voltage is relatively stable in the 3.0V to 3.8V range. This non-linear relationship highlights why a constant-current driver is vastly superior to a constant-voltage source for driving LEDs, as minor voltage changes can cause large current swings.

4.2 Luminous Intensity vs. Forward Current

This curve demonstrates that light output is approximately proportional to forward current in the lower to mid-range. However, efficiency (light output per unit of electrical input) typically decreases at very high currents due to increased heat generation. Operating near the maximum rated current (25 mA) may provide higher brightness but at the cost of reduced longevity and efficiency.

4.3 Luminous Intensity vs. Ambient Temperature

The light output decreases as the ambient temperature rises. This is a critical thermal management consideration. For example, if the LED is operated at its maximum temperature (+85°C), the luminous intensity will be significantly lower than its rated value at 25°C. Adequate PCB thermal design (copper pours, vias) is necessary to minimize the LED junction temperature and maintain stable light output.

4.4 Forward Current Derating Curve

This graph explicitly defines the maximum allowable continuous forward current as a function of ambient temperature. As temperature increases, the maximum safe current decreases linearly. This is to prevent the junction temperature from exceeding its limit, which would accelerate degradation. Designers must use this curve to select an appropriate operating current for their expected maximum ambient temperature.

4.5 Spectrum Distribution

The spectral plot confirms the blue emission with a peak around 468 nm and a full width at half maximum (FWHM) of approximately 35 nm. There is minimal emission in other parts of the visible spectrum, indicating good color purity for a blue LED.

4.6 Radiation Pattern

The polar diagram visually confirms the 120° viewing angle, showing a Lambertian-like emission pattern where intensity is highest at 0° (perpendicular to the chip) and decreases smoothly towards the edges.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard SMD package. The dimensional drawing provides critical measurements for PCB footprint design, including body length, width, height, and lead (terminal) spacing. Adherence to these dimensions is necessary for proper placement and soldering. The note specifies a general tolerance of ±0.1 mm unless otherwise stated.

5.2 Suggested Pad Layout

A recommended land pattern (footprint) is provided. This includes pad size, shape, and spacing. The datasheet correctly advises that this is a reference design and should be modified based on individual manufacturing capabilities (e.g., solder paste stencil design, reflow profile). The primary goal of the pad design is to ensure reliable solder joint formation and adequate thermal relief.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed temperature profile for Pb-free reflow soldering is provided. Key parameters include: a preheat stage (150-200°C for 60-120s), a time above liquidus (217°C for 60-150s), a peak temperature not exceeding 260°C for a maximum of 10 seconds, and controlled ramp-up/cool-down rates. It is explicitly stated that reflow should not be performed more than two times to avoid thermal stress on the component.

6.2 Hand Soldering Instructions

If hand soldering is necessary, strict limits are imposed: soldering iron tip temperature < 350°C, contact time per terminal ≤ 3 seconds, iron power ≤ 25W, and a minimum 2-second interval between soldering each terminal. The datasheet warns that damage often occurs during hand soldering, emphasizing the preference for reflow processes.

6.3 Storage and Moisture Sensitivity

The LED is packaged in a moisture-resistant bag with desiccant. Before opening, it should be stored at ≤ 30°C and ≤ 90% RH. After opening, the "floor life" is 1 year under ≤ 30°C / ≤ 60% RH. If exceeded, a baking treatment (60 ± 5°C for 24 hours) is required before reflow to prevent "popcorning" (package cracking due to vaporized moisture during soldering).

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The device is supplied in 8mm wide embossed carrier tape on 7-inch diameter reels. The reel dimensions, tape pocket design, and cover tape specifications are detailed to ensure compatibility with automated pick-and-place equipment. Each reel contains 3000 pieces.

7.2 Label Explanation

The reel label contains several codes:

• P/N: Product Number (the full part number, e.g., 16-213/BHC-AN1P2/3T).
• CAT: Luminous Intensity Rank (the bin code for brightness: N1, N2, P1, P2).
• HUE: Chromaticity & Dominant Wavelength Rank (the bin code for color: A9, A10, A11, A12).
• REF: Forward Voltage Rank.
• LOT No: Traceability lot number.

These codes are essential for traceability and ensuring the correct component variant is used in production.

8. Application Suggestions and Design Considerations

8.1 Current Limiting is Mandatory

The datasheet's first precaution is emphatic: "Customer must apply resistors for protection." Due to the LED's steep I-V curve, a small increase in supply voltage can cause a large, potentially destructive increase in current. A series resistor or, preferably, a dedicated constant-current LED driver circuit is required for safe operation.

8.2 Thermal Management

While the package is small, its performance is temperature-dependent. For consistent brightness and long life, the PCB layout should incorporate thermal management techniques. This includes using sufficient copper area connected to the LED's thermal pad (if applicable) or cathode/anode pads to act as a heat sink, and possibly using thermal vias to transfer heat to inner or bottom layers.

8.3 Optical Design

The 120° viewing angle makes this LED suitable for wide-area illumination without secondary optics. For more focused light, external lenses or reflectors would be required. Designers should consider the angular intensity distribution when planning light guides or diffusers for backlighting applications.

9. Technical Comparison and Differentiation

The primary differentiation of this LED lies in its specific combination of package size, wide viewing angle, blue color point, and its detailed binning structure. Compared to non-binned or loosely binned LEDs, it offers greater predictability in color and brightness for applications requiring visual consistency. Its compatibility with standard SMD assembly processes and Pb-free soldering makes it a drop-in component for modern electronics manufacturing lines. The comprehensive set of derating curves and application warnings provides designers with the necessary data to use the component reliably at the limits of its specification.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Why is my LED dimmer than expected?

Check the operating conditions: 1) Ensure the forward current is exactly 5 mA (or the current corresponding to the datasheet test condition). 2) Verify the ambient temperature. Luminous intensity decreases with rising temperature (see Section 4.3). 3) Confirm the purchased bin code (CAT on label). An N1 bin LED will be less bright than a P2 bin LED at the same current.

10.2 How do I select the correct current-limiting resistor?

Use Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (3.7V) to calculate the minimum resistor value that will limit current to the desired I_F under worst-case conditions. Then check the power rating of the resistor: P_R = (I_F)² * R.

10.3 Can I drive this LED with a 3.3V microcontroller pin?

Directly, it is not recommended. The typical V_F is 3.3V, and the maximum can be 3.7V. At 3.3V supply, there may be insufficient voltage headroom to turn the LED on consistently, especially at lower temperatures where V_F can increase. Furthermore, MCU pins have current sourcing limits (often 20-25mA). A transistor or driver circuit is the proper interface.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel with multiple uniform blue LEDs.

1. Specification: Define required minimum brightness and exact color hue. For uniformity, specify a single, tight bin for both luminous intensity (e.g., P1) and dominant wavelength (e.g., A10).
2. Circuit Design: Use a constant-current driver IC capable of delivering 5 mA per channel to multiple LEDs. This ensures identical current and therefore identical brightness across all LEDs, regardless of small V_F variations.
3. PCB Layout: Design pads according to the suggested layout. Include a small copper pour connected to the cathode pad of each LED to aid heat dissipation. Keep LEDs spaced to avoid mutual heating.
4. Assembly: Follow the reflow profile precisely. Store opened reels in a dry cabinet if not used immediately.
5. Validation: Measure forward voltage and light output of sample units at the intended operating current and maximum expected ambient temperature to verify performance.

12. Operating Principle Introduction

This LED is based on a semiconductor p-n junction made from InGaN materials. When a forward voltage exceeding the junction's potential barrier (the forward voltage V_F) is applied, electrons and holes are injected into the active region where they recombine. In a direct bandgap semiconductor like InGaN, this recombination releases energy in the form of photons (light). The specific energy bandgap of the InGaN alloy determines the wavelength of the emitted photons, which in this case is in the blue region of the visible spectrum (~468 nm). The epoxy resin package serves to protect the semiconductor chip, act as a lens to shape the light output (resulting in the 120° viewing angle), and provide the mechanical structure for soldering.

13. Technology Trends

SMD LEDs like the 16-213 series represent the industry standard for miniaturization and automated assembly. Ongoing trends in the field include:

• Increased Efficiency: Development of new epitaxial structures and materials to achieve higher luminous efficacy (more light output per electrical watt).
• Improved Color Consistency: Advances in manufacturing control and binning algorithms to provide tighter color and brightness tolerances straight from production.
• Enhanced Thermal Performance: Development of packages with lower thermal resistance to allow higher drive currents and maintain performance at elevated temperatures.
• Integration: Movement towards multi-chip packages (RGB, white) and LEDs with integrated drivers or control circuitry ("smart LEDs").

The component described in this datasheet fits into the broader ecosystem of reliable, cost-effective single-color indicator LEDs that continue to be essential in countless electronic devices.