SMD LED 19-22/R6G6C-A01/2T Datasheet - Multi-Color (Red/Yellow-Green) - Package 2.0x1.25x0.8mm - Voltage 2.0V - Power 60mW - English Technical Document

1. Product Overview

The 19-22 SMD LED is a compact, surface-mount device designed for high-density PCB applications. This multi-color variant integrates two distinct LED chips within a single package: one emitting Brilliant Red (R6) and the other emitting Brilliant Yellow Green (G6). Its miniature footprint enables significant space savings compared to traditional lead-frame components, contributing to smaller end-product designs, reduced storage requirements, and higher assembly density. The lightweight construction further makes it ideal for portable and miniature electronic devices.

The product is engineered for compatibility with modern automated pick-and-place assembly lines and standard infrared or vapor phase reflow soldering processes. It adheres to stringent environmental and safety standards, being fully Pb-free, compliant with the EU RoHS directive, EU REACH regulations, and meeting halogen-free criteria (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided for reliable long-term performance.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA for both R6 and G6 chips. This is the maximum DC current for continuous operation at Ta=25°C.
• Peak Forward Current (I_FP): 60 mA (Duty 1/10 @1KHz). Suitable for pulsed operation but not for DC.
• Power Dissipation (P_d): 60 mW. The maximum power the package can dissipate, calculated as V_F * I_F.
• Electrostatic Discharge (ESD) HBM: 2000 V. Indicates the device's sensitivity; proper ESD handling procedures are mandatory.
• Operating Temperature (T_opr): -40°C to +85°C. The ambient temperature range for normal operation.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature: Reflow: 260°C peak for 10 seconds max. Hand soldering: 350°C for 3 seconds max per terminal.

2.2 Electro-Optical Characteristics (Ta=25°C)

These are the typical performance parameters measured under standard test conditions (I_F=20mA, Ta=25°C).

• Luminous Intensity (I_v):
  • R6 (Red): 45.0 - 112.0 mcd (see binning).
  • G6 (Yellow Green): 45.0 - 72.0 mcd (see binning).
  • Tolerance: ±11%.
• Viewing Angle (2θ_1/2): 130° (typical). This wide angle ensures good visibility from various perspectives.
• Peak Wavelength (λ_p):
  • R6: 632 nm (typical).
  • G6: 575 nm (typical).
• Dominant Wavelength (λ_d):
  • R6: 617.5 - 633.5 nm.
  • G6: 567.5 - 575.5 nm.
  • Tolerance: ±1 nm.
• Spectrum Radiation Bandwidth (Δλ): 20 nm (typical) for both colors, indicating relatively pure color emission.
• Forward Voltage (V_F):
  • R6 & G6: 1.7V (Min), 2.0V (Typ), 2.4V (Max) @ I_F=20mA.
• Reverse Current (I_R): 10 µA (Max) @ V_R=5V.

3. Binning System Explanation

The LEDs are sorted (binned) based on key optical parameters to ensure consistency within a production batch. This allows designers to select parts matching specific brightness and color requirements.

3.1 R6 (Brilliant Red) Binning

• Luminous Intensity Bins:
  • P1: 45.0 - 57.0 mcd
  • P2: 57.0 - 72.0 mcd
  • Q1: 72.0 - 90.0 mcd
  • Q2: 90.0 - 112.0 mcd
• Dominant Wavelength Bins:
  • E4: 617.50 - 621.50 nm
  • E5: 621.50 - 625.50 nm
  • E6: 625.50 - 629.50 nm
  • E7: 629.50 - 633.50 nm

3.2 G6 (Brilliant Yellow Green) Binning

• Luminous Intensity Bins:
  • P1: 45.0 - 57.0 mcd
  • P2: 57.0 - 72.0 mcd
• Dominant Wavelength Bins:
  • C15: 567.50 - 569.50 nm
  • C16: 569.50 - 571.50 nm
  • C17: 571.50 - 573.50 nm
  • C18: 573.50 - 575.50 nm

A complete product code includes both Intensity (CAT) and Wavelength (HUE) bin codes, allowing precise selection.

4. Performance Curve Analysis

4.1 R6 Chip Characteristics

The provided curves for the R6 (Red) chip illustrate key relationships:

• Relative Luminous Intensity vs. Ambient Temperature: Luminous output decreases as ambient temperature increases, a typical behavior for LEDs due to reduced internal quantum efficiency and increased non-radiative recombination at higher temperatures.
• Forward Voltage vs. Forward Current (I-V Curve): Shows the exponential relationship. The curve's knee voltage is around 1.7-2.0V. The dynamic resistance can be inferred from the slope above the knee voltage.
• Relative Luminous Intensity vs. Forward Current: Output is roughly linear with current in the normal operating range (up to ~20-30mA), after which efficiency may drop due to heating and other effects.
• Spectrum Distribution: The graph shows a dominant peak around 632 nm (red) with a typical full width at half maximum (FWHM) of approximately 20 nm.

4.2 G6 Chip Characteristics

Similar curves are provided for the G6 (Yellow Green) chip, depicting:

• Relative Luminous Intensity vs. Ambient Temperature.
• Forward Voltage vs. Forward Current.
• Relative Luminous Intensity vs. Forward Current.
• Spectrum Distribution: Expected peak around 575 nm.

These curves are essential for thermal management design and for predicting performance under non-standard operating conditions.

5. Mechanical & Package Information

5.1 Package Dimensions

The 19-22 SMD LED has a very compact footprint. Key dimensions (tolerance ±0.1mm unless noted) include:

• Package Length: 2.0 mm
• Package Width: 1.25 mm
• Package Height: 0.8 mm
• Terminal dimensions and spacing are defined for reliable soldering.

The detailed dimensioned drawing is crucial for PCB land pattern design (footprint). A correctly designed footprint ensures proper solder joint formation, alignment, and mechanical stability.

5.2 Polarity Identification

The package includes a polarity indicator, typically a notch or a marked cathode. Correct orientation during placement is vital for circuit functionality.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile (Pb-free)

A critical process for reliable assembly. The recommended profile includes:

• Pre-heating: 150-200°C for 60-120 seconds. Gradual heating to minimize thermal shock.
• Time Above Liquidus (TAL): 60-150 seconds above 217°C.
• Peak Temperature: Maximum 260°C, held for a maximum of 10 seconds.
• Heating Rate: Maximum 6°C/second up to 255°C.
• Cooling Rate: Maximum 3°C/second.
• Reflow Limit: The assembly should not undergo reflow soldering more than two times to prevent excessive thermal stress on the LED package and wire bonds.

6.2 Hand Soldering

If manual soldering is necessary:

• Iron tip temperature: < 350°C.
• Contact time per terminal: ≤ 3 seconds.
• Soldering iron power: ≤ 25W.
• Avoid applying mechanical stress to the component during or after soldering.

6.3 Storage & Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant to prevent moisture absorption, which can cause "popcorning" (package cracking) during reflow.

• Before Use: Do not open the moisture-proof bag until ready for assembly.
• After Opening: Use within 168 hours (7 days) if stored at ≤ 30°C and ≤ 60% RH.
• Rebaking: If the exposure time is exceeded or desiccant is saturated, bake at 60 ±5°C for 24 hours before use.

7. Packaging & Ordering Information

7.1 Tape and Reel Specifications

The components are supplied in industry-standard embossed carrier tape for automated assembly.

• Carrier Tape Width: 8 mm.
• Reel Diameter: 7 inches.
• Pocket Pitch: Defined in the carrier tape drawing.
• Quantity per Reel: 2000 pieces.

Detailed reel and tape dimensions are provided for compatibility with feeder equipment.

7.2 Label Explanation

The reel label contains several codes essential for traceability and verification:

• P/N: Product Number (e.g., 19-22/R6G6C-A01/2T).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank (Bin Code).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank (Bin Code).
• REF: Forward Voltage Rank.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch backlighting, and flat backlighting for LCD symbols due to their small size and good brightness.
• Status Indicators: Perfect for telecommunication equipment (phones, fax machines), consumer electronics, and industrial control panels as multi-color status or function indicators.
• General Purpose Indication: Any application requiring compact, reliable, and bright visual indicators.

8.2 Design Considerations

• Current Limiting: An external current-limiting resistor is absolutely mandatory. The LED's exponential I-V characteristic means a small increase in voltage causes a large current increase, leading to instantaneous failure. The resistor value is calculated as R = (V_supply - V_F) / I_F.
• Thermal Management: While power dissipation is low, maintaining the junction temperature within limits is key for longevity and stable light output. Ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or currents.
• ESD Protection: Implement ESD protection on input lines if the LED is exposed to user interfaces, and always follow ESD-safe handling procedures during assembly.
• PCB Layout: Follow the recommended land pattern from the dimension drawing. Ensure solder mask dams between pads to prevent bridging.

9. Technical Comparison & Differentiation

The 19-22 series offers distinct advantages in specific contexts:

• vs. Larger SMD LEDs (e.g., 3528, 5050): The primary advantage is the significantly smaller footprint (2.0x1.25mm), enabling ultra-miniaturized designs where board space is at a premium. The trade-off is generally lower total light output per package.
• vs. Single-Color 19-22 LEDs: This specific A01/2T variant integrates two different color chips (Red and Yellow-Green) in one package. This saves space and placement cost compared to using two separate single-color LEDs, simplifying designs requiring dual-color indication.
• vs. Through-Hole LEDs: Offers all standard SMD benefits: suitability for automated assembly, no lead bending/trimming, lower profile, and better performance in high-vibration environments.
• Compliance: Its full suite of compliance (Pb-free, RoHS, REACH, Halogen-Free) makes it suitable for the most demanding global markets and environmentally conscious designs.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Can I drive this LED directly from a 3.3V or 5V logic supply without a resistor?
A: No, never. You must use a series current-limiting resistor. Without it, the forward voltage is only ~2.0V, so the excess voltage from a 3.3V or 5V supply will cause excessive current, destroying the LED instantly.

Q2: What is the difference between Peak Wavelength and Dominant Wavelength?
A: Peak Wavelength (λ_p) is the wavelength at which the emission spectrum has its maximum intensity. Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. λ_d is more relevant for color specification. The datasheet provides both.

Q3: How do I select the correct bin codes for my application?
A: If your design requires consistent brightness across multiple units, specify a tighter luminous intensity bin (e.g., P2 only). If color consistency is critical (e.g., for color matching), specify a narrow dominant wavelength bin (e.g., E5 for red). Consult the binning tables in sections 3.1 and 3.2.

Q4: The operating temperature is up to 85°C. Can I use it in an outdoor application?
A: The 85°C rating refers to the ambient air temperature around the device. In an outdoor enclosure exposed to direct sunlight, internal temperatures can easily exceed this. You must design the system to ensure the LED's local ambient temperature remains within -40°C to +85°C, considering solar heating, internal heat from other components, and lack of ventilation.

Q5: Why is there a strict 7-day floor life after opening the moisture barrier bag?
A: The plastic LED package can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture rapidly turns to steam, creating pressure that can delaminate the package or crack the epoxy, a failure known as "popcorning." The 7-day limit assumes proper storage conditions (30°C/60%RH).

11. Practical Design & Usage Case Study

Scenario: Designing a Dual-Color Status Indicator for a Portable Medical Device.

Requirements: The device needs a single, tiny indicator to show "Standby" (Green) and "Fault" (Red). Board space is extremely limited. The device must be RoHS and halogen-free for global medical market compliance.

Component Selection: The 19-22/R6G6C-A01/2T is an ideal candidate. Its 2.0x1.25mm footprint saves crucial space. The integrated Red (R6) and Yellow-Green (G6) chips eliminate the need for two separate LEDs and their associated placement cycles. Its full environmental compliance meets regulatory needs.

Circuit Design: Two independent driver circuits are designed, each consisting of a GPIO pin from a microcontroller, a current-limiting resistor, and the corresponding anode of the LED package. The common cathode is connected to ground. The resistor value is calculated for a target current of 15mA (well below the 25mA max) for longevity: R = (3.3V - 2.0V) / 0.015A ≈ 87Ω (use 82Ω or 100Ω standard value).

PCB Layout: The recommended land pattern from the datasheet is used. Small thermal relief connections are used on the pads to facilitate soldering while maintaining a good thermal connection to a small ground pour for heat dissipation.

Assembly & Result: The parts are supplied on 8mm tape for automatic placement. The designed reflow profile is followed precisely. The final product has a clean, professional-looking dual-color indicator that meets all size, reliability, and compliance requirements.

12. Technology Introduction

The 19-22 LED utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material for both the R6 (Red) and G6 (Yellow-Green) chips. AlGaInP is a direct bandgap III-V compound semiconductor well-suited for producing high-efficiency light emission in the amber-to-red color spectrum (approximately 560-650 nm). By carefully adjusting the ratios of Aluminum, Gallium, and Indium in the crystal lattice, the bandgap energy—and thus the emitted photon wavelength—can be precisely tuned.

The basic operating principle is electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. There, they recombine radiatively, releasing energy in the form of photons. The wavelength (color) of these photons is determined by the bandgap energy of the semiconductor material in the active region. The chip is encapsulated in a clear epoxy resin which protects the semiconductor die, acts as a lens to shape the light output (achieving the 130° viewing angle), and provides mechanical stability.

13. Technology Trends

The market for miniature SMD LEDs like the 19-22 continues to evolve driven by several key trends:

• Increased Miniaturization: The demand for ever-smaller consumer electronics, wearables, and medical devices pushes for LEDs with smaller footprints and lower profiles than the 19-22, such as chip-scale package (CSP) LEDs or even smaller package types.
• Higher Efficiency & Luminance: Ongoing improvements in epitaxial growth, chip design, and package extraction efficiency lead to higher luminous intensity from the same or smaller chip sizes, allowing designers to use less current for the same brightness, improving battery life and thermal performance.
• Advanced Color Options & Multi-Chip Integration: The trend exemplified by this product—integrating multiple colors—is expanding to include RGB (Red-Green-Blue) or RGBW (Red-Green-Blue-White) in tiny packages, enabling full-color programmability in a single point source.
• Enhanced Reliability & Harsh Environment Suitability: Developments in encapsulation materials (e.g., silicones instead of epoxy for better heat and UV resistance) and package structures are improving LED lifetime and performance in automotive, industrial, and outdoor applications.
• Intelligent Integration: A broader trend involves integrating control circuitry (like constant current drivers or simple logic) directly with the LED die or within the package, moving towards "smart LED" components that simplify system design.

The 19-22 series represents a mature, reliable solution in this landscape, particularly suited for cost-effective, space-constrained indicator applications requiring robust performance and broad compliance.