SMD LED 0201 Blue Datasheet - Dimensions 0.6x0.3x0.25mm - Voltage 2.4-3.3V - Power 99mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED) in an 0201 package format. The device is designed for automated printed circuit board (PCB) assembly and is ideal for space-constrained applications. It utilizes an InGaN (Indium Gallium Nitride) semiconductor material to produce blue light with a water-clear lens, offering a broad viewing angle suitable for various indicator and backlighting purposes.

1.1 Features

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 12mm tape wound onto 7-inch diameter reels for automated pick-and-place assembly.
• Standardized EIA (Electronic Industries Alliance) package footprint.
• Input compatible with standard integrated circuit (IC) logic levels.
• Designed for compatibility with automated surface-mount placement equipment.
• Suitable for use in infrared (IR) reflow soldering processes.
• Preconditioned to accelerate to JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3.

1.2 Applications

This LED is targeted at a wide range of electronic equipment where reliable, compact status indication is required. Typical application areas include:

• Telecommunication devices (e.g., cordless phones, cellular phones).
• Office automation equipment (e.g., notebook computers, network systems).
• Home appliances and consumer electronics.
• Industrial control and monitoring equipment.
• Status and power indicators.
• Signal and symbolic illumination.
• Front panel and keypad backlighting.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The following parameters define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Power Dissipation (Pd): 99 mW. This is the maximum amount of power the LED package can dissipate as heat without exceeding its maximum junction temperature.
• Peak Forward Current (I_FP): 100 mA. This is the maximum allowable instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (I_F): 30 mA. This is the maximum continuous forward current recommended for reliable long-term operation.
• Operating Temperature Range (T_opr): -40°C to +85°C. The ambient temperature range over which the device is designed to function correctly.
• Storage Temperature Range (T_stg): -40°C to +100°C. The temperature range for storing the device when not powered.

2.2 Electrical / Optical Characteristics

These parameters are measured at a standard ambient temperature (T_a) of 25°C and define the typical performance of the device.

• Luminous Intensity (I_V): 400 - 1040 mcd (millicandela) at I_F = 20mA. This measures the perceived brightness of the LED to the human eye, filtered to match the CIE photopic response curve. The wide range indicates a binning system is used.
• Viewing Angle (2θ_1/2): 110 degrees (typical). This is the full angle at which the luminous intensity is half of its peak axial value. A 110° angle provides a very wide emission pattern.
• Peak Emission Wavelength (λ_P): 466 nm (typical). The wavelength at which the optical output power is maximum.
• Dominant Wavelength (λ_d): 466 - 476 nm at I_F = 20mA. This is the single wavelength that best represents the perceived color of the light, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 35 nm (typical). The spectral bandwidth measured at half the maximum intensity (Full Width at Half Maximum - FWHM). A value of 35nm is characteristic of InGaN blue LEDs.
• Forward Voltage (V_F): 2.4 - 3.3 V at I_F = 20mA. The voltage drop across the LED when operating at the specified current. The range signifies different voltage bins.
• Reverse Current (I_R): 10 μA (max) at V_R = 5V. The small leakage current when a reverse bias is applied. The device is not designed for reverse operation; this parameter is primarily for IR test validation.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific requirements for color, brightness, and forward voltage.

3.1 Forward Voltage (V_F) Rank

Binned at a test current of 20mA. Tolerance for each bin is ±0.1V.

• Bin F4: 2.4V (Min) to 2.7V (Max)
• Bin F5: 2.7V (Min) to 3.0V (Max)
• Bin F6: 3.0V (Min) to 3.3V (Max)

3.2 Luminous Intensity (I_V) Rank

Binned at a test current of 20mA. Tolerance on each intensity bin is ±11%.

• Bin T2: 400.0 mcd (Min) to 540.0 mcd (Max)
• Bin U1: 540.0 mcd (Min) to 750.0 mcd (Max)
• Bin U2: 750.0 mcd (Min) to 1040.0 mcd (Max)

3.3 Hue (Dominant Wavelength) Rank

Binned at a test current of 20mA. Tolerance for each bin is ±1nm.

• Bin AC: 466.0 nm (Min) to 471.0 nm (Max)
• Bin AD: 471.0 nm (Min) to 476.0 nm (Max)

4. Performance Curve Analysis

The datasheet references typical performance curves which are essential for understanding device behavior under varying conditions. While specific graphs are not reproduced in text, their implications are analyzed below.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The I-V characteristic is non-linear, typical of a diode. The forward voltage (V_F) has a positive temperature coefficient, meaning it decreases slightly as the junction temperature increases for a given current. Designers must account for this when designing current-limiting circuits to ensure stable operation across the temperature range.

4.2 Luminous Intensity vs. Forward Current

Luminous intensity is generally proportional to forward current within the safe operating area. However, efficiency may drop at very high currents due to increased heat generation (droop effect). Operating at or below the recommended 20mA ensures optimal efficiency and longevity.

4.3 Spectral Distribution

The spectral output curve centers around the peak wavelength of 466nm with a FWHM of approximately 35nm. This defines the blue color purity. The dominant wavelength, used for binning, is calculated from this spectrum weighted by the human eye's sensitivity.

4.4 Temperature Characteristics

LED performance is temperature-dependent. Luminous intensity typically decreases as junction temperature rises. The operating and storage temperature ranges (-40°C to +85°C and -100°C respectively) ensure the semiconductor material and package integrity are maintained.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The device conforms to the 0201 package standard. Key dimensions (in millimeters) include a body length of approximately 0.6mm, a width of 0.3mm, and a height of 0.25mm. All dimensional tolerances are ±0.2mm unless otherwise specified. The anode and cathode terminals are clearly designated for correct PCB orientation.

5.2 Recommended PCB Attachment Pad

A land pattern (footprint) is provided for infrared or vapor phase reflow soldering. Adhering to this recommended pad layout is crucial for achieving reliable solder joints, proper self-alignment during reflow, and effective heat dissipation from the LED die.

5.3 Tape and Reel Packaging

The LEDs are supplied in embossed carrier tape with a width of 12mm. The tape is wound onto reels with a 7-inch (178mm) diameter. Standard reel quantities are 4000 pieces per reel, with a minimum packing quantity of 500 pieces for remainder lots. The packaging follows ANSI/EIA-481 specifications to ensure compatibility with automated assembly equipment.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

A suggested reflow profile compliant with J-STD-020B for lead-free processes is provided. Key parameters include:

• Pre-heat: 150-200°C maximum.
• Pre-heat Time: 120 seconds maximum.
• Peak Temperature: 260°C maximum.
• Time Above Liquidus: 10 seconds maximum (recommended for a maximum of two reflow cycles).

It is critical to note that the optimal profile depends on the specific PCB design, solder paste, and oven. The provided profile serves as a generic target based on JEDEC standards.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken due to the miniature size. Recommendations include:

• Iron Temperature: 300°C maximum.
• Soldering Time: 3 seconds maximum per joint.
• Apply heat to the PCB pad, not directly to the LED body.

6.3 Cleaning

If post-solder cleaning is required, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is acceptable. Unspecified chemicals may damage the epoxy lens or package.

6.4 Storage and Moisture Sensitivity

The LEDs are moisture-sensitive (MSL 3).

• Sealed Package: Store at ≤30°C and ≤70% Relative Humidity (RH). Use within one year of the pack date.
• Opened Package: Store at ≤30°C and ≤60% RH. It is recommended to complete IR reflow within 168 hours (7 days) of opening.
• Extended Storage (Opened): Store in a sealed container with desiccant or in a nitrogen desiccator.
• Exposure >168hrs: LEDs must be baked at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Application Suggestions

7.1 Typical Application Circuits

This LED requires a current-limiting mechanism when driven from a voltage source higher than its forward voltage. The simplest method is a series resistor. The resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F. For example, with a 5V supply, a V_F of 3.0V (typical), and a desired I_F of 20mA, R_s = (5V - 3.0V) / 0.020A = 100 Ω. The power rating of the resistor should be at least I_F² * R_s.

7.2 Design Considerations

• Current Drive: Always drive the LED with a constant current or a voltage source with a series resistor. Direct connection to a voltage source exceeding V_F will cause excessive current and rapid failure.
• Thermal Management: Although power dissipation is low, ensuring adequate PCB copper area around the pads helps dissipate heat, especially in high ambient temperature environments or when driven at higher currents.
• ESD Protection: While not explicitly stated as sensitive, handling all semiconductor devices with appropriate ESD (Electrostatic Discharge) precautions is good practice.
• Optical Design: The wide 110° viewing angle makes it suitable for applications requiring broad visibility. For focused light, external lenses or light guides may be necessary.

8. Technical Comparison and Differentiation

The primary differentiating factors for this LED are its extremely compact 0201 footprint and its specific blue color point (466-476nm dominant wavelength). Compared to larger packages (e.g., 0603, 0805), the 0201 offers significant space savings on the PCB, enabling higher density designs. The InGaN technology provides efficient blue emission. The combination of a wide viewing angle and a clear lens results in a bright, diffuse light source ideal for status indicators where viewing angle is not restricted. The detailed binning system allows for precise selection in applications requiring tight color or brightness matching across multiple LEDs.

9. Frequently Asked Questions (Based on Technical Parameters)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_P) is the physical wavelength where the LED emits the most optical power. Dominant Wavelength (λ_d) is a calculated value that represents the single wavelength of monochromatic light that would appear to have the same color as the LED's output to the human eye. λ_d is therefore more relevant for color specification and binning.

9.2 Can I drive this LED with 30mA continuously?

While the Absolute Maximum Rating for DC Forward Current is 30mA, the typical test condition and recommended operating point for the published optical specifications is 20mA. Operating at 30mA may produce higher light output but will generate more heat, potentially reducing lifetime and shifting color. For reliable long-term operation, it is advisable to design the circuit for 20mA or less.

9.3 Why is there a reverse current specification if the device is not for reverse operation?

The Reverse Current (I_R) specification is a quality control parameter measured during production testing (IR test). It ensures the integrity of the semiconductor junction. In application, a reverse voltage should never be intentionally applied, as it is not designed to block significant reverse voltage and could be damaged.

9.4 How do I interpret the bin codes when ordering?

To ensure you receive LEDs with consistent performance, you should specify the bin codes for Forward Voltage (F4/F5/F6), Luminous Intensity (T2/U1/U2), and Dominant Wavelength (AC/AD) based on your design requirements. For example, an order might specify parts from bin F5, U1, AC for medium voltage, medium-high brightness, and a bluer hue.

10. Practical Use Case

Scenario: Designing a compact wearable device status indicator. The device has a small PCB with limited space. A blue power-on indicator is required. The 0201 LED is selected for its minimal footprint. The design uses a 3.3V microcontroller GPIO pin to control the LED. A series resistor is calculated using the maximum V_F from the chosen voltage bin (e.g., Bin F6 max of 3.3V) to ensure sufficient current even with worst-case V_F: R_s = (3.3V - 3.3V) / 0.020A = 0 Ω. This is not feasible. Therefore, a lower V_F bin (F4 or F5) must be selected, or the supply voltage increased. Choosing Bin F5 (max V_F=3.0V) and adding a small boost converter to provide 3.6V allows R_s = (3.6V - 3.0V) / 0.020A = 30 Ω. The PCB layout provides modest copper pours on the LED pads for heat sinking. The LED is placed on the board using automated pick-and-place from the 12mm tape reel.

11. Principle Introduction

This LED is a semiconductor photonic device. It is based on a heterojunction structure of Indium Gallium Nitride (InGaN). When a forward bias voltage is applied, electrons and holes are injected into the active region from the n-type and p-type semiconductor layers, respectively. These charge carriers recombine radiatively, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, blue. The water-clear epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output pattern to achieve the specified 110-degree viewing angle.

12. Development Trends

The trend in SMD LEDs for indicator applications continues toward miniaturization, increased efficiency, and higher reliability. Package sizes have progressed from 0603 to 0402, and now to 0201 and even smaller metric equivalents like 01005. Efficiency improvements (higher lumens per watt) allow for adequate brightness at lower drive currents, reducing power consumption and thermal load. Advancements in packaging materials and die-attach technologies enhance long-term reliability and resistance to thermal cycling. Furthermore, there is a growing emphasis on tighter binning tolerances and more sophisticated color mixing capabilities for applications requiring precise color rendering or tunable white light, although this particular device is a single-color blue emitter.