SMD LED 0603 Blue Datasheet - Dimensions 1.6x0.8x0.8mm - Voltage 2.8-3.8V - Power 80mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Light Emitting Diode (LED) in a standard 0603 package size. The device emits blue light utilizing an Indium Gallium Nitride (InGaN) semiconductor material. It is designed for automated assembly processes and is compatible with infrared reflow soldering, making it suitable for high-volume electronics manufacturing.

1.1 Core Features and Advantages

The LED offers several key features that enhance its usability and reliability in modern electronic designs. It is compliant with RoHS (Restriction of Hazardous Substances) directives, classifying it as a green product. The component is supplied in industry-standard 8mm tape on 7-inch diameter reels, facilitating efficient handling by automated pick-and-place equipment. Its design is I.C. (Integrated Circuit) compatible, allowing for straightforward integration into digital and analog circuits.

1.2 Target Applications

This LED is intended for use in general electronic equipment. Typical applications include status indicators, backlighting for small displays, panel illumination, and decorative lighting in consumer electronics, communication devices, and office equipment. Its small form factor and reliability make it a versatile choice for space-constrained designs.

2. In-Depth Technical Parameter Analysis

All parameters are specified at an ambient temperature (Ta) of 25°C unless otherwise noted. Understanding these parameters is crucial for proper circuit design and ensuring long-term performance.

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are not intended for continuous operation.

• Power Dissipation (Pd): 80 mW. This is the maximum amount of power the LED package can dissipate as heat.
• Peak Forward Current (IFP): 100 mA. This is the maximum allowable instantaneous current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (IF): 20 mA. This is the recommended maximum continuous forward current for reliable operation.
• Operating Temperature Range: -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored without degradation within these limits.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters under specified test conditions.

• Luminous Intensity (Iv): Ranges from 140 mcd (minimum) to 450 mcd (maximum) at a forward current (IF) of 20 mA. Intensity is measured using a sensor filtered to match the human eye's photopic response (CIE curve).
• Viewing Angle (2θ1/2): 120 degrees. This is the full angle at which the luminous intensity drops to half of its value measured on the central axis. A wide viewing angle like this provides broad, diffuse illumination.
• Peak Emission Wavelength (λP): 468 nm (typical). This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (λd): Ranges from 465 nm to 475 nm at IF=20mA. This is the single wavelength perceived by the human eye that defines the color of the light, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 25 nm (typical). This parameter indicates the spectral purity or bandwidth of the emitted light.
• Forward Voltage (VF): Ranges from 2.8 V (minimum) to 3.8 V (maximum) at IF=20mA. This is the voltage drop across the LED when conducting current.
• Reverse Current (IR): 10 μA (maximum) at a Reverse Voltage (VR) of 5V. The device is not designed for reverse bias operation; this parameter is for leakage current characterization only.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins based on key parameters. This allows designers to select parts that meet specific requirements for color and brightness uniformity in their application.

3.1 Forward Voltage Binning

Bins are labeled D7 through D11, each covering a 0.2V range from 2.8V to 3.8V at 20mA. Tolerance within each bin is ±0.1V. Selecting LEDs from the same voltage bin helps maintain uniform current sharing when multiple LEDs are connected in parallel.

1.3.2 Luminous Intensity Binning

Bins are labeled R2, S1, S2, T1, and T2. The intensity ranges from 140 mcd (R2 min) to 450 mcd (T2 max) at 20mA. Tolerance on each intensity bin is ±11%. This binning is critical for applications requiring consistent brightness levels across multiple indicators.

3.3 Dominant Wavelength Binning

Bins are labeled AC (465-470 nm) and AD (470-475 nm). Tolerance for each bin is ±1 nm. This ensures a very tight control over the perceived blue color, which is important for color-matching in multi-LED arrays or backlighting systems.

4. Performance Curve Analysis

While specific graphs are referenced in the datasheet (e.g., Fig.1, Fig.5), typical curves for such devices provide essential design insights.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The relationship is exponential. A small increase in voltage beyond the threshold leads to a large increase in current. Therefore, LEDs must be driven by a current-limited source, not a constant voltage source, to prevent thermal runaway and destruction.

4.2 Luminous Intensity vs. Forward Current

Luminous intensity is approximately proportional to the forward current. However, efficiency may drop at very high currents due to increased heat generation within the semiconductor junction.

4.3 Spectral Distribution

The emitted light spectrum centers around the peak wavelength (468 nm typical) with a characteristic half-width. The dominant wavelength determines the perceived hue. Variations in manufacturing and drive current can cause slight shifts in these spectral characteristics.

4.4 Temperature Dependence

LED performance is temperature-sensitive. Typically, forward voltage decreases with increasing junction temperature, while luminous intensity also decreases. Operating the LED within its specified temperature range is vital for maintaining performance and longevity.

5. Mechanical and Package Information

5.1 Device Dimensions

The LED conforms to the EIA standard 0603 package footprint. Key dimensions include a body length of approximately 1.6 mm, a width of 0.8 mm, and a height of 0.8 mm. Detailed mechanical drawings should be consulted for precise pad layout and placement tolerances, which are typically ±0.2 mm.

5.2 Polarity Identification

The cathode is typically marked, often by a green tint on the corresponding side of the lens or a notch in the package. Correct polarity orientation is mandatory during assembly to ensure proper function.

5.3 Recommended PCB Pad Design

A land pattern slightly larger than the device footprint is recommended to ensure a reliable solder joint. The datasheet provides a specific pad layout diagram optimized for infrared or vapor phase reflow soldering processes, which helps prevent tombstoning (component standing up on one end) during reflow.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The device is compatible with infrared reflow soldering processes. A lead-free soldering profile compliant with J-STD-020B is suggested. Key parameters include a pre-heat temperature of 150-200°C, a peak body temperature not exceeding 260°C, and a time above liquidus (TAL) tailored to the specific solder paste. The total pre-heat time should be limited to a maximum of 120 seconds.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron with a temperature not exceeding 300°C. The soldering time should be limited to a maximum of 3 seconds per pad, and this should be performed only once to minimize thermal stress on the component.

6.3 Storage and Handling

Unopened Packaging: Store at ≤30°C and ≤70% Relative Humidity (RH). The shelf life in the moisture-proof bag with desiccant is one year.
Opened Packaging: For components exposed to ambient air, the storage conditions should not exceed 30°C and 60% RH. It is strongly recommended to complete the IR reflow process within 168 hours (7 days) of opening the bag. For longer storage outside the original packaging, store in a sealed container with desiccant or in a nitrogen atmosphere. Components stored beyond 168 hours should be baked at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" (package cracking due to rapid vapor expansion during reflow).

6.4 Cleaning

If cleaning of the assembled board is required, use only specified solvents. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable. Do not use unspecified chemical cleaners as they may damage the epoxy lens or package.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on 8mm wide embossed carrier tape wound onto 7-inch (178 mm) diameter reels. Each reel contains 2000 pieces. The tape pockets are sealed with a protective top cover tape. Packaging follows ANSI/EIA-481 specifications. For quantities less than a full reel, a minimum packing quantity of 500 pieces applies for remainder lots.

7.2 Quality Assurance on Tape

The maximum number of consecutive missing components (empty pockets) on a reel is two, ensuring consistency for automated feeders.

8. Application Design Considerations

8.1 Drive Method

An LED is a current-operated device. To ensure uniform brightness, especially when connecting multiple LEDs in parallel, each LED should be driven by its own current-limiting resistor. Driving LEDs in series with a constant current source is often a more reliable method for achieving uniform intensity, as the same current flows through all devices in the string.

8.2 Thermal Management

Although power dissipation is low (80mW max), proper PCB layout can aid in heat dissipation. Ensure adequate copper area connected to the thermal pads (if any) or the cathode/anode traces to act as a heat sink, especially when operating at high ambient temperatures or near maximum current.

8.3 Electrical Protection

Consider adding transient voltage suppression (TVS) diodes or other protection circuits if the LED is connected to lines susceptible to voltage spikes or electrostatic discharge (ESD). The LED has a low reverse breakdown voltage and can be easily damaged by reverse bias or over-voltage conditions.

9. Frequently Asked Questions (FAQ)

9.1 Can I drive this LED directly from a 5V or 3.3V logic output?

No. You must use a series current-limiting resistor. The required resistor value (R) can be calculated using Ohm's Law: R = (Vcc - VF) / IF, where Vcc is your supply voltage (e.g., 5V), VF is the forward voltage of the LED (use the maximum value from the bin, e.g., 3.8V), and IF is your desired forward current (e.g., 20mA). Example: R = (5V - 3.8V) / 0.02A = 60 Ohms. Always choose the next higher standard resistor value and verify power dissipation in the resistor.

9.2 Why is there a viewing angle specification, and how do I use it?

The 120-degree viewing angle indicates this is a wide-angle LED. The light output is diffuse rather than focused into a narrow beam. This is ideal for status indicators that need to be visible from a wide range of positions. For applications requiring a directed beam, a lens or a LED with a narrower viewing angle would be more suitable.

9.3 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λP) is the physical wavelength where the light emission is strongest. Dominant Wavelength (λd) is a calculated value based on how the human eye perceives color; it's the single wavelength that would appear to have the same color as the LED's output. For monochromatic LEDs like this blue one, they are often close, but dominant wavelength is the key parameter for color matching.

9.4 My application requires very consistent blue color. What should I specify?

You should specify a tight Dominant Wavelength bin, such as requesting all parts from bin \"AC\" (465-470 nm) or \"AD\" (470-475 nm). This ensures minimal color variation between different LEDs in your product.

10. Design and Usage Case Study

10.1 Multi-LED Status Indicator Panel

Scenario: Designing a control panel with 10 blue status indicators that must have uniform brightness.
Design Approach:
1. Circuit: Use a series connection for uniformity. With a 24V supply, connect 5 LEDs in series per string (5 * 3.8V max = 19V), using two identical strings in parallel. A single constant current driver or a current-limiting resistor for each string calculates based on the total string voltage drop.
2. Component Selection: Specify LEDs from the same Luminous Intensity bin (e.g., all from T1 bin: 280-355 mcd) and the same Dominant Wavelength bin (e.g., all AC bin) to ensure visual consistency.
3. Layout: Place LEDs symmetrically on the PCB. Ensure the recommended pad geometry is used to promote reliable soldering and consistent alignment.

11. Technology Introduction

11.1 InGaN Semiconductor Technology

This LED uses an Indium Gallium Nitride (InGaN) active layer. By varying the ratio of indium to gallium in the crystal lattice, the bandgap of the semiconductor can be tuned, which directly determines the wavelength (color) of the emitted light. InGaN is the prevalent material for producing high-efficiency blue, green, and white LEDs (the latter using a blue LED with a phosphor coating). The 0603 package houses the tiny semiconductor die, wire bonds, and a molded epoxy lens that protects the die and shapes the light output.

12. Industry Trends

12.1 Miniaturization and Integration

The trend in SMD LEDs continues toward smaller package sizes (e.g., 0402, 0201) to save board space in increasingly compact devices like smartphones, wearables, and ultra-thin displays. Furthermore, there is growth in integrated LED modules that combine the LED die with a driver IC, protection components, and sometimes multiple colors (RGB) in a single package, simplifying design and improving performance.

12.2 Efficiency and Reliability

Ongoing materials science and manufacturing process improvements steadily increase the luminous efficacy (lumens per watt) of LEDs, allowing for brighter output at lower power or reduced thermal load. Enhanced packaging materials and techniques also improve long-term reliability, color stability, and resistance to harsh environmental conditions like high temperature and humidity.