SMD LED LTST-C060UBKT-SA Datasheet - Size 1.6x0.8x0.6mm - Voltage 2.5-3.4V - Blue Color - English Technical Document

1. Product Overview

This document provides the complete technical specifications for the LTST-C060UBKT-SA, a surface-mount device (SMD) LED designed for automated printed circuit board (PCB) assembly. This component belongs to the 0603 package family, characterized by its miniature footprint, making it ideal for space-constrained applications across various electronic equipment.

1.1 Features

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 8mm tape wound onto 7-inch diameter reels for automated pick-and-place assembly.
• Standardized EIA package dimensions ensuring compatibility across the industry.
• Designed for compatibility with integrated circuits (I.C. compatible).
• Optimized for use with automatic placement equipment.
• Suitable for infrared (IR) reflow soldering processes.
• Preconditioned to accelerate to JEDEC Moisture Sensitivity Level 3.

1.2 Applications

The LED is suitable for a broad range of applications, including but not limited to:

• Telecommunication equipment (e.g., cordless and cellular phones).
• Office automation devices and notebook computers.
• Home appliances and indoor signboards.
• Network systems and industrial equipment.
• Status indicators and signal luminaries.
• Front panel backlighting.

2. Package Dimensions and Mechanical Information

The LTST-C060UBKT-SA utilizes a standard 0603 package. The lens color is water clear, and the light source is based on InGaN (Indium Gallium Nitride) technology, emitting blue light.

• All dimensions are provided in millimeters (mm).
• The standard tolerance for dimensions is ±0.2 mm unless otherwise specified in the detailed mechanical drawing (refer to the original datasheet for the drawing).

3. Technical Parameters and Characteristics

3.1 Absolute Maximum Ratings

Ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these values may cause permanent damage.

• Power Dissipation (Pd): 102 mW
• Peak Forward Current (I_F(PEAK)): 80 mA (at 1/10 duty cycle, 0.1ms pulse width)
• Continuous Forward Current (I_F): 30 mA DC
• Operating Temperature Range: -40°C to +85°C
• Storage Temperature Range: -40°C to +100°C

3.2 Electrical and Optical Characteristics

Characteristics are measured at Ta=25°C under the defined test conditions.

Measurement Notes:

1. Luminous intensity is measured with a filter approximating the CIE photopic eye-response curve.
2. The viewing angle (2θ_1/2) is the full angle where intensity drops to half its axial value.
3. Dominant wavelength defines the perceived color. Tolerance is ±1 nm.
4. Forward voltage tolerance is ±0.1 V.
5. The device is not designed for reverse bias operation; the reverse current test is for quality inspection only.

3.3 Suggested IR Reflow Profile

For lead-free soldering processes, a reflow profile compliant with J-STD-020B is recommended. The profile typically includes a preheat stage, a thermal soak, a reflow zone with a peak temperature not exceeding 260°C, and a cooling phase. The exact time-temperature curve should be characterized for the specific PCB assembly.

4. Binning Code System

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

4.1 Luminous Intensity (I_V) Bins

Binned at I_F = 10mA. Tolerance within each bin is ±11%.

4.2 Forward Voltage (V_F) Bins

Binned at I_F = 10mA. Tolerance within each bin is ±0.1 V.

4.3 Dominant Wavelength (λ_d) Bins

Binned at I_F = 10mA. Tolerance within each bin is ±1 nm.

5. Performance Curve Analysis

The datasheet includes typical characteristic curves which are essential for design analysis. These curves graphically represent the relationship between key parameters under varying conditions.

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a sub-linear manner, aiding in drive current selection for desired brightness.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the thermal derating of light output, which is crucial for applications with high ambient temperatures.
• Forward Voltage vs. Forward Current: Illustrates the diode's IV characteristic, important for calculating power dissipation and designing current-limiting circuits.
• Spectral Distribution: Depicts the relative radiant power versus wavelength, centered around the typical 465 nm peak, defining the blue color purity.

Designers should consult these curves to understand device behavior beyond the typical point specifications, especially for operation outside standard test conditions.

6. Assembly and Handling Guidelines

6.1 Cleaning

Unspecified chemicals may damage the LED package. If cleaning is necessary, use ethyl alcohol or isopropyl alcohol at room temperature. Immersion time should be less than one minute.

6.2 Recommended PCB Pad Layout

A land pattern design is provided for infrared or vapor phase reflow soldering. Adherence to this pattern is critical for proper soldering and mechanical stability. A stencil thickness of 0.10mm maximum is suggested for solder paste application.

6.3 Soldering Process

Reflow Soldering: Maximum peak temperature 260°C, with pre-heat at 150-200°C for up to 120 seconds. Total time above liquidus and at peak temperature must be controlled to prevent thermal damage.
Hand Soldering (Iron): Use a tip temperature not exceeding 300°C, with a soldering time of 3 seconds maximum per joint. This should be performed only once.
Note: The optimal profile depends on the specific board assembly; the provided values are guidelines.

6.4 Storage Conditions

• Sealed Package: Store at ≤30°C and ≤70% RH. Use within one year from the date the moisture-proof bag is opened.
• Opened Package: Store at ≤30°C and ≤60% RH. Components should be reflowed within 168 hours (7 days) of exposure. For longer storage, use a sealed container with desiccant or a nitrogen atmosphere.
• Rebaking: LEDs exposed for more than 168 hours require baking at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Packaging Specifications

The LEDs are supplied in a tape-and-reel format compatible with automated assembly equipment.

• Tape: 8mm wide carrier tape.
• Reel: 7-inch (178mm) diameter.
• Packing Quantity: 4000 pieces per full reel.
• Minimum Order Quantity (MOQ): 500 pieces for remainder reels.
• The packaging conforms to EIA-481 specifications. Empty pockets are sealed with cover tape.

Detailed dimensional drawings for the tape pocket and the reel are provided in the original datasheet for feeder and handling equipment setup.

8. Application Notes and Cautions

8.1 Intended Use

This LED is designed for standard commercial and industrial electronic equipment. It is not rated for safety-critical applications where failure could jeopardize life or health (e.g., aviation, medical life-support). For such applications, consultation with the manufacturer is mandatory to assess suitability and potential need for higher reliability screening.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant-current driver to limit the forward current to the maximum rated DC value (30 mA) or lower for desired brightness and longevity.
• Thermal Management: While power dissipation is low, ensure adequate PCB copper area or thermal vias if operating at high currents or in high ambient temperatures to maintain junction temperature within limits.
• ESD Protection: Although not explicitly stated as sensitive, standard ESD handling precautions for semiconductor devices are recommended during assembly.
• Polarity: The LED is a diode and must be connected with correct polarity. The package has a marking (typically a notch or a green marking on the cathode side) for identification.

8.3 Technical Comparison and Trends

The 0603 package represents a mature and widely adopted footprint in the SMD LED market. The use of InGaN technology for blue emission is standard. Key differentiators for this part include its specific binning structure for color and intensity consistency, its compliance with lead-free reflow profiles, and its moisture sensitivity level (MSL 3). Compared to larger packages, the 0603 offers minimal space consumption but may have slightly lower maximum current handling and light output than larger counterparts like 0805 or 1206 LEDs. The industry trend continues towards miniaturization, increased efficiency (lumens per watt), and tighter color control.