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SMD LED 0603 Blue Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 2.65-3.15V - Power 76mW - English Technical Document

Complete technical datasheet for a 0603 package blue SMD LED. Includes detailed specifications, optical characteristics, binning codes, soldering guidelines, and application notes.
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PDF Document Cover - SMD LED 0603 Blue Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 2.65-3.15V - Power 76mW - English Technical Document

1. Product Overview

This document details the specifications for a compact, high-performance blue Surface Mount Device (SMD) Light Emitting Diode (LED) in the industry-standard 0603 package. This component is designed for modern electronic assembly processes, offering compatibility with automated placement equipment and infrared reflow soldering. Its primary applications include status indicators, backlighting for small displays, and decorative lighting in consumer electronics, communication devices, and office equipment. The LED features a water-clear lens for optimal light output and is constructed using InGaN (Indium Gallium Nitride) technology, which is known for efficient blue light emission.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The device is rated for a maximum continuous forward current (DC) of 20 mA. Under pulsed conditions with a 1/10 duty cycle and 0.1ms pulse width, it can handle a peak forward current of up to 100 mA. The maximum power dissipation is 76 mW. The operating temperature range is specified from -20°C to +80°C, while the storage temperature range extends from -30°C to +100°C. A key reliability feature is its high electrostatic discharge (ESD) threshold of 8000 V, tested according to the Human Body Model (HBM), making it robust against handling during assembly.

2.2 Electrical & Optical Characteristics

The core performance is defined at a standard test current of 5mA and an ambient temperature of 25°C. The luminous intensity typically ranges from 9.0 to 36.0 millicandelas (mcd). The device exhibits a very wide viewing angle (2θ1/2) of 130 degrees, providing broad, even illumination. The peak emission wavelength (λP) is centered at 468 nm, with a dominant wavelength (λd) specification between 465.0 nm and 470.0 nm, defining its blue color point. The spectral line half-width (Δλ) is approximately 25 nm. The forward voltage (VF) ranges from 2.65 V to 3.15 V at 5mA. A reverse voltage (VR) of 0.60 V to 1.20 V is noted under a test condition of 10mA reverse current; however, the device is not designed for operation in reverse bias.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. This product uses a multi-parameter binning system.

3.1 Luminous Intensity Binning

At the standard test condition of 5mA, luminous intensity is categorized into bins from K2 (9.0-11.2 mcd) to N1 (28.0-36.0 mcd). A separate binning at 20mA includes codes like P (45.0-71.0 mcd) and Q (71.0-112.0 mcd). A tolerance of ±15% applies within each intensity bin.

3.2 Dominant Wavelength Binning

The dominant wavelength, which defines the perceived color, is tightly controlled. All units fall within the \"AC\" bin, covering 465.0 nm to 470.0 nm, with a tolerance of ±1 nm for each unit within this range.

3.3 Forward Voltage Binning

Forward voltage is binned in 0.1V steps from Bin 1 (2.65-2.75V) to Bin 5 (3.05-3.15V) at 5mA. This allows designers to select LEDs with consistent electrical characteristics for current-limiting circuit design.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 6 for viewing angle), their analysis is crucial. The relationship between forward current (IF) and luminous intensity (IV) is typically super-linear, meaning brightness increases more than proportionally with current up to a point. The forward voltage (VF) has a negative temperature coefficient, decreasing slightly as the junction temperature rises. The spectral distribution curve shows a single peak around 468 nm, confirming the monochromatic blue output. The wide, lambertian-like radiation pattern indicated by the 130-degree viewing angle is ideal for applications requiring wide-area illumination rather than a focused beam.

5. Mechanical & Package Information

The LED is housed in an EIA-standard 0603 package. The dimensions are approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height (tolerance ±0.10mm). The package features a water-clear lens. Polarity is indicated by the cathode mark, which is typically a green stripe or a notch on the component body. Detailed dimensional drawings, including suggested soldering pad layouts, are provided to ensure proper PCB footprint design for reliable soldering and mechanical stability.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The component is compatible with infrared (IR) reflow soldering processes, including lead-free (Pb-free) assemblies. A suggested reflow profile is provided, with a peak temperature not exceeding 260°C for a maximum of 10 seconds. A pre-heat stage is recommended. Due to variations in board design, paste, and oven type, the profile should be characterized for the specific application.

6.2 Cleaning

If cleaning is necessary after soldering, only specified solvents should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is acceptable. Unspecified chemicals may damage the package material.

6.3 Storage & Handling

For unopened moisture-proof packaging with desiccant, LEDs should be stored at ≤30°C and ≤90% RH and used within one year. Once opened, the storage environment should not exceed 30°C and 60% RH. Components exposed beyond 672 hours (28 days) should be baked at approximately 60°C for at least 20 hours before soldering to prevent \"popcorning\" or delamination due to moisture absorption. ESD precautions are critical; use wrist straps and grounded equipment.

7. Packaging & Ordering Information

The LEDs are supplied in industry-standard packaging for automated assembly. They are mounted on 8mm wide carrier tape and wound onto 7-inch (178mm) diameter reels. Each full reel contains 3000 pieces. A minimum packing quantity of 500 pieces is available for remainder orders. The packaging conforms to ANSI/EIA 481-1-A-1994 specifications. The part number LTST-C170ZBKT-5A encodes the specific characteristics: package type, color (Blue), and likely the intensity/voltage bin codes (K, T, 5A).

8. Application Recommendations

8.1 Typical Application Scenarios

This LED is ideal for status indicators on consumer electronics (phones, routers, chargers), backlighting for small LCDs or keypads, and decorative accent lighting in various devices. Its small size makes it suitable for space-constrained designs.

8.2 Design Considerations

A current-limiting resistor is mandatory in series with the LED. The value should be calculated based on the supply voltage, the LED's forward voltage (using the max value from the bin for reliability), and the desired operating current (not to exceed 20mA DC). For uniform brightness in arrays, select LEDs from the same intensity and wavelength bins. Consider the thermal environment, as exceeding the maximum junction temperature can reduce lifespan and light output.

9. Technical Comparison & Differentiation

Compared to older technology like GaP LEDs, this InGaN-based blue LED offers superior efficiency and color purity. Within the 0603 blue LED segment, its key differentiators are the very high 8000V ESD protection, which enhances assembly yield and field reliability, and the wide 130-degree viewing angle. The comprehensive binning system allows for high-precision color matching in critical applications.

10. Frequently Asked Questions (FAQ)

Q: Can I drive this LED at 20mA continuously?

A: Yes, 20mA is the maximum rated continuous DC forward current. For longest lifetime, operating at a lower current (e.g., 5-10mA) is often sufficient and recommended.

Q: What is the difference between peak wavelength and dominant wavelength?

A: Peak wavelength is the point of highest power in the spectral output curve (468 nm here). Dominant wavelength is the single wavelength perceived by the human eye, calculated from the color coordinates (465-470 nm here). Dominant wavelength is more relevant for color specification.

Q: Is a heat sink required?

A: For typical operation at or below 20mA in a normal ambient environment, a dedicated heat sink is not required for the 0603 package. However, PCB layout should provide adequate copper area for heat dissipation.

Q: Can I use this for reverse voltage indication?

A: No. The device has a very low reverse breakdown voltage (0.6-1.2V) and is not designed for reverse bias operation. It must be protected from reverse voltage conditions.

11. Practical Design Case Study

Consider designing a battery-powered device with a blue power indicator. Using a 3.3V supply, targeting an LED current of 5mA, and assuming a worst-case forward voltage of 3.15V (Bin 5), the required series resistor is R = (V_supply - Vf) / I = (3.3V - 3.15V) / 0.005A = 30 Ohms. A standard 33 Ohm resistor would be suitable, resulting in a slightly lower current. This ensures the LED operates within specification even with supply voltage tolerances and component variations.

12. Technology Principle Introduction

This LED utilizes an InGaN semiconductor material system. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region. Their recombination releases energy in the form of photons (light). The specific bandgap energy of the InGaN alloy determines the wavelength of the emitted light, which in this case is in the blue spectrum (~465-470 nm). The water-clear epoxy lens encapsulates the semiconductor chip, provides mechanical protection, and shapes the light output pattern.

13. Technology Trends

The trend in SMD LEDs like the 0603 package continues towards higher efficiency (more light output per mA), improved color consistency through tighter binning, and enhanced reliability features like higher ESD ratings. There is also ongoing development in miniaturization (e.g., 0402 and 0201 packages) and in integrating multiple color chips (RGB) into a single package. The drive for energy efficiency across all electronics supports the adoption of such low-power, long-life indicator solutions.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.