SMD LED 12-11 Blue Datasheet - Size 1.2x1.0x0.6mm - Voltage 2.7-3.2V - Power 40mW - English Technical Document

1. Product Overview

The 12-11/BHC-ZL1M2QY/2C is a compact, surface-mount blue LED designed for modern electronic applications requiring high-density component placement. This device utilizes InGaN (Indium Gallium Nitride) semiconductor technology to produce blue light with a typical dominant wavelength of 468 nm. Its primary advantage lies in its miniature 12-11 package footprint, which is significantly smaller than traditional leaded LEDs, enabling designers to reduce overall board size and create more compact end products.

The core advantages of this component include its compatibility with standard automated pick-and-place assembly equipment and standard infrared (IR) or vapor phase reflow soldering processes. This makes it suitable for high-volume manufacturing. It is a mono-color (blue) device and is manufactured to be Pb-free, compliant with the EU RoHS and REACH directives, and meets halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The small size and lightweight nature make it ideal for space-constrained and portable applications.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

Operating the device beyond these limits may cause permanent damage. The absolute maximum ratings are specified at an ambient temperature (Ta) of 25°C.

• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can damage the LED's semiconductor junction.
• Continuous Forward Current (IF): 10 mA. This is the maximum DC current that can be applied continuously.
• Peak Forward Current (IFP): 100 mA. This is permissible only under pulsed conditions with a duty cycle of 1/10 at 1 kHz. It is crucial for applications requiring brief, high-intensity flashes.
• Power Dissipation (Pd): 40 mW. This is the maximum power the package can dissipate as heat, calculated as Forward Voltage (VF) multiplied by Forward Current (IF).
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. This rating indicates the LED's sensitivity to static electricity; proper ESD handling procedures are mandatory.
• Operating Temperature (Topr): -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature (Tstg): -40°C to +90°C.
• Soldering Temperature (Tsol): For reflow soldering, the peak temperature should not exceed 260°C for a maximum of 10 seconds. For hand soldering, the iron tip temperature should be below 350°C for a maximum of 3 seconds per terminal.

2.2 Electro-Optical Characteristics

The typical performance is measured at Ta=25°C with a forward current (IF) of 5 mA, which is the standard test condition.

• Luminous Intensity (Iv): Ranges from a minimum of 11.5 mcd to a maximum of 28.5 mcd. The specific value is determined by the bin code (L1, L2, M1, M2). The tolerance is ±11%.
• Viewing Angle (2θ1/2): 120 degrees. This wide viewing angle makes the LED suitable for applications requiring broad illumination or visibility from multiple angles.
• Peak Wavelength (λp): Typically 468 nm. This is the wavelength at which the spectral power distribution is maximum.
• Dominant Wavelength (λd): Ranges from 465.0 nm to 475.0 nm, binned into codes X (465-470 nm) and Y (470-475 nm). Tolerance is ±1 nm. This is the wavelength perceived by the human eye.
• Spectral Bandwidth (Δλ): Typically 25 nm. This defines the width of the emitted spectrum at half its maximum intensity (Full Width at Half Maximum - FWHM).
• Forward Voltage (VF): Ranges from 2.7 V to 3.2 V at IF=5mA, binned into codes 29 to 33. Tolerance is ±0.05V. This parameter is critical for designing the current-limiting circuit.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted (binned) based on key optical and electrical parameters. This allows designers to select components that meet specific application requirements for brightness and color.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins based on their measured luminous intensity at 5 mA:
- L1: 11.5 - 14.5 mcd
- L2: 14.5 - 18.0 mcd
- M1: 18.0 - 22.5 mcd
- M2: 22.5 - 28.5 mcd
The product code "M2" in "BHC-ZL1M2QY/2C" indicates this device belongs to the M2 intensity bin.

3.2 Dominant Wavelength Binning

LEDs are sorted into two wavelength bins to control the shade of blue:
- X: 465 - 470 nm (shorter wavelength, slightly more violet-blue)
- Y: 470 - 475 nm (longer wavelength, slightly more cyan-blue)
The product code "QY" indicates this device belongs to the Y wavelength bin.

3.3 Forward Voltage Binning

LEDs are also binned by forward voltage drop to aid in circuit design, especially for parallel connections or precise power management:
- 29: 2.70 - 2.80 V
- 30: 2.80 - 2.90 V
- 31: 2.90 - 3.00 V
- 32: 3.00 - 3.10 V
- 33: 3.10 - 3.20 V
The "2C" in the part number likely corresponds to a specific voltage bin, though the exact mapping should be confirmed with the manufacturer's detailed bin code guide.

4. Performance Curve Analysis

While the PDF references typical electro-optical characteristic curves, the specific graphs are not provided in the text. Based on standard LED behavior, the following curves are typically analyzed:

• Current vs. Voltage (I-V) Curve: Shows the exponential relationship between forward current and forward voltage. The curve will have a turn-on voltage around 2.7V and a relatively steep slope in the operating region, highlighting the need for current regulation.
• Luminous Intensity vs. Forward Current (Iv-IF): This curve is generally linear at lower currents but may show saturation or efficiency droop at higher currents, emphasizing why operation within the specified 10 mA limit is important.
• Luminous Intensity vs. Ambient Temperature (Iv-Ta): LED light output typically decreases as ambient temperature increases. Understanding this derating is crucial for applications operating in high-temperature environments.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing a peak at ~468 nm and a FWHM of ~25 nm, confirming the monochromatic blue output.

5. Mechanical and Package Information

5.1 Package Dimensions

The 12-11 SMD LED has a compact rectangular package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:
- Package Length: Approximately 1.2 mm (inferred from "12-11" naming).
- Package Width: Approximately 1.0 mm.
- Package Height: Approximately 0.6 mm.
- Electrode pad dimensions and spacing are designed for reliable solder joint formation. The cathode is marked for polarity identification, which is essential for correct orientation during assembly.

5.2 Polarity Identification

A clear cathode mark is present on the package. Correct polarity must be observed during PCB layout and assembly to ensure proper function and prevent damage from reverse bias.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

The device is compatible with lead-free (Pb-free) reflow soldering processes. The recommended temperature profile is critical to prevent thermal damage:
- Pre-heating: 150-200°C for 60-120 seconds.
- Ramp-up Rate: Maximum 3°C/second to the peak temperature.
- Time Above Liquidus (217°C): 60-150 seconds.
- Peak Temperature: Maximum 260°C.
- Time Within 5°C of Peak: Maximum 10 seconds.
- Time Above 255°C: Maximum 30 seconds.
- Cooling Rate: Maximum 6°C/second.
Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:
- Use a soldering iron with a tip temperature below 350°C.
- Limit contact time to a maximum of 3 seconds per terminal.
- Use an iron with a power rating of 25W or less.
- Allow a minimum 2-second interval between soldering each terminal to manage heat input.
- Avoid applying mechanical stress to the LED body during or after soldering.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant to prevent moisture absorption, which can cause "popcorning" during reflow.
- Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
- After Opening: The "floor life" is 1 year at ≤30°C and ≤60% RH. Unused components should be resealed in a moisture-proof bag.
- Baking: If the desiccant indicator shows moisture absorption or the storage time is exceeded, bake the LEDs at 60 ±5°C for 24 hours before use.

7. Packaging and Ordering Information

The LEDs are supplied on embossed carrier tape for automated assembly.
- Tape Width: 8 mm.
- Reel Size: 7-inch diameter.
- Quantity per Reel: 2000 pieces.
The reel label includes critical information: Customer Part Number (CPN), Manufacturer Part Number (P/N), Quantity (QTY), and the bin codes for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF).

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for backlighting indicators, switches, symbols, and small LCD displays in consumer electronics, automotive dashboards, and industrial control panels.
• Status Indicators: Perfect for power, connectivity, or function status indicators in telecommunications equipment (phones, faxes), computer peripherals, and networking devices.
• General Purpose Illumination: Suitable for any application requiring a compact, reliable, low-power blue light source.

8.2 Design Considerations

• Current Limiting: An external current-limiting resistor is absolutely mandatory. The LED's forward voltage has a negative temperature coefficient, meaning it decreases as temperature rises. Without a resistor, a small increase in voltage can lead to a large, potentially destructive, increase in current (thermal runaway). The resistor value can be calculated using Ohm's Law: R = (Vsupply - VF) / IF.
• Thermal Management: While the power is low, ensure the PCB layout does not trap heat around the LED, especially if multiple LEDs are used closely together or if the ambient temperature is high.
• ESD Protection: Implement ESD protection measures in the handling and assembly process, as the device is rated for 2000V HBM.
• Repair: Avoid repairing soldered LEDs. If absolutely necessary, use a specialized double-head soldering iron to simultaneously heat both terminals and lift the component without twisting, which can damage the internal bonds.

9. Technical Comparison and Differentiation

The primary differentiation of the 12-11 LED lies in its package size. Compared to larger SMD LEDs (e.g., 3528, 5050) or through-hole LEDs, it offers a significant reduction in footprint and height, enabling ultra-miniaturization. Compared to other 1206-sized LEDs, its specific binning for intensity (M2), wavelength (Y), and voltage provides predictable performance for designers requiring consistency. Its compliance with modern environmental standards (RoHS, REACH, Halogen-Free) is also a key advantage for products targeting global markets.

10. Frequently Asked Questions (FAQs)

Q: Why is a current-limiting resistor necessary?
A: LEDs are current-driven devices, not voltage-driven. Their I-V characteristic is exponential. A resistor in series sets a fixed operating current, preventing thermal runaway and ensuring stable, long-term operation within the specified limits.

Q: Can I drive this LED directly from a 3.3V or 5V logic supply?
A: No. You must always use a series resistor. For a 3.3V supply and a target current of 5mA with a VF of 3.0V, the resistor would be R = (3.3V - 3.0V) / 0.005A = 60 Ohms. Always use the maximum VF from the bin to calculate the worst-case resistor value.

Q: What does the "12-11" in the part name signify?
A: It typically refers to the package dimensions in tenths of a millimeter: 1.2 mm long by 1.0 mm wide. The height is a separate parameter.

Q: How do I interpret the bin codes on the reel label?
A: The CAT, HUE, and REF codes correspond to the Luminous Intensity, Dominant Wavelength, and Forward Voltage bins described in sections 3.1, 3.2, and 3.3. These ensure you receive LEDs with the specific performance characteristics you ordered.

11. Practical Design Case

Scenario: Designing a compact status indicator for a USB device. The device runs on 5V USB power and requires a clearly visible blue indicator.

Design Steps:
1. Component Selection: Choose the 12-11/BHC-ZL1M2QY/2C LED for its small size and bright blue output (M2 bin).
2. Current Setting: Decide on an operating current. For a status indicator, 5mA (the test condition) provides good visibility without excessive power draw.
3. Resistor Calculation: Use the maximum VF from the voltage bin (e.g., 3.2V for bin 33) for a robust design. R = (5.0V - 3.2V) / 0.005A = 360 Ohms. The nearest standard value is 360Ω or 390Ω. Using 390Ω gives a slightly lower, safe current: I = (5.0V - 3.2V) / 390Ω ≈ 4.6 mA.
4. PCB Layout: Place the 1206 footprint resistor adjacent to the LED's anode pad. Ensure the cathode pad is correctly oriented to the PCB's cathode marking.
5. Assembly: Follow the reflow soldering profile in section 6.1. The small size allows placement very close to other components, saving board space.

12. Operating Principle

This LED is a semiconductor photonic device. It is based on an InGaN (Indium Gallium Nitride) heterostructure. When a forward voltage exceeding the diode's turn-on voltage (~2.7V) is applied, electrons and holes are injected into the active region from the n-type and p-type semiconductor layers, respectively. These charge carriers recombine radiatively, releasing energy in the form of photons. The specific composition of the InGaN alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, blue light with a peak around 468 nm. The water-clear resin encapsulant protects the semiconductor die and acts as a lens, shaping the 120-degree viewing angle.

13. Technology Trends

The development of SMD LEDs like the 12-11 package follows broader trends in electronics: miniaturization, increased efficiency, and enhanced reliability. The use of InGaN technology for blue LEDs was a foundational achievement in solid-state lighting, enabling white LEDs (via phosphor conversion) and full-color displays. Current trends in the industry include pushing for even higher luminous efficacy (more light output per watt), improved color consistency through tighter binning, and the development of novel package formats for specialized applications like mini-LED and micro-LED displays. The environmental compliance (Pb-free, halogen-free) highlighted in this datasheet reflects the industry-wide shift towards more sustainable manufacturing processes.

14. Application Restrictions Disclaimer

This product is designed for general commercial and industrial applications. It is not specifically designed or qualified for high-reliability applications where failure could lead to personal injury, loss of life, or significant property damage. Such applications include, but are not limited to:
- Military and aerospace systems (e.g., flight controls).
- Automotive safety and security systems (e.g., airbag controls, braking systems).
- Life-supporting or life-critical medical equipment.
For use in these or any other application outside the published specifications, consultation with the component manufacturer is essential to determine if a different, specially qualified product is required.