SMD LED 16-213/BHC-ZL1M2QY/3T Datasheet - 1.6x0.8mm - 3.2V - 110mW - Blue - English Technical Documentation

1. Product Overview

The 16-213/BHC-ZL1M2QY/3T is a surface-mount device (SMD) light-emitting diode (LED) utilizing a blue InGaN semiconductor chip. This component is designed for modern, high-density electronic assemblies where space and weight are critical constraints. Its primary value proposition lies in enabling miniaturization of end products while maintaining reliable optical performance.

The LED is packaged on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with automated pick-and-place assembly equipment. This compatibility streamlines high-volume manufacturing processes. The device is constructed with lead-free (Pb-free) materials and complies with the European Union's Restriction of Hazardous Substances (RoHS) directive, Registration, Evaluation, Authorisation and Restriction of Chemicals (REACH) regulation, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It is qualified for use with both infrared and vapor phase reflow soldering processes.

2. Technical Parameter Deep-Dive

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed and should be avoided in circuit design.

• Reverse Voltage (V_R): 5 V. Exceeding this voltage in the reverse-biased direction can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA. This is the maximum DC current recommended for reliable long-term operation.
• Peak Forward Current (I_FP): 100 mA. This pulsed current rating (at a 1/10 duty cycle, 1 kHz) is for brief transient conditions, not continuous operation.
• Power Dissipation (P_d): 110 mW. This is the maximum allowable power loss (V_F * I_F) within the device at 25°C ambient temperature. Derating is necessary at higher temperatures.
• Electrostatic Discharge (ESD) Withstand: 150 V (Human Body Model). Proper ESD handling procedures are essential during assembly and handling.
• Operating Temperature (T_opr): -40°C to +85°C. The device is functional across this broad industrial temperature range.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature (T_sol): The package can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These parameters are typically measured at an ambient temperature (T_a) of 25°C and a forward current (I_F) of 5 mA, unless otherwise specified. They define the core light output and electrical performance.

• Luminous Intensity (I_v): Ranges from a minimum of 11.5 mcd to a maximum of 28.5 mcd. The typical value falls within this range. A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): Approximately 120 degrees. This is the full angle at which the luminous intensity is half of the peak intensity measured at 0 degrees (on-axis).
• Peak Wavelength (λ_p): Typically 468 nm. This is the wavelength at which the spectral power distribution reaches its maximum.
• Dominant Wavelength (λ_d): Ranges from 465 nm to 475 nm. This is the single wavelength perceived by the human eye, defining the color. A tolerance of ±1 nm applies.
• Spectral Bandwidth (Δλ): Typically 25 nm. This is the full width at half maximum (FWHM) of the emission spectrum, indicating color purity.
• Forward Voltage (V_F): Ranges from 2.7 V to 3.2 V at I_F = 5mA. A tolerance of ±0.05V applies. This is the voltage drop across the LED when conducting current.
• Reverse Current (I_R): Maximum of 50 μA when a reverse bias of 5 V is applied.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into performance bins based on key parameters. This allows designers to select parts that meet specific application requirements.

3.1 Luminous Intensity Bins

Binned at I_F = 5 mA. Codes L1, L2, M1, M2 represent increasing levels of light output.

• L1: 11.5 – 14.5 mcd
• L2: 14.5 – 18.0 mcd
• M1: 18.0 – 22.5 mcd
• M2: 22.5 – 28.5 mcd

3.2 Dominant Wavelength Bins

Binned at I_F = 5 mA. Defines the precise shade of blue.

• X: 465 – 470 nm
• Y: 470 – 475 nm

3.3 Forward Voltage Bins

Binned at I_F = 5 mA. Important for designing current-limiting circuits and managing power consumption.

• 29: 2.7 – 2.8 V
• 30: 2.8 – 2.9 V
• 31: 2.9 – 3.0 V
• 32: 3.0 – 3.1 V
• 33: 3.1 – 3.2 V

4. Performance Curve Analysis

The datasheet provides several characteristic curves measured at T_a=25°C, offering insight into performance under varying conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between current and voltage. The operating point for a given current (e.g., 5mA, 20mA) can be determined from this graph, which is crucial for selecting an appropriate current-limiting resistor or driver circuit.

4.2 Luminous Intensity vs. Forward Current

The light output increases with forward current, but the relationship is not perfectly linear, especially at higher currents. This graph helps designers understand the efficiency trade-off when driving the LED at different current levels.

3.3 Luminous Intensity vs. Ambient Temperature

LED light output decreases as the junction temperature rises. This derating curve is critical for applications operating in elevated ambient temperatures. It shows the relative luminous intensity dropping as temperature increases from -40°C to +100°C.

4.4 Forward Current Derating Curve

Directly related to the power dissipation limit, this curve specifies the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating and ensure longevity, the driving current must be reduced when operating above 25°C.

4.5 Spectrum Distribution

This plot displays the relative optical power emitted across the wavelength spectrum, centered around the peak wavelength of ~468 nm with a characteristic bandwidth. It confirms the blue color emission.

4.6 Radiation Pattern

A polar diagram illustrating the spatial distribution of light intensity. The 120-degree viewing angle is visually confirmed by this pattern, showing how light is emitted in a wide Lambertian-like distribution.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED conforms to the standard 1608 (1.6mm x 0.8mm) chip LED footprint. Key dimensions include the overall length, width, and height, as well as the electrode pad spacing and size. All tolerances are typically ±0.1mm unless otherwise noted. A suggested land pattern (footprint) for PCB design is provided for reference, though designers are advised to tailor it based on their specific assembly process and reliability requirements.

5.2 Polarity Identification

The cathode is typically marked by a green tint or other visual indicator on the package itself. The datasheet should be consulted for the exact marking scheme. Correct polarity is essential for circuit operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free (Pb-free) reflow temperature profile is specified:

• Pre-heating: 150–200°C for 60–120 seconds.
• Time Above Liquidus (TAL): 60–150 seconds above 217°C.
• Peak Temperature: Maximum of 260°C, held for a maximum of 10 seconds.
• Heating Rate: Maximum 6°C/second up to 255°C.
• Cooling Rate: Maximum 3°C/second.
• Reflow Limit: The assembly should not undergo reflow soldering more than two times.

6.2 Hand Soldering

If hand soldering is necessary, the iron tip temperature must be kept below 350°C, and contact time per terminal should not exceed 3 seconds. A low-power iron (≤25W) is recommended. A cooling interval of at least 2 seconds should be allowed between soldering each terminal to prevent thermal shock.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
• After Opening: The "floor life" is 1 year under conditions of ≤30°C and ≤60% RH. Unused devices should be resealed in a moisture-proof package.
• Baking: If the desiccant indicator has changed color or the storage time is exceeded, a baking treatment of 60 ±5°C for 24 hours is required before reflow to prevent "popcorning" (package cracking due to vapor pressure).

6.4 Critical Precautions

• Current Limiting: An external current-limiting resistor or constant-current driver is mandatory. The LED's exponential I-V characteristic means a small voltage change causes a large current change, which can lead to immediate failure.
• Mechanical Stress: Avoid applying stress to the LED body during soldering or in the final assembly. Do not warp the PCB after soldering.
• Repair: Repair after soldering is not recommended. If unavoidable, a specialized dual-head soldering iron should be used to simultaneously heat both terminals, preventing mechanical stress on the solder joints. The impact on LED characteristics must be evaluated beforehand.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied on embossed carrier tape with a width of 8mm. The tape is wound onto a standard 7-inch (178mm) diameter reel. Each reel contains 3000 pieces (POS). Detailed dimensions for the carrier tape, including pocket spacing and reel hub size, are provided.

7.2 Label Explanation

The reel label contains several key codes:

• CPN: Customer's Part Number (optional).
• P/N: Manufacturer's full Part Number (e.g., 16-213/BHC-ZL1M2QY/3T).
• QTY: Packing Quantity on the reel.
• CAT: Luminous Intensity Rank (e.g., L1, M2).
• HUE: Chromaticity/Dominant Wavelength Rank (e.g., X, Y).
• REF: Forward Voltage Rank (e.g., 30, 32).
• LOT No: Traceable manufacturing lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for backlighting indicators, switches, symbols, and small LCD panels in automotive dashboards, consumer electronics, and industrial control panels.
• Status Indicators: Perfect for power, connectivity, or function status indicators in telecommunications equipment (phones, faxes), networking hardware, and computer peripherals.
• General Purpose Illumination: Suitable for any application requiring a compact, reliable, low-power blue indicator light.

8.2 Design Considerations

• Circuit Design: Always use a series resistor or constant-current driver. Calculate the resistor value using R = (V_supply - V_F) / I_F, where V_F should be chosen from the maximum bin value (e.g., 3.2V) for a conservative design.
• Thermal Management: For continuous operation at high ambient temperatures or near maximum current, consider PCB layout to aid heat dissipation. Use the derating curves to select a safe operating current.
• Optical Design: The 120-degree viewing angle provides wide visibility. For focused light, an external lens may be required. The water-clear resin package is suitable for applications where the chip color is acceptable.

9. Technical Comparison and Differentiation

The primary advantage of this 1608 package LED compared to larger leaded LEDs is its extreme miniaturization, enabling higher packing density on PCBs and ultimately smaller end products. Compared to other SMD packages, the 1608 offers a good balance between size and ease of handling during assembly. Its compliance with modern environmental regulations (RoHS, Halogen-Free) makes it suitable for global markets with strict material restrictions. The specified binning structure provides designers with predictable performance, which is critical for applications requiring consistent color and brightness across multiple units.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use with a 5V supply?

Using the maximum V_F of 3.2V and a target I_F of 5mA: R = (5V - 3.2V) / 0.005A = 360 Ω. The nearest standard higher value (e.g., 390 Ω) would provide a slightly safer current of ~4.6mA.

10.2 Can I drive this LED at 20mA continuously?

Yes, the absolute maximum rating for continuous forward current is 25 mA. However, you must consult the derating curve if the ambient temperature exceeds 25°C. At 85°C, the maximum allowable current is significantly lower. Also, driving at 20mA will produce higher light output but will reduce efficiency and increase junction temperature.

10.3 What does the "water clear" resin color mean?

It means the epoxy encapsulating the semiconductor chip is transparent, not diffused or tinted. This allows the true color of the blue InGaN chip to be seen directly, resulting in a more saturated color point but potentially making the tiny chip itself visible.

10.4 Why is the storage and baking information so important?

SMD plastic packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture can rapidly turn to steam, causing internal delamination or cracking ("popcorning"), which destroys the device. The prescribed baking removes this moisture.

11. Practical Design and Usage Case

Scenario: Designing a multi-indicator panel for a portable medical device. The device requires several blue status LEDs ("power on\