SMD LED 48-213 Blue Datasheet - Size 2.25x1.45x0.72mm - Voltage 2.7-3.2V - Power 95mW - English Technical Document

1. Product Overview

The 48-213 is a compact, surface-mount device (SMD) LED designed for modern electronic applications requiring miniaturization and high reliability. This mono-color blue LED utilizes InGaN chip technology to produce light with a typical peak wavelength of 468nm. Its primary advantages include a significantly reduced footprint compared to leaded components, enabling higher packing density on PCBs, reduced storage requirements, and ultimately contributing to smaller end-product designs. The lightweight construction further makes it ideal for portable and miniature applications.

1.1 Core Features and Compliance

• Packaging: Supplied in 8mm tape on 7-inch diameter reels, compatible with standard automatic pick-and-place equipment.
• Soldering Process: Compatible with both infrared (IR) and vapor phase reflow soldering processes.
• Environmental Compliance: The product is Pb-free (lead-free), compliant with the EU RoHS directive, and adheres to EU REACH regulations.
• Halogen-Free: Compliant with halogen-free requirements (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm).

2. Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (I_F): 25 mA.
• Peak Forward Current (I_FP): 100 mA, permissible only under pulsed conditions (duty cycle 1/10 @ 1kHz).
• Power Dissipation (P_d): 95 mW. This is the maximum allowable power the package can dissipate as heat at an ambient temperature (T_a) of 25°C.
• Electrostatic Discharge (ESD): Withstands 150V per the Human Body Model (HBM). Proper ESD handling precautions are essential.
• Temperature Range: Operating: -40°C to +85°C; Storage: -40°C to +90°C.
• Soldering Temperature: Reflow profile peak: 260°C max for 10 seconds. Hand soldering: 350°C max for 3 seconds per terminal.

2.2 Electro-Optical Characteristics (T_a=25°C)

These parameters are tested under standard conditions (I_F = 5mA) and define the device's performance.

• Luminous Intensity (I_v): Ranges from 22.5 mcd (Min) to 57.0 mcd (Max), with a typical tolerance of ±11%. The actual value is determined by the bin code (M2, N1, N2, P1).
• Viewing Angle (2θ_1/2): 120 degrees (typical). This wide angle provides a broad emission pattern suitable for backlighting and indicator applications.
• Peak Wavelength (λ_p): 468 nm (typical).
• Dominant Wavelength (λ_d): Ranges from 465 nm to 475 nm, categorized into bins Z (465-470nm) and Y (470-475nm).
• Spectral Bandwidth (Δλ): 35 nm (typical), defining the spectral purity of the blue light emitted.
• Forward Voltage (V_F): Ranges from 2.7V to 3.2V at 5mA, with a typical tolerance of ±0.05V. It is binned into groups Q29 to Q33.
• Reverse Current (I_R): Maximum 50 μA at V_R = 5V. Note: The device is tested for reverse voltage but is not intended for reverse-bias operation.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Dominant Wavelength Binning

Defines the perceived color of the LED. Two groups ensure color uniformity within an application.

Group Z: 465 nm – 470 nm

Group Y: 470 nm – 475 nm

3.2 Luminous Intensity Binning

Sorts LEDs based on their light output at 5mA.

M2: 22.5 – 28.5 mcd

N1: 28.5 – 36.0 mcd

N2: 36.0 – 45.0 mcd

P1: 45.0 – 57.0 mcd

3.3 Forward Voltage Binning

Groups LEDs by their forward voltage drop, which is critical for current-limiting resistor calculation and power supply design.

Q29: 2.7V – 2.8V

Q30: 2.8V – 2.9V

Q31: 2.9V – 3.0V

Q32: 3.0V – 3.1V

Q33: 3.1V – 3.2V

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are vital for design engineers.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This non-linear relationship shows that a small increase in voltage beyond the knee voltage results in a large increase in current. This underscores the absolute necessity of using a series current-limiting resistor or constant-current driver to prevent thermal runaway and device failure.

4.2 Luminous Intensity vs. Forward Current

The light output increases with forward current but not linearly. The curve helps designers choose an operating point that balances brightness with efficiency and device longevity.

4.3 Luminous Intensity vs. Ambient Temperature

LED light output decreases as the junction temperature rises. This curve shows the relative luminous intensity dropping as ambient temperature increases from -40°C to +100°C. Effective thermal management in the application is crucial to maintain consistent brightness.

4.4 Forward Current Derating Curve

This is one of the most critical graphs for reliability. It shows the maximum allowable continuous forward current decreasing as the ambient temperature rises above 25°C. At 85°C, the maximum allowable current is significantly reduced to prevent exceeding the maximum junction temperature and ensure long-term reliability.

4.5 Spectrum Distribution

Displays the relative radiant power across wavelengths, centered around 468nm with a typical bandwidth of 35nm. This confirms the monochromatic blue nature of the emission.

4.6 Radiation Pattern

A polar diagram illustrating the spatial distribution of light intensity, confirming the 120° viewing angle. The pattern is typically Lambertian or near-Lambertian.

5. Mechanical and Package Information

5.1 Package Dimensions

The 48-213 features a compact SMD package with the following key dimensions (in mm):

- Length: 2.25 ±0.20

- Width: 1.45 ±0.10

- Height: 0.72 ±0.10

- Lead spacing: 1.80 (between anode and cathode pads)

A cathode mark is clearly indicated on the package for correct polarity orientation during assembly.

5.2 Suggested Pad Layout

A recommended land pattern (footprint) is provided, with dimensions for the solder pads. The datasheet explicitly notes that this is for reference only and should be modified based on individual PCB design requirements, solder paste volume, and assembly process.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile (Pb-free)

A detailed temperature profile is specified:

- Preheat: 150–200°C for 60–120 seconds.

- Time above liquidus (217°C): 60–150 seconds.

- Peak Temperature: 260°C maximum, held for 10 seconds maximum.

- Heating Rate: 3°C/sec maximum up to 255°C, 6°C/sec maximum overall.

- Cooling Rate: Defined by the process.

It is critical to adhere to this profile. Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is unavoidable:

- Iron tip temperature must be less than 350°C.

- Contact time per terminal must not exceed 3 seconds.

- Soldering iron power should be less than 25W.

- Allow an interval of more than 2 seconds between soldering each terminal to prevent thermal shock.

The datasheet cautions that damage often occurs during hand soldering.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant.

- Before opening: Store at ≤30°C and ≤90% RH.

- After opening: The "floor life" is 1 year under ≤30°C and ≤60% RH. Unused devices must be resealed in a moisture-proof package.

- If the desiccant indicator changes color or storage time is exceeded, a baking treatment is required: 60 ±5°C for 24 hours before use in a reflow process.

6.4 Critical Precautions

• Current Limiting: An external current-limiting resistor is MANDATORY. The LED's exponential I-V characteristic means a small voltage change causes a large current change, leading to immediate burnout without protection.
• Mechanical Stress: Avoid applying stress to the LED body during soldering or in the final application. Do not warp the PCB after soldering.
• Repair: Repair after soldering is strongly discouraged. If absolutely necessary, use a dual-head soldering iron for simultaneous heating of both terminals to minimize thermal stress.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The device is supplied in embossed carrier tape:

- Reel Diameter: 7 inches.

- Tape Width: 8mm.

- Quantity per Reel: 3000 pieces.

Detailed dimensions for the carrier tape pockets and the reel are provided to ensure compatibility with automated feeders.

7.2 Label Explanation

The reel label contains several key identifiers:

- P/N: Product Number (e.g., 48-213/BHC-ZM2P1QY/3C).

- QTY: Packing quantity.

- CAT: Luminous Intensity Rank (e.g., M2, P1).

- HUE: Chromaticity/Dominant Wavelength Rank (e.g., Z, Y).

- REF: Forward Voltage Rank (e.g., Q29, Q33).

- LOT No.: Traceability lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch illumination, and flat backlighting for LCDs and symbols due to its wide viewing angle and compact size.
• Telecommunication Equipment: Status indicators and keypad backlighting in phones, fax machines, and other communication devices.
• General Indicator Use: Any application requiring a reliable, compact blue status indicator.

8.2 Design Considerations

• Thermal Management: While the power is low, PCB layout should still consider heat dissipation, especially in high ambient temperature environments or when driving near maximum current. Use the derating curve.
• Current Drive Circuit: Always use a constant current source or a voltage source with a series resistor. Calculate the resistor value using the maximum V_F from the bin and the desired I_F to ensure current never exceeds the absolute maximum rating.
• Optical Design: The 120° viewing angle provides wide coverage. For more focused light, external lenses or light guides may be necessary.
• ESD Protection: Implement ESD protection on input lines and ensure assembly areas are ESD-safe, as the device is rated for 150V HBM.

9. Technical Comparison and Differentiation

The 48-213 SMD LED offers several key advantages in its class:

Size Advantage: Its 2.25 x 1.45 mm footprint is significantly smaller than traditional 3mm or 5mm leaded LEDs, enabling ultra-compact designs.

Process Compatibility: Full compatibility with standard SMT reflow processes (IR and vapor phase) allows for high-volume, low-cost automated assembly, unlike through-hole LEDs which require manual or wave soldering.

Performance Consistency: The detailed binning system for wavelength, intensity, and voltage allows designers to select parts that ensure visual consistency across all units in a product, which is critical for backlighting and multi-LED arrays.

Robustness: The SMD package, when properly soldered, offers excellent mechanical stability and resistance to vibration compared to leaded parts.

10. Frequently Asked Questions (Based on Technical Parameters)

Q1: Why is a current-limiting resistor absolutely necessary?

A1: The forward voltage (V_F) has a tolerance and a negative temperature coefficient. A slight increase in supply voltage or a decrease in V_F due to heating can cause a large, uncontrolled increase in current (thermal runaway), leading to instantaneous failure. The resistor stabilizes the current.

Q2: Can I drive this LED at 25mA continuously?

A2: You can, but only if the ambient temperature (T_a) is at or below 25°C. Refer to the Forward Current Derating Curve (Section 4.4). At higher ambient temperatures, the maximum allowable continuous current must be reduced to keep the junction temperature within safe limits.

Q3: What do the bin codes (e.g., ZM2P1QY) mean?

A3: This is a composite code. 'Z' or 'Y' indicates the dominant wavelength bin. 'M2', 'P1', etc., indicate the luminous intensity bin. 'Q29' to 'Q33' indicate the forward voltage bin. Selecting a specific bin combination ensures predictable color, brightness, and electrical behavior.

Q4: How do I interpret the "Peak" vs. "Dominant" wavelength?

A4: Peak Wavelength (λ_p) is the wavelength at which the emitted optical power is maximum (468nm typ.). Dominant Wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED (465-475nm). λ_d is more relevant for color specification.

11. Design and Usage Case Study

Scenario: Designing a multi-LED status panel for a portable medical device.

Requirements: Uniform blue backlighting for 10 membrane switches, ultra-low profile, reliable operation from -10°C to +60°C, powered from a regulated 5V rail.

Design Steps:

1. LED Selection: The 48-213 is chosen for its small size, wide viewing angle (for even backlighting), and SMD compatibility.

2. Bin Selection: To ensure uniform color and brightness, a single bin is specified for the entire order (e.g., Y-P1-Q31).

3. Current Setting: Targeting a balance of brightness and longevity, I_F is set to 10mA. From the derating curve, 10mA is safe up to ~85°C, well above the 60°C requirement.

4. Resistor Calculation: Using the worst-case (Max) V_F from bin Q31 (3.0V) and supply voltage (5V): R = (5V - 3.0V) / 0.01A = 200 Ω. A standard 200 Ω, 1/10W resistor is selected.

5. PCB Layout: The suggested pad layout is used as a starting point. A small thermal relief is added to the cathode pad to aid soldering while maintaining electrical connection. LEDs are spaced to allow even light diffusion via a light guide.

6. Assembly: The reels are loaded into pick-and-place machines. The specified Pb-free reflow profile is programmed into the oven. After reflow, no post-soldering stress is applied to the board.

12. Technical Principle Introduction

The 48-213 LED is based on a semiconductor diode structure fabricated from Indium Gallium Nitride (InGaN) materials. When a forward voltage exceeding the diode's knee voltage (approx. 2.7-3.2V) is applied, electrons and holes are injected into the active region of the semiconductor. Their recombination releases energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy, which directly corresponds to the wavelength of the emitted light—in this case, blue light around 468nm. The water-clear resin encapsulant protects the semiconductor chip and acts as a primary lens, shaping the initial radiation pattern. The SMD package provides mechanical protection, electrical connections via metalized pads, and a path for heat dissipation from the chip to the PCB.

13. Industry Trends and Context

The 48-213 represents a mature product in the evolution of SMD LEDs. The general industry trend continues towards:

Increased Efficiency: Newer chip designs and materials (like advanced InGaN structures) offer higher luminous efficacy (more light output per electrical watt), allowing either brighter displays or lower power consumption.

Miniaturization: Even smaller package footprints (e.g., 1.0x0.5mm) are becoming common for space-constrained applications like wearable technology and ultra-thin displays.

Improved Color Consistency: Tighter binning tolerances and the use of phosphor-converted white LEDs with higher Color Rendering Index (CRI) are standard for display backlighting, though this part remains a mono-color blue device.

Integrated Solutions: A growing trend is the integration of the LED driver IC, current-limiting resistors, and sometimes even control logic into a single module or package, simplifying design for end-users. The 48-213 remains a fundamental discrete component offering maximum design flexibility.