SMD LED 19-213/S2C-AP1Q2B/3T Datasheet - Brilliant Orange - 2.0x1.25x0.8mm - Forward Voltage 1.75-2.35V - Power 60mW - English Technical Document

1. Product Overview

The 19-213/S2C-AP1Q2B/3T is a surface-mount device (SMD) LED designed for high-density, miniature applications. Utilizing AlGaInP chip technology, it emits a brilliant orange light with a typical dominant wavelength of 611 nm. Its compact footprint and lightweight construction make it an ideal choice for modern electronic designs where space and weight are critical constraints.

1.1 Core Advantages

The primary advantages of this LED stem from its SMD package. It enables significantly smaller printed circuit board (PCB) designs compared to traditional lead-frame components. This leads to higher component packing density, reduced storage requirements for both the components and the final assembled products, and ultimately contributes to the miniaturization of end-user equipment. The component is also compliant with key environmental and safety standards, including RoHS, REACH, and halogen-free requirements (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

This LED is well-suited for a variety of indicator and backlighting functions. Typical application areas include dashboard and switch backlighting in automotive or industrial controls. In telecommunications, it can serve as an indicator or backlight in devices such as telephones and fax machines. It is also applicable for flat backlighting of LCDs, switches, and symbols, alongside general-purpose indicator use.

2. Technical Specifications Deep Dive

This section provides a detailed, objective analysis of the LED's key electrical, optical, and thermal parameters as defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed. Key ratings include:

• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Continuous Forward Current (IF): 25 mA.
• Peak Forward Current (IFP): 60 mA, permissible only under pulsed conditions (duty cycle 1/10 @ 1 kHz).
• Power Dissipation (Pd): 60 mW. This is the maximum allowable power loss as heat.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage).
• Soldering Temperature: Withstands reflow soldering at 260°C for 10 seconds or hand soldering at 350°C for 3 seconds.
• Electrostatic Discharge (ESD): Human Body Model (HBM) rating of 2000 V. Standard ESD handling precautions are necessary.

2.2 Electro-Optical Characteristics

Measured at a standard test condition of Ta=25°C and IF=20 mA, these parameters define the LED's performance.

• Luminous Intensity (Iv): Ranges from a minimum of 45.0 mcd to a maximum of 112.0 mcd. The actual value is determined by the binning process.
• Viewing Angle (2θ1/2): A wide 120-degree angle, providing broad, even illumination suitable for indicator applications.
• Peak Wavelength (λp): Typically 611 nm.
• Dominant Wavelength (λd): Specified between 600.5 nm and 612.5 nm, defining the perceived orange color.
• Spectral Bandwidth (Δλ): Approximately 17 nm, typical for AlGaInP LEDs.
• Forward Voltage (VF): Between 1.75 V and 2.35 V at 20 mA. This range is critical for driver circuit design.
• Reverse Current (IR): Maximum of 10 μA at VR=5V. The datasheet explicitly notes the device is not designed for reverse operation.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins. The 19-213 uses three independent binning parameters.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins (P1, P2, Q1, Q2) based on their measured luminous intensity at IF=20mA. This allows designers to select a brightness grade suitable for their application, from standard indicator (P1: 45.0-57.0 mcd) to higher brightness needs (Q2: 90.0-112.0 mcd).

3.2 Dominant Wavelength Binning

The orange color hue is controlled through dominant wavelength bins D8 through D11. Each bin covers a 3 nm range, from 600.5-603.5 nm (D8) to 609.5-612.5 nm (D11). This ensures a tightly controlled color appearance across a production batch.

3.3 Forward Voltage Binning

Forward voltage is binned into three categories (0, 1, 2). This helps in designing efficient current-limiting circuits, as knowing the VF range (e.g., Bin 0: 1.75-1.95V, Bin 2: 2.15-2.35V) allows for more precise resistor calculation to achieve the target drive current.

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are essential for understanding the LED's behavior under different operating conditions.

4.1 Spectral Distribution

The spectrum curve shows a single, dominant peak centered around 611 nm, which is characteristic of AlGaInP material. The relatively narrow bandwidth confirms the purity of the orange color output.

4.2 Radiation Pattern

The polar radiation diagram illustrates the 120-degree viewing angle. The intensity is nearly uniform across a wide central region, decaying smoothly towards the edges, which is ideal for wide-angle indicators.

4.3 Relative Luminous Intensity vs. Forward Current

This curve shows a sub-linear relationship. While output increases with current, the efficiency typically decreases at higher currents due to increased heat generation. Operating at or below the recommended 20 mA ensures optimal performance and longevity.

4.4 Relative Luminous Intensity vs. Ambient Temperature

Luminous output is inversely related to junction temperature. The curve shows output decreasing as ambient temperature rises above 25°C. This thermal derating is a critical consideration for applications in high-temperature environments.

4.5 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating and ensure reliability, the forward current must be reduced when operating at elevated ambient temperatures.

4.6 Forward Voltage vs. Forward Current (IV Curve)

The IV curve demonstrates the diode's exponential characteristic. The forward voltage increases with current. The binning ranges for VF are defined along this curve at the 20 mA test point.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD footprint. Key dimensions include a body size of approximately 2.0 mm in length, 1.25 mm in width, and 0.8 mm in height (typical for this package type, exact values should be taken from the dimension drawing). The datasheet includes a detailed dimensioned drawing with a standard tolerance of ±0.1 mm unless otherwise specified.

5.2 Polarity Identification

The cathode is typically marked on the device, often by a notch, a green dot, or a different shape on the cathode side of the lens. Correct polarity must be observed during assembly to prevent damage.

6. Soldering and Assembly Guidelines

Proper handling is crucial for reliability. The datasheet provides specific instructions.

6.1 Current Limiting

An external current-limiting resistor is mandatory. The LED's exponential IV characteristic means a small increase in voltage can cause a large, potentially destructive, increase in current.

6.2 Storage and Moisture Sensitivity

The components are packaged in a moisture-resistant bag with desiccant.

• Do not open the bag until ready for use.
• After opening, use within 168 hours (7 days) if stored at ≤30°C and ≤60% RH.
• If unused, reseal in a moisture-proof package.
• If exposure limits are exceeded, a bake-out at 60±5°C for 24 hours is required before reflow soldering.

6.3 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time above liquidus (217°C): 60-150 seconds.
• Peak temperature: 260°C maximum, held for ≤10 seconds.
• Maximum heating rate: 6°C/sec, maximum cooling rate: 3°C/sec.
• Reflow should not be performed more than twice.

6.4 Hand Soldering and Rework

If hand soldering is necessary, limit iron tip temperature to ≤350°C, apply heat to each terminal for ≤3 seconds, and use a low-power iron (<25W). For rework, a dual-head soldering iron is recommended to simultaneously heat both terminals and avoid mechanical stress. The impact of rework on LED characteristics should be verified beforehand.

7. Packaging and Ordering Information

7.1 Standard Packaging

The LEDs are supplied in 8mm wide embossed carrier tape, wound on 7-inch diameter reels. Each reel contains 3000 pieces.

7.2 Label Information

The reel label contains critical information for traceability and identification:

• CPN: Customer's part number.
• P/N: Manufacturer's part number (19-213/S2C-AP1Q2B/3T).
• QTY: Packing quantity.
• CAT: Luminous Intensity bin code (e.g., Q2).
• HUE: Chromaticity/Dominant Wavelength bin code (e.g., D10).
• REF: Forward Voltage bin code (e.g., 1).
• LOT No.: Manufacturing lot number.

8. Application Design Considerations

8.1 Driver Circuit Design

Always use a series resistor to set the forward current. Calculate the resistor value using the formula: R = (Vcc - VF) / IF, where VF should be chosen from the maximum value in the selected voltage bin to ensure current does not exceed the design target under worst-case conditions. Consider the derating curves for high-temperature operation.

8.2 Thermal Management

Although small, the LED generates heat. Ensure adequate PCB copper area or thermal vias are used, especially when driving at higher currents or in high ambient temperatures, to conduct heat away from the LED junction and maintain performance and lifespan.

8.3 Optical Integration

The wide 120-degree viewing angle makes it suitable for applications requiring broad visibility. For light guides or lenses, the radiation pattern should be considered to ensure efficient coupling and desired illumination pattern.

9. Technical Comparison and Differentiation

Compared to older through-hole LED packages, this SMD type offers a drastic reduction in size and weight, enabling modern miniaturized designs. Within the SMD orange LED segment, its key differentiators are its specific combination of AlGaInP technology (for efficient orange/red emission), the defined binning structure for color/brightness consistency, and its compliance with halogen-free and other environmental standards. The detailed derating and handling guidelines also provide designers with clear parameters for reliable implementation.

10. Frequently Asked Questions (FAQ)

10.1 What resistor value should I use with a 5V supply?

Using the worst-case VF (max of your selected bin, e.g., 2.35V from Bin 2) and a target IF of 20 mA: R = (5V - 2.35V) / 0.020A = 132.5 Ω. A standard 130 Ω or 150 Ω resistor would be appropriate, but always verify the actual current under your specific conditions.

10.2 Can I drive this LED without a current-limiting resistor?

No. The diode's IV characteristic is exponential. Connecting it directly to a voltage source, even one close to its nominal VF, will likely result in excessive current, rapid overheating, and immediate failure.

10.3 Why is there a 7-day limit after opening the moisture-proof bag?

SMD packages can absorb moisture from the atmosphere. During reflow soldering, this trapped moisture can rapidly vaporize, causing internal delamination or "popcorning," which cracks the package and destroys the device. The 168-hour floor life is the safe exposure time for this component's moisture sensitivity level.

10.4 How do I interpret the part number 19-213/S2C-AP1Q2B/3T?

While the exact corporate coding may vary, it typically references the base product (19-213), package type (SMD), and likely includes codes for the specific luminous intensity (Q2), dominant wavelength, and forward voltage bins selected for that order.

11. Design-in Case Study

Scenario: Designing a status indicator panel for an industrial controller operating in an ambient up to 60°C. Uniform orange color and consistent brightness across multiple indicators are critical.

Implementation:

1. Component Selection: Specify LEDs from a single production lot and tight bins (e.g., Q1 for intensity, D10 for wavelength) to ensure visual consistency.
2. Circuit Design: Using a 3.3V rail, calculate the series resistor. Assuming VF bin 1 (max 2.15V) and targeting 18 mA (slightly derated for temperature): R = (3.3V - 2.15V) / 0.018A ≈ 64 Ω. Use a 62 Ω or 68 Ω 1% tolerance resistor.
3. Thermal Design: Place the LED away from other heat sources on the PCB. Use a small copper pour connected to the cathode pad (typically the thermal pad) to dissipate heat, considering the 60°C ambient and consulting the forward current derating curve.
4. Assembly: Schedule PCB assembly so that the LED reel is opened and used within the 7-day window. Follow the specified reflow profile precisely.

This approach ensures reliable operation, consistent appearance, and long-term stability in the target environment.

12. Technology Principle

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, orange (~611 nm). The SMD package encapsulates the tiny semiconductor chip, provides mechanical protection, incorporates a lens to shape the light output, and offers solderable terminals for electrical connection.

13. Industry Trends

The trend in indicator and backlight LEDs continues towards higher efficiency (more light output per unit of electrical input), increased reliability, and further miniaturization. There is also a strong industry-wide push for broader compliance with environmental regulations (beyond RoHS to include substances like PFAS) and the development of even more robust packaging to withstand higher temperature soldering processes. The standardization of binning codes and detailed technical documentation, as seen in this datasheet, facilitates easier design-in and supply chain management for manufacturers.