SMD LED 19-213/R6C-AM2P1VY/3T Datasheet - Brilliant Red - 5mA - 2.2V - English Technical Document

1. Product Overview

The 19-213 is a surface-mount device (SMD) LED designed for general-purpose indicator and backlighting applications. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip to produce a brilliant red light output. This component is characterized by its compact size, which facilitates higher packing density on printed circuit boards (PCBs) and enables the design of smaller end-user equipment. The device is supplied on 8mm tape reels, making it fully compatible with automated pick-and-place assembly processes.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its miniature footprint, lightweight construction, and compliance with modern manufacturing and environmental standards. It is Pb-free, RoHS compliant, REACH compliant, and classified as halogen-free. These features make it suitable for a wide range of consumer electronics, telecommunications equipment (e.g., telephones, fax machines), automotive dashboard and switch backlighting, and general backlighting for LCDs and symbols.

2. Technical Parameter Deep Dive

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation outside these limits is not advised.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (I_F): 25mA DC. The continuous DC current should not surpass this value.
• Peak Forward Current (I_FP): 60mA. This is permissible only under pulsed conditions (duty cycle 1/10, 1kHz) to handle transient surges.
• Power Dissipation (P_d): 60mW. This is the maximum power the package can dissipate at an ambient temperature (T_a) of 25°C.
• Electrostatic Discharge (ESD): 2000V (Human Body Model). Proper ESD handling procedures are essential during assembly.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage).
• Soldering Temperature: Reflow profile peak at 260°C for max 10 seconds; hand soldering at 350°C for max 3 seconds per terminal.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of I_F = 5mA and T_a = 25°C. They define the typical performance of the device.

• Luminous Intensity (I_v): Ranges from 22.5 mcd (min) to 57.0 mcd (max), with a typical tolerance of ±11%. The actual value is determined by the bin code (M2, N1, N2, P1).
• Viewing Angle (2θ_1/2): A wide 120-degree typical angle, providing a broad emission pattern suitable for area illumination.
• Peak Wavelength (λ_p): Typically 632 nm, placing the emission in the red region of the visible spectrum.
• Dominant Wavelength (λ_d): Specified between 617.5 nm and 633.5 nm, with a tolerance of ±1 nm. This is the primary color coordinate, binned as E4 to E7.
• Spectral Bandwidth (Δλ): Typically 20 nm, indicating the spectral purity of the red light.
• Forward Voltage (V_F): Ranges from 1.70V to 2.20V at 5mA, with a tolerance of ±0.05V. It is binned from code 19 to 23. A current-limiting resistor is mandatory in series to prevent thermal runaway from minor voltage fluctuations.
• Reverse Current (I_R): Maximum 10 µA at V_R=5V. The device is not designed for operation in reverse bias.

3. Binning System Explanation

The product is sorted into bins based on key performance parameters to ensure consistency within a production lot. Designers can specify bins to meet tight application requirements.

3.1 Luminous Intensity Binning

Bins: M2 (22.5-28.5 mcd), N1 (28.5-36.0 mcd), N2 (36.0-45.0 mcd), P1 (45.0-57.0 mcd). Selecting a higher bin (e.g., P1) guarantees higher minimum brightness.

3.2 Dominant Wavelength Binning

Bins: E4 (617.5-621.5 nm), E5 (621.5-625.5 nm), E6 (625.5-629.5 nm), E7 (629.5-633.5 nm). This allows for color consistency in applications where multiple LEDs are used side-by-side.

3.3 Forward Voltage Binning

Bins: 19 (1.70-1.80V), 20 (1.80-1.90V), 21 (1.90-2.00V), 22 (2.00-2.10V), 23 (2.10-2.20V). Matching V_F bins can help achieve uniform current sharing in parallel configurations.

4. Performance Curve Analysis

While specific graphs are not detailed in the provided text, typical curves for such an LED would include:

• I-V (Current-Voltage) Curve: Shows the exponential relationship between forward voltage and current. The knee voltage is around 1.7-2.2V.
• Luminous Intensity vs. Forward Current: Intensity increases with current but may saturate at higher currents due to thermal effects.
• Luminous Intensity vs. Ambient Temperature: Intensity typically decreases as ambient temperature rises, a critical factor for thermal management.
• Spectral Distribution: A plot showing the relative radiant power versus wavelength, centered around 632 nm with a ~20 nm bandwidth.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED comes in a standard SMD package. The dimensional drawing specifies the length, width, height, pad sizes, and their positions with a typical tolerance of ±0.1mm. Correct pad layout is crucial for reliable soldering and mechanical stability.

5.2 Polarity Identification

The cathode is typically marked on the device body or indicated in the footprint diagram. Correct orientation is essential for circuit operation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free reflow profile is recommended: Preheat at 150-200°C for 60-120s, time above 217°C (liquidus) for 60-150s, peak temperature at 260°C max for 10 seconds max. The maximum heating rate should be 6°C/s and cooling rate 3°C/s. Reflow should not be performed more than twice.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron with a tip temperature below 350°C, applying heat to each terminal for no more than 3 seconds. Use a low-power iron (<25W) and allow a cooling interval of at least 2 seconds between terminals to prevent thermal damage.

6.3 Storage and Moisture Sensitivity

The components are packaged in moisture-resistant bags with desiccant. Do not open the bag until ready for use. After opening, unused LEDs must be stored at ≤ 30°C and ≤ 60% RH and used within 168 hours (7 days). If exceeded, a baking treatment at 60 ± 5°C for 24 hours is required before reflow.

7. Packaging and Ordering Information

7.1 Packaging Specification

The LEDs are supplied in carrier tape on 7-inch diameter reels. Each reel contains 3000 pieces. The reel, tape, and cover tape dimensions are provided in the datasheet.

7.2 Label Explanation

The packaging label includes critical information: Product Number (P/N), quantity (QTY), and the specific bin codes for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF), along with the Lot Number.

8. Application Suggestions

8.1 Typical Application Scenarios

• Status Indicators: Power, connectivity, or mode indicators in consumer electronics and telecom devices.
• Backlighting: For membrane switches, keypads, automotive dashboard icons, and LCD panels in low-to-moderate brightness requirements.
• General Decorative Lighting: Where small size and specific red color are needed.

8.2 Design Considerations

• Current Limiting: ALWAYS use a series resistor. Calculate its value based on the supply voltage (V_supply), the LED's forward voltage (V_F from its bin), and the desired forward current (I_F, not to exceed 25mA). R = (V_supply - V_F) / I_F.
• Thermal Management: Although low power, ensure adequate PCB copper area or thermal relief if operating at high ambient temperatures or near maximum current to maintain light output and longevity.
• ESD Protection: Implement ESD protection on input lines if the LED is in a user-accessible location.

9. Technical Comparison and Differentiation

Compared to older through-hole LED packages, this SMD LED offers significant space savings, better suitability for automated assembly, and potentially better thermal performance due to direct PCB attachment. Within the SMD red LED category, its key differentiators are its specific AlGaInP chip technology (offering high efficiency and brilliant red color), wide 120-degree viewing angle, and comprehensive environmental compliance (RoHS, Halogen-Free).

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Why is a series resistor mandatory?

LEDs are current-driven devices. Their V-I characteristic is exponential. A small increase in voltage beyond the knee point causes a large, potentially destructive, increase in current. A series resistor makes the current largely dependent on the resistor value and supply voltage, providing a simple and effective constant-current approximation.

10.2 Can I drive this LED with a 3.3V or 5V supply?

Yes, both are common. For a 3.3V supply and a target I_F of 5mA, with a typical V_F of 2.0V, the series resistor would be R = (3.3V - 2.0V) / 0.005A = 260 Ohms. For a 5V supply, R = (5V - 2.0V) / 0.005A = 600 Ohms. Always use the maximum V_F from the bin for a conservative design.

10.3 What does the "binning" information mean for my design?

Binning ensures consistency. If your design requires uniform brightness across multiple LEDs (e.g., in a backlight array), you should specify a tight luminous intensity bin (e.g., P1 only). Similarly, for consistent color, specify a tight dominant wavelength bin (e.g., E6 only). This may affect cost and availability.

11. Practical Design and Usage Case

Case: Designing a multi-LED status indicator panel. A designer needs 10 red indicators on a panel powered by a 5V rail. To ensure uniform brightness and color, they specify bins P1 for intensity and E6 for wavelength. Using the maximum V_F from bin 23 (2.20V) for a conservative design, and choosing I_F = 10mA for good visibility, the series resistor value is calculated: R = (5V - 2.20V) / 0.01A = 280 Ohms. The nearest standard value of 270 Ohms is selected, resulting in a slight current increase to ~10.4mA, which is still within the 25mA limit. The LEDs are placed on the PCB with the recommended footprint, and the assembly follows the specified reflow profile.

12. Operating Principle Introduction

This LED is based on a semiconductor p-n junction made of AlGaInP materials. When a forward voltage exceeding the junction's built-in potential is applied, electrons and holes are injected across the junction. Their recombination releases energy in the form of photons (light), a process called electroluminescence. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light, in this case, brilliant red (~632 nm). The water-clear resin lens helps in extracting and distributing the light.

13. Technology Trends

The general trend in indicator-type SMD LEDs is towards even smaller package sizes (e.g., 0402, 0201 metric) for ultra-compact devices, higher efficiency leading to greater luminous intensity at lower currents, and expanded color gamuts. There is also a continuous push for improved reliability under harsh conditions (higher temperature, humidity) and stricter compliance with global environmental regulations. The underlying semiconductor materials, like AlGaInP and InGaN (for blue/green), are constantly being refined for better performance and cost-effectiveness.