Table of Contents
- 1. Product Overview
- 1.1 Core Features and Compliance
- 1.2 Target Applications
- 2. Technical Specifications Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 3.3 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Relative Luminous Intensity vs. Forward Current
- 4.3 Relative Luminous Intensity vs. Ambient Temperature
- 4.4 Forward Current Derating Curve
- 4.5 Radiation Pattern and Spectrum Distribution
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 6. Soldering and Assembly Guidelines
- 6.1 Storage and Moisture Sensitivity
- 6.2 Reflow Soldering Profile
- 6.3 Hand Soldering and Rework
- 6.4 Circuit Protection
- 7. Packaging and Ordering Information
- 7.1 Reel and Tape Specifications
- 7.2 Label Explanation
- 8. Application Design Considerations
- 8.1 Driving the LED
- 8.2 Thermal Management
- 8.3 Optical Design
- 9. Technical Comparison and Positioning
- 10. Frequently Asked Questions (FAQ)
- 10.1 What is the difference between peak wavelength and dominant wavelength?
- 10.2 Why is a current-limiting resistor absolutely necessary?
- 10.3 Can I use this LED for continuous operation at 25mA?
- 10.4 How do I interpret the part number 19-213/Y2C-AP1Q2B/3T?
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 19-213/Y2C-AP1Q2B/3T is a surface-mount device (SMD) LED designed for modern electronic applications requiring compact, reliable, and efficient indicator or backlighting solutions. This component utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor technology to produce a brilliant yellow light output. Its primary advantage lies in its miniature size, which enables significant reductions in printed circuit board (PCB) footprint, higher component packing density, and ultimately contributes to the development of smaller and lighter end-user equipment. The device is constructed with a water-clear resin lens, optimizing light extraction and viewing angle.
1.1 Core Features and Compliance
The LED is packaged on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with high-speed automated pick-and-place assembly equipment. It is designed for use with standard infrared (IR) and vapor phase reflow soldering processes, ensuring seamless integration into modern manufacturing lines. The product is classified as a mono-color type. It is manufactured as a Pb-free (lead-free) component and is compliant with the European Union's RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations. Furthermore, it meets halogen-free requirements, with bromine (Br) and chlorine (Cl) content each below 900 ppm and their combined total below 1500 ppm.
1.2 Target Applications
This LED is well-suited for a variety of applications where space-saving and reliable illumination are critical. Typical use cases include backlighting for automotive dashboards and control switches, status indicators and keypad backlighting in telecommunication devices such as telephones and fax machines, flat backlighting units for liquid crystal displays (LCDs), and general-purpose indicator functions across consumer and industrial electronics.
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed. All values are specified at an ambient temperature (Ta) of 25°C.
- Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
- Continuous Forward Current (IF): 25 mA.
- Peak Forward Current (IFP): 60 mA, permissible only under pulsed conditions with a duty cycle of 1/10 and a frequency of 1 kHz.
- Power Dissipation (Pd): 60 mW. This is the maximum allowable power loss as heat.
- Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. This rating indicates the device's sensitivity to static electricity; proper ESD handling procedures are mandatory.
- Operating Temperature Range (Topr): -40°C to +85°C.
- Storage Temperature Range (Tstg): -40°C to +90°C.
- Soldering Temperature (Tsol): For reflow soldering, a peak temperature of 260°C for a maximum of 10 seconds is specified. For hand soldering, the iron tip temperature must not exceed 350°C, with contact time limited to 3 seconds per terminal.
2.2 Electro-Optical Characteristics
These parameters define the device's performance under normal operating conditions, typically measured at Ta=25°C and a forward current (IF) of 20 mA, unless otherwise stated.
- Luminous Intensity (Iv): Ranges from a minimum of 45.0 mcd to a maximum of 112.0 mcd. The typical value falls within this range based on the specific bin code.
- Viewing Angle (2θ1/2): 120 degrees (typical). This is the full angle at which the luminous intensity is half of the maximum intensity measured at 0 degrees (on-axis).
- Peak Wavelength (λp): Approximately 591 nm (typical). This is the wavelength at which the spectral emission is strongest.
- Dominant Wavelength (λd): Ranges from 585.5 nm to 594.5 nm. This is the single wavelength perceived by the human eye that matches the color of the emitted light.
- Spectral Radiation Bandwidth (Δλ): 15 nm (typical). This indicates the width of the emitted spectrum at half the maximum intensity (Full Width at Half Maximum - FWHM).
- Forward Voltage (VF): Ranges from 1.75 V to 2.35 V at IF=20mA. This is the voltage drop across the LED when it is conducting.
- Reverse Current (IR): Maximum of 10 μA when a reverse voltage (VR) of 5V is applied. The datasheet explicitly notes that the device is not designed for operation in reverse bias; this parameter is for test purposes only.
Important Notes: The datasheet specifies manufacturing tolerances: Luminous Intensity ±11%, Dominant Wavelength ±1 nm, and Forward Voltage ±0.1 V.
3. Binning System Explanation
To ensure consistency in mass production, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific application requirements for brightness and color.
3.1 Luminous Intensity Binning
Binned at IF=20mA. The bin code (e.g., P1, Q2) defines a specific intensity range.
- P1: 45.0 – 57.0 mcd
- P2: 57.0 – 72.0 mcd
- Q1: 72.0 – 90.0 mcd
- Q2: 90.0 – 112.0 mcd
3.2 Dominant Wavelength Binning
Binned at IF=20mA. This determines the precise shade of yellow.
- D3: 585.5 – 588.5 nm
- D4: 588.5 – 591.5 nm
- D5: 591.5 – 594.5 nm
3.3 Forward Voltage Binning
Binned at IF=20mA. This is crucial for circuit design, particularly when driving multiple LEDs in series.
- 0: 1.75 – 1.95 V
- 1: 1.95 – 2.15 V
- 2: 2.15 – 2.35 V
4. Performance Curve Analysis
The datasheet provides several characteristic graphs that illustrate the device's behavior under varying conditions. These are essential for robust circuit design.
4.1 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship between the current flowing through the LED and the voltage across it. It is fundamental for selecting the appropriate current-limiting resistor. The curve will shift with temperature.
4.2 Relative Luminous Intensity vs. Forward Current
This graph demonstrates how light output increases with forward current. It is typically non-linear, and operating near the maximum current may offer diminishing returns in brightness while increasing heat and reducing lifetime.
4.3 Relative Luminous Intensity vs. Ambient Temperature
LED light output decreases as the junction temperature rises. This graph quantifies that derating, showing the percentage of luminous intensity retained from -40°C to +110°C. Effective thermal management is key to maintaining consistent brightness.
4.4 Forward Current Derating Curve
To prevent overheating, the maximum allowable continuous forward current must be reduced as the ambient temperature increases. This graph provides the derating guidelines above 25°C up to the maximum operating temperature.
4.5 Radiation Pattern and Spectrum Distribution
The radiation pattern diagram visually represents the 120-degree viewing angle. The spectrum distribution plot shows the narrow emission peak centered around 591 nm, characteristic of AlGaInP technology, which produces a saturated yellow color.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED has a compact SMD footprint. Critical dimensions include the body size, terminal (pad) spacing, and overall height. All unspecified tolerances are ±0.1 mm. The polarity is indicated by a marking on the package or a specific pad design (typically the cathode). Designers must refer to the exact dimensional drawing for PCB land pattern design.
6. Soldering and Assembly Guidelines
6.1 Storage and Moisture Sensitivity
The LEDs are packaged in a moisture-resistant barrier bag with desiccant. The bag must not be opened until the components are ready for use. After opening, unused LEDs should be stored at ≤30°C and ≤60% Relative Humidity (RH) and used within 168 hours (7 days). If the storage time is exceeded or the desiccant indicates saturation, a baking treatment at 60 ±5°C for 24 hours is required before soldering to prevent "popcorning" damage during reflow.
6.2 Reflow Soldering Profile
A lead-free (Pb-free) reflow profile is specified:
- Pre-heating: 150–200°C for 60–120 seconds.
- Time Above Liquidus (TAL): 60–150 seconds above 217°C.
- Peak Temperature: Maximum of 260°C, held for a maximum of 10 seconds.
- Ramp-up Rate: Maximum 6°C/second.
- Time Above 255°C: Maximum 30 seconds.
- Ramp-down Rate: Maximum 3°C/second.
6.3 Hand Soldering and Rework
If hand soldering is unavoidable, use a soldering iron with a tip temperature ≤350°C and power ≤25W. Contact time per terminal must be ≤3 seconds. Allow a cooling interval of at least 2 seconds between soldering each terminal. Rework is strongly discouraged. If absolutely necessary, a specialized double-head soldering iron must be used to simultaneously heat both terminals and avoid mechanical stress on the solder joints. The impact on LED characteristics must be verified after rework.
6.4 Circuit Protection
A current-limiting resistor is mandatory in series with the LED. The forward voltage has a negative temperature coefficient, meaning it decreases as the LED heats up. Without a resistor, a small increase in supply voltage or a drop in VF can cause a large, potentially destructive, increase in forward current.
7. Packaging and Ordering Information
7.1 Reel and Tape Specifications
The components are supplied in embossed carrier tape on 7-inch diameter reels. The standard loaded quantity is 3000 pieces per reel. Detailed dimensions for the reel, carrier tape pockets, and cover tape are provided for compatibility with automated equipment feeders.
7.2 Label Explanation
The packaging label includes several codes:
- CPN: Customer's Product Number.
- P/N: Manufacturer's Product Number (e.g., 19-213/Y2C-AP1Q2B/3T).
- QTY: Packing Quantity.
- CAT: Luminous Intensity Rank (Bin Code).
- HUE: Chromaticity Coordinates & Dominant Wavelength Rank (Bin Code).
- REF: Forward Voltage Rank (Bin Code).
- LOT No: Manufacturing Lot Number for traceability.
8. Application Design Considerations
8.1 Driving the LED
Always drive the LED with a constant current or via a current-limiting resistor from a voltage source. Calculate the resistor value using Ohm's Law: R = (V_supply - VF_LED) / I_desired. Use the maximum VF from the bin or datasheet to ensure sufficient current under all conditions. For example, with a 5V supply, a desired current of 20mA, and a max VF of 2.35V: R = (5 - 2.35) / 0.02 = 132.5 Ω. A standard 130 Ω or 150 Ω resistor would be appropriate, checking the power rating (P = I²R).
8.2 Thermal Management
While the package is small, power dissipation (up to 60mW) can still cause a temperature rise. Ensure adequate PCB copper area (thermal relief pads) to conduct heat away from the LED terminals, especially when operating at high ambient temperatures or near maximum current. This helps maintain luminous intensity and long-term reliability.
8.3 Optical Design
The 120-degree viewing angle provides a wide, diffuse emission pattern suitable for area illumination and indicators viewed from various angles. For more focused light, secondary optics (lenses) would be required. The water-clear resin offers good color saturation.
9. Technical Comparison and Positioning
Compared to traditional through-hole LEDs, this SMD type offers significant advantages in assembly speed, board space savings, and mechanical reliability by eliminating leads. Within the SMD yellow LED category, the AlGaInP technology used here typically offers higher efficiency and better color purity than older technologies like GaAsP for yellow wavelengths. The specific binning structure allows for tighter control over color and brightness in production runs compared to non-binned or broadly binned alternatives.
10. Frequently Asked Questions (FAQ)
10.1 What is the difference between peak wavelength and dominant wavelength?
Peak wavelength (λp) is the physical wavelength at which the LED emits the most optical power. Dominant wavelength (λd) is a perceptual metric; it is the wavelength of monochromatic light that would appear to have the same color as the LED's output to the human eye. For a narrow-spectrum LED like this one, they are often close, but λd is the more relevant parameter for color specification.
10.2 Why is a current-limiting resistor absolutely necessary?
An LED is a diode with a very steep I-V curve in the forward region. Its forward voltage also decreases with increasing temperature. Without a series resistor, any slight variation in supply voltage or temperature can lead to a runaway increase in current, rapidly exceeding the Absolute Maximum Rating and causing catastrophic failure (burn-out). The resistor provides negative feedback, stabilizing the operating point.
10.3 Can I use this LED for continuous operation at 25mA?
Yes, 25mA is the rated continuous forward current (IF) at 25°C. However, if the ambient temperature is expected to be higher, you must consult the Forward Current Derating Curve and reduce the operating current accordingly to stay within the power dissipation limits and ensure long-term reliability.
10.4 How do I interpret the part number 19-213/Y2C-AP1Q2B/3T?
While the exact breakdown may be proprietary, it typically encodes key attributes. "19-213" is likely the base product series. The suffix often includes the color code (Y for Yellow), intensity bin (Q2), wavelength bin (likely implied), and voltage bin (3T may relate to bin '2' or packaging). The specific label codes (CAT, HUE, REF) on the reel provide the definitive bin information for your order.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |