Table of Contents
- 1. Product Overview
- 2. Technical Specifications Deep Dive
- 2.1 Absolute Maximum Ratings
- 2.2 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Dominant Wavelength Binning
- 4. Performance Curve Analysis
- 4.1 Relative Luminous Intensity vs. Forward Current
- 4.2 Relative Luminous Intensity vs. Ambient Temperature
- 4.3 Forward Voltage vs. Forward Current
- 4.4 Spectrum Distribution
- 4.5 Radiation Pattern
- 4.6 Forward Current Derating Curve
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 6. Soldering and Assembly Guidelines
- 6.1 Reflow Soldering Profile
- 6.2 Hand Soldering
- 6.3 Storage and Moisture Sensitivity
- 7. Packaging and Ordering Information
- 7.1 Reel and Tape Specifications
- 7.2 Label Information
- 8. Application Recommendations
- 8.1 Typical Applications
- 8.2 Design Considerations
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 11. Practical Design Case Study
- 12. Operating Principle
- 13. Technology Trends
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 19-213 is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a Brilliant Yellow Green light output. The primary advantage of this component is its miniature footprint, which enables significant reductions in printed circuit board (PCB) size and overall equipment dimensions. Its lightweight construction further makes it suitable for applications where space and weight are critical constraints. The LED is packaged on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with high-speed automated pick-and-place assembly equipment. It is a mono-color, lead-free (Pb-free) component that complies with major environmental regulations including RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).
2. Technical Specifications Deep Dive
2.1 Absolute Maximum Ratings
These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed. The absolute maximum ratings are specified at an ambient temperature (Ta) of 25°C. The maximum reverse voltage (VR) is 5V. The continuous forward current (IF) must not exceed 25 mA. For pulsed operation, a peak forward current (IFP) of 60 mA is allowed under a duty cycle of 1/10 at 1 kHz. The maximum power dissipation (Pd) is 60 mW. The device can withstand an electrostatic discharge (ESD) of 2000V according to the Human Body Model (HBM). The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature range (Tstg) is slightly wider, from -40°C to +90°C. For soldering, a reflow profile with a peak temperature of 260°C for 10 seconds is specified, or hand soldering at 350°C for a maximum of 3 seconds.
2.2 Electro-Optical Characteristics
The typical performance is measured at Ta=25°C and a forward current (IF) of 20 mA. The luminous intensity (Iv) has a typical range defined by bin codes, with a minimum of 45.0 mcd and a maximum of 112.0 mcd. The viewing angle (2θ1/2), where the intensity is half of the on-axis value, is a wide 120 degrees. The peak wavelength (λp) is typically 575 nm, and the dominant wavelength (λd) ranges from 569.5 nm to 577.5 nm, categorized into specific bins. The spectral bandwidth (Δλ) is approximately 20 nm. The forward voltage (VF) is typically 2.0V with a maximum of 2.35V. The reverse current (IR) is a maximum of 10 μA when a reverse voltage (VR) of 5V is applied. It is crucial to note that the device is not designed for operation in reverse bias; the VR rating is for test conditions only when measuring IR.
3. Binning System Explanation
To ensure consistency in brightness and color, the LEDs are sorted into bins based on key parameters.
3.1 Luminous Intensity Binning
The luminous output is categorized into four bins (P1, P2, Q1, Q2) when measured at IF=20mA. Bin P1 covers 45.0 to 57.0 mcd, P2 from 57.0 to 72.0 mcd, Q1 from 72.0 to 90.0 mcd, and Q2 from 90.0 to 112.0 mcd. A tolerance of ±11% applies to the luminous intensity.
3.2 Dominant Wavelength Binning
The color, defined by dominant wavelength, is sorted into four bins (C16, C17, C18, C19) at IF=20mA. Bin C16 ranges from 569.5 to 571.5 nm, C17 from 571.5 to 573.5 nm, C18 from 573.5 to 575.5 nm, and C19 from 575.5 to 577.5 nm. A tight tolerance of ±1nm is maintained for the dominant wavelength.
4. Performance Curve Analysis
The datasheet provides several characteristic curves that are essential for circuit design and thermal management.
4.1 Relative Luminous Intensity vs. Forward Current
This curve shows how light output increases with forward current. It is non-linear, and designers must refer to this graph to select the appropriate operating current for desired brightness, ensuring they do not exceed the absolute maximum ratings.
4.2 Relative Luminous Intensity vs. Ambient Temperature
This graph illustrates the thermal derating of light output. As ambient temperature increases, the luminous efficiency decreases. This is critical for applications operating in elevated temperature environments, as it may necessitate optical or electrical compensation.
4.3 Forward Voltage vs. Forward Current
The IV (Current-Voltage) characteristic curve is fundamental for designing the current-limiting circuitry. It shows the exponential relationship, helping to calculate the necessary series resistor value or constant current driver specifications.
4.4 Spectrum Distribution
The spectral power distribution curve confirms the monochromatic nature of the LED, showing a single peak centered around 575 nm, which defines its Brilliant Yellow Green color.
4.5 Radiation Pattern
The polar diagram depicts the spatial distribution of light intensity. The 120° viewing angle is confirmed here, showing a near-Lambertian emission pattern suitable for wide-area illumination.
4.6 Forward Current Derating Curve
This is arguably the most important graph for reliability. It shows the maximum allowable continuous forward current as a function of ambient temperature. As temperature rises, the maximum current must be reduced to stay within the device's safe operating area and power dissipation limits.
5. Mechanical and Package Information
5.1 Package Dimensions
The LED has a compact SMD package. Key dimensions include a body length of 2.0 mm, a width of 1.25 mm, and a height of 0.8 mm. The anode and cathode terminals are clearly marked. All unspecified tolerances are ±0.1 mm. The dimensional drawing is essential for creating the PCB land pattern (footprint) in CAD software.
6. Soldering and Assembly Guidelines
6.1 Reflow Soldering Profile
For Pb-free soldering, a specific temperature profile must be followed. The pre-heating zone should be between 150°C and 200°C for 60-120 seconds. The time above the solder liquidus temperature (217°C) should be 60-150 seconds. The peak temperature must not exceed 260°C, and the time within 5°C of this peak should be a maximum of 10 seconds. The maximum heating rate is 3°C/sec, and the maximum cooling rate is 6°C/sec. Reflow soldering should not be performed more than twice.
6.2 Hand Soldering
If hand soldering is unavoidable, the iron tip temperature must be below 350°C, and contact time per terminal must not exceed 3 seconds. A low-power soldering iron (≤25W) is recommended. A minimum interval of 2 seconds should be left between soldering each terminal to prevent thermal shock.
6.3 Storage and Moisture Sensitivity
The components are packaged in a moisture-resistant bag with desiccant. The bag must not be opened until the parts are ready for use. After opening, unused LEDs must be stored at ≤30°C and ≤60% Relative Humidity (RH) and used within 168 hours (7 days). If this window is exceeded or the desiccant indicator changes color, a baking treatment at 60±5°C for 24 hours is required before use.
7. Packaging and Ordering Information
7.1 Reel and Tape Specifications
The LEDs are supplied in embossed carrier tape on a 7-inch (178 mm) diameter reel. The reel width is 13.0 mm, and the hub diameter is 44.4 mm. Each reel contains 3000 pieces. The carrier tape pocket dimensions are designed to securely hold the 2.0x1.25 mm package.
7.2 Label Information
The packaging label contains critical information for traceability and correct application: Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity/Dominant Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).
8. Application Recommendations
8.1 Typical Applications
The Brilliant Yellow Green color and wide viewing angle make this LED ideal for status indication and backlighting. Common uses include backlighting for instrument panel dashboards and switches, indicator and keypad backlighting in telecommunication devices like phones and fax machines, flat backlighting for small LCDs and symbols, and general-purpose indicator applications.
8.2 Design Considerations
Current Limiting: An external current-limiting resistor is mandatory. The exponential IV characteristic means a small increase in voltage can cause a large, damaging increase in current. The resistor value must be calculated based on the supply voltage, the LED's typical forward voltage (2.0V), and the desired operating current (≤25 mA).
Thermal Management: While the package is small, power dissipation (up to 60 mW) must be considered, especially in high ambient temperatures or enclosed spaces. The derating curve must be consulted. Adequate PCB copper area around the pads can help dissipate heat.
ESD Protection: Although rated for 2000V HBM, standard ESD handling precautions should be observed during assembly.
Optical Design: The 120° viewing angle provides wide coverage. For focused light, secondary optics (lenses) would be required. The water-clear resin lens offers good light extraction.
9. Technical Comparison and Differentiation
Compared to older through-hole LED packages, this SMD type offers a drastically reduced footprint and profile, enabling modern miniaturized designs. The AlGaInP technology provides high efficiency and saturated color in the yellow-green spectrum. The wide 120° viewing angle is a key advantage over narrower-angle LEDs for applications requiring broad visibility. Compliance with RoHS, REACH, and halogen-free standards ensures it meets stringent global environmental requirements for electronic products.
10. Frequently Asked Questions (FAQ)
Q: Can I drive this LED without a series resistor?
A: No. The datasheet explicitly warns that a slight voltage shift will cause a large current change, leading to burnout. A current-limiting resistor or constant-current driver is essential.
Q: What happens if I exceed the 7-day floor life after opening the moisture-proof bag?
A: The LEDs may absorb moisture, which can cause popcorn cracking or delamination during reflow soldering. They must be baked at 60±5°C for 24 hours before use.
Q: Can I use this for reverse-voltage indication?
A: No. The device is not designed for reverse operation. The 5V reverse voltage rating is for test conditions only when measuring leakage current (IR).
Q: How do I interpret the bin codes (P1, C17, etc.) on the label?
A: These codes specify the guaranteed range for luminous intensity (P1, P2, Q1, Q2) and dominant wavelength (C16-C19). Designers should select the appropriate bin for their application's brightness and color consistency requirements.
11. Practical Design Case Study
Consider designing a status indicator for a portable consumer device powered by a 3.3V rail. The goal is a clearly visible Brilliant Yellow Green light.
Step 1 - Current Selection: Targeting a mid-range brightness, an operating current of 15 mA is chosen, well below the 25 mA maximum.
Step 2 - Resistor Calculation: Using Ohm's Law: R = (V_supply - Vf_LED) / I_LED. With V_supply = 3.3V, Vf_typical = 2.0V, and I_LED = 0.015 A, R = (3.3 - 2.0) / 0.015 = 86.67 Ω. The nearest standard value of 91 Ω or 82 Ω can be selected, slightly adjusting the current.
Step 3 - Power Rating: Power dissipated in the resistor P_R = I²R = (0.015)² * 91 = 0.0205 W. A standard 1/10W (0.1W) resistor is more than sufficient.
Step 4 - Thermal Check: The device's power dissipation P_LED = Vf * I = 2.0V * 0.015A = 30 mW. According to the derating curve, at an expected maximum ambient temperature of 50°C, the allowable current is still above 25 mA, so 15 mA is safe.
Step 5 - PCB Layout: A footprint matching the 2.0x1.25mm package is created. Small thermal relief connections to a modest copper pour can aid soldering and heat dissipation without acting as a large heat sink that might complicate reflow.
12. Operating Principle
This LED operates on the principle of electroluminescence in a semiconductor p-n junction. The active region is composed of AlGaInP. When a forward voltage exceeding the junction's built-in potential is applied, electrons from the n-type region and holes from the p-type region are injected into the active region. Here, they recombine, releasing energy in the form of photons. The specific bandgap energy of the AlGaInP alloy determines the wavelength of the emitted light, in this case, corresponding to Brilliant Yellow Green (~575 nm). The water-clear epoxy resin encapsulant protects the semiconductor die, provides mechanical stability, and shapes the light output beam to the specified 120-degree viewing angle.
13. Technology Trends
The development of SMD LEDs like the 19-213 is part of the broader trend in electronics towards miniaturization, increased reliability, and automated assembly. AlGaInP technology represents a mature and efficient solution for producing high-brightness red, orange, yellow, and green LEDs. Ongoing research in semiconductor materials, such as further refinements in epitaxial growth and phosphor conversion for broader spectra, continues to push the boundaries of efficiency, color rendering, and power density. Furthermore, packaging innovations focus on improving thermal management to allow higher drive currents from ever-smaller footprints, as well as enhancing reliability under harsh environmental conditions. The integration of drive electronics and multiple color chips into single packages (e.g., RGB LEDs) is another significant trend enabled by advanced SMD technology.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |