SMD LED 19-213 Dark Red Water Clear Datasheet - 2.0x1.25x0.8mm - 2.0V - 0.06W - English Technical Document

1. Product Overview

The 19-213 is a compact, surface-mount LED designed for modern electronic applications requiring high-density component placement. It utilizes AlGaInP semiconductor technology to produce a dark red emission. The primary advantage of this component is its miniature footprint, which enables smaller PCB designs, reduced storage requirements, and ultimately contributes to the miniaturization of end equipment. Its lightweight construction further makes it ideal for portable and space-constrained applications.

The LED is packaged on 8mm tape wound on a 7-inch diameter reel, making it fully compatible with automated pick-and-place assembly equipment. It is designed for reliability and environmental compliance, being Pb-free, RoHS compliant, compliant with EU REACH regulations, and meeting halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.1 Core Advantages

• Miniaturization: Significantly smaller than traditional lead-frame LEDs, enabling higher packing density.
• Automation Friendly: Supplied in tape-and-reel packaging for high-speed automated assembly.
• Process Compatibility: Suitable for both infrared (IR) and vapor phase reflow soldering processes.
• Environmental Compliance: Adheres to major global environmental and safety standards (Pb-free, RoHS, REACH, Halogen-Free).
• Reliable Performance: Stable electro-optical characteristics within specified operating conditions.

1.2 Target Applications

This LED is versatile and finds use in various illumination and indication roles, including:

• Backlighting: For instrument panels, switches, and symbols.
• Telecommunication Equipment: Status indicators and keypad backlighting in phones and fax machines.
• LCD Displays: Flat backlighting units.
• General Purpose Indication: Any application requiring a compact, bright, dark red indicator.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not advised.

Interpretation: The low reverse voltage rating (5V) indicates this device is not designed for reverse bias operation and requires protection in circuits where reverse voltage is possible. The forward current rating of 25mA is the continuous DC limit. The 60mA peak rating allows for brief pulses, useful in multiplexed display applications. The ESD rating of 2000V HBM is standard for LEDs, indicating the need for standard ESD handling precautions during assembly.

2.2 Electro-Optical Characteristics

These parameters are measured at a junction temperature (Tj) of 25°C under a forward current (IF) of 20mA, unless otherwise specified. They define the typical performance of the device.

Interpretation: The luminous intensity has a wide binning range (45-112 mcd), which is addressed in the binning system. The 120-degree viewing angle is very wide, providing a broad, diffuse light pattern suitable for backlighting and general indication. The dominant wavelength range of 625.5-637.5 nm places the emission firmly in the dark red portion of the spectrum. The typical 20nm spectral bandwidth indicates a relatively pure color emission. The forward voltage is relatively low, typical for AlGaInP LEDs, which helps minimize power consumption.

2.3 Thermal Considerations

While not explicitly detailed in a separate thermal resistance parameter, thermal management is critical. The absolute maximum power dissipation is 60mW. Exceeding this, especially at high ambient temperatures, will reduce luminous output and lifespan. The derating curve (shown in the PDF) illustrates how the maximum allowable forward current decreases as ambient temperature increases above 25°C. Proper PCB layout with adequate thermal relief is recommended for applications running at high currents or in elevated temperature environments.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted (binned) based on key performance parameters. The 19-213 uses a three-dimensional binning system for Luminous Intensity (Iv), Dominant Wavelength (λd), and Forward Voltage (VF).

3.1 Luminous Intensity Binning

The product code \"R7C-AP1Q2L/3T\" suggests a specific bin combination. Analyzing this: \"Q2\" likely corresponds to the luminous intensity bin (90-112 mcd).

3.2 Dominant Wavelength Binning

In the product code, \"R7C\" may indicate the wavelength bin. \"R\" often denotes red, and \"7C\" could specify a particular chromaticity coordinate or wavelength sub-bin within the E6-E8 range.

3.3 Forward Voltage Binning

The \"AP1\" in the product code might relate to the forward voltage bin. This binning is crucial for designers to ensure consistent brightness when multiple LEDs are driven in series, as a higher Vf bin LED would drop more voltage, potentially reducing current and brightness if not accounted for in the current-limiting circuit.

4. Performance Curve Analysis

The datasheet provides several typical characteristic curves which are essential for understanding device behavior under non-standard conditions.

4.1 Relative Luminous Intensity vs. Forward Current

This curve shows that luminous intensity increases super-linearly with forward current at lower currents, then tends to saturate at higher currents (typically above the recommended 20mA). Driving the LED above its rated current leads to diminishing returns in light output while significantly increasing heat and accelerating degradation.

4.2 Relative Luminous Intensity vs. Ambient Temperature

This is a critical curve for thermal design. It demonstrates that luminous output decreases as the ambient (and thus junction) temperature increases. For AlGaInP LEDs, the output can drop by approximately 20-30% over the operating temperature range from -40°C to +85°C. Designs intended for high-temperature environments must account for this derating to maintain sufficient brightness.

4.3 Forward Voltage vs. Forward Current

The IV curve shows the exponential relationship typical of a diode. The forward voltage has a negative temperature coefficient (it decreases as temperature increases). This is important for constant-voltage drive schemes, as a warmer LED will draw more current, potentially leading to thermal runaway if not properly current-limited.

4.4 Spectrum Distribution and Radiation Pattern

The spectrum plot confirms the peak wavelength and the ~20nm FWHM. The radiation pattern plot (polar diagram) visually confirms the 120-degree viewing angle, showing a smooth, wide emission profile ideal for even illumination.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a very compact SMD package. Key dimensions (in mm) are approximately: Length (L) = 2.0, Width (W) = 1.25, Height (H) = 0.8. The cathode is typically identified by a marking or a chamfered corner on the package. The exact dimensions and pad layout should be taken from the detailed dimension drawing in the PDF for PCB footprint design. Tolerances are typically ±0.1mm.

5.2 Polarity Identification

Correct polarity is essential. The datasheet's package drawing indicates the anode and cathode pads. Misconnection will prevent the LED from illuminating and applying the 5V maximum reverse voltage could damage the device.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with lead-free (Pb-free) reflow processes. The recommended temperature profile is crucial for reliability:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (TAL): 60-150 seconds above 217°C.
• Peak Temperature: Maximum of 260°C, held for a maximum of 10 seconds.
• Ramp-up Rate: Maximum 6°C/second.
• Ramp-down Rate: Maximum 3°C/second.

Critical Rule: Reflow soldering should not be performed more than two times on the same device to avoid thermal stress damage to the epoxy resin and internal bonds.

6.2 Hand Soldering

If manual repair is necessary, extreme care must be taken:

• Soldering iron tip temperature: < 350°C.
• Contact time per terminal: < 3 seconds.
• Soldering iron power: < 25W.
• Allow a minimum 2-second interval between soldering each terminal to allow heat dissipation.

The datasheet explicitly warns that damage often occurs during hand soldering.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant to prevent moisture absorption, which can cause \"popcorning\" (package cracking) during reflow.

1. Do not open the bag until ready for use.
2. After opening, unused LEDs must be stored at ≤ 30°C and ≤ 60% Relative Humidity.
3. The \"Floor Life\" after bag opening is 168 hours (7 days).
4. If the floor life is exceeded or the desiccant indicator shows saturation, a baking treatment is required: 60 ±5°C for 24 hours before use.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The standard packaging is 3000 pieces per reel. The carrier tape width is 8mm, wound on a standard 7-inch (178mm) diameter reel. Detailed dimensions for the reel, carrier tape pockets, and cover tape are provided in the PDF for compatibility with automated equipment feeders.

7.2 Label Explanation

The reel label contains key information for traceability and verification:

• CPN: Customer's Part Number (if assigned).
• P/N: Manufacturer's Part Number (e.g., 19-213/R7C-AP1Q2L/3T).
• QTY: Quantity of pieces on the reel.
• CAT: Luminous Intensity Rank (e.g., Q2).
• HUE: Chromaticity/Dominant Wavelength Rank (e.g., related to R7C).
• REF: Forward Voltage Rank (e.g., related to AP1).
• LOT No: Manufacturing lot number for quality tracking.

8. Application Design Considerations

8.1 Current Limiting is Mandatory

The datasheet's first \"Precaution for Use\" is emphatic: An external current-limiting resistor (or constant-current driver) MUST be used. LEDs exhibit a sharp rise in current with a small increase in voltage beyond their forward voltage (Vf). Operating directly from a voltage source without current control will result in excessive current, immediate overheating, and catastrophic failure.

8.2 Circuit Board Layout

Avoid mechanical stress on the LED during and after soldering. Do not bend or warp the PCB in the vicinity of the LED after assembly, as this can crack the solder joints or the LED package itself. Ensure the PCB footprint matches the recommended land pattern to achieve a reliable solder fillet.

8.3 Thermal Management in Arrays

When designing arrays of these LEDs for backlighting, consider the total power dissipation. Spacing LEDs appropriately and providing thermal vias (if on a multilayer board) can help dissipate heat and prevent localized hot spots that reduce brightness and longevity.

9. Technical Comparison and Differentiation

The 19-213 LED's primary differentiators in its class are its combination of a very compact package size, a wide 120-degree viewing angle with water-clear resin (offering high on-axis intensity), and full compliance with modern environmental standards. Compared to older, diffused resin LEDs, the water-clear lens provides higher luminous intensity for the same chip size, though with a more directed beam which is effectively broadened by the 120-degree angle. Its AlGaInP technology offers higher efficiency and better color saturation in the red/orange spectrum compared to older technologies like GaAsP.

10. Frequently Asked Questions (FAQ)

10.1 Can I drive this LED without a resistor if my power supply is exactly 2.0V?

No. This is dangerous. The forward voltage (Vf) has a tolerance and a negative temperature coefficient. A supply of 2.0V might be below Vf at 25°C, but as the LED warms up, Vf drops. This could cause the current to rise uncontrollably. Always use a series resistor or constant-current driver set for 20mA or less.

10.2 Why is the storage and baking procedure so important?

SMD plastic packages can absorb moisture from the air. During the high-temperature reflow soldering process, this trapped moisture rapidly turns to steam, creating internal pressure that can delaminate the package or crack the epoxy, leading to immediate or latent failure. The baking process safely drives out this absorbed moisture.

10.3 How do I interpret the product code 19-213/R7C-AP1Q2L/3T?

This is a full part number specifying exact performance bins:

• 19-213: Base product family and package.
• R7C: Likely specifies the dark red chromaticity/wavelength bin.
• AP1: Likely specifies the forward voltage bin.
• Q2: Specifies the luminous intensity bin (90-112 mcd).
• L/3T: May indicate other attributes like packaging type or special marking.

Consult the manufacturer's full bin code documentation for precise definitions.

11. Design and Use Case Example

11.1 Dashboard Switch Backlighting

Scenario: Designing backlighting for an automotive dashboard switch that requires a uniform red glow behind a symbol.Implementation: Use 2-3 pieces of the 19-213 LED placed behind a light guide or diffuser. Their wide 120-degree viewing angle helps create even illumination without hotspots. Drive them in series with a single current-limiting resistor from the vehicle's 12V supply (using a suitable voltage regulator if necessary). Calculate the resistor value as R = (V_supply - (N * Vf_LED)) / I_desired. For 3 LEDs in series with a typical Vf of 2.0V each, driven at 15mA from a regulated 5V line: R = (5V - 6V) / 0.015A = -66.7 Ohms. This calculation shows a problem: the total Vf (6V) exceeds the supply (5V). Therefore, you would either use fewer LEDs in series (e.g., 2 LEDs: R = (5V - 4V)/0.015A ≈ 67 Ohms) or connect them in parallel (each with its own resistor) from a higher voltage source. This example highlights the importance of considering forward voltage in circuit design.

12. Operating Principle

The 19-213 LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage is applied across the P-N junction, electrons from the N-type material and holes from the P-type material are injected into the active region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, dark red (~639 nm peak). The water-clear epoxy resin encapsulant protects the semiconductor chip, provides mechanical stability, and acts as a lens to shape the light output into the specified 120-degree viewing angle.

13. Technology Trends

The development of LEDs like the 19-213 follows several key industry trends: Miniaturization: Continuous reduction in package size to enable denser electronics. Higher Efficiency: Ongoing improvements in internal quantum efficiency and light extraction from the package to deliver more light (mcd) per unit of electrical input (mA). Environmental Compliance: The move to Pb-free soldering and halogen-free materials is now a baseline requirement driven by global regulations like RoHS and REACH. Automation and Standardization: Packaging on tape-and-reel and adherence to standard SMD footprints (like this 2.0x1.25mm approximate size) are essential for cost-effective, high-volume manufacturing. Future iterations may focus on even higher brightness within the same footprint, improved thermal performance, or expanded color gamuts and color-rendering indices for display applications.