SMD LED 22-23/R6GHBHC-A01/2C Datasheet - Multi-Color - Voltage 2.0-3.7V - Power 60-95mW - English Technical Document

1. Product Overview

The 22-23 series is a compact, multi-color Surface Mount Device (SMD) LED designed for modern electronic applications requiring miniaturization and high reliability. This component is significantly smaller than traditional lead-frame type LEDs, enabling substantial reductions in printed circuit board (PCB) size and overall equipment footprint. Its lightweight construction makes it particularly suitable for space-constrained and portable devices.

The series is offered in three distinct color variants, each based on different semiconductor materials: Brilliant Red (R6, AlGaInP), Brilliant Green (GH, InGaN), and Blue (BH, InGaN). All variants are supplied in a water-clear resin package. The product is fully compliant with Pb-free (RoHS) manufacturing requirements and is compatible with standard infrared and vapor phase reflow soldering processes, facilitating easy integration into automated assembly lines. It is packaged on 8mm tape mounted on 7-inch diameter reels.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not recommended operating conditions.

• Reverse Voltage (V_R): 5V for all types. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (I_F): The maximum continuous DC forward current is 25mA for all R6, GH, and BH types.
• Peak Forward Current (I_FP): The maximum permissible pulsed forward current, specified at a duty cycle of 1/10 and 1kHz frequency, varies: 60mA for R6, 95mA for GH, and 100mA for BH. This parameter is critical for pulsed operation applications.
• Power Dissipation (P_d): The maximum power the device can dissipate is 60mW for R6, and 95mW for GH and BH. This limit is determined by the package's thermal characteristics.
• Operating & Storage Temperature: The device is rated for operation from -40°C to +85°C and can be stored from -40°C to +90°C.
• Electrostatic Discharge (ESD): All variants have an ESD withstand voltage of 2000V (Human Body Model), indicating a standard level of ESD sensitivity. Proper ESD handling precautions are necessary.
• Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260°C for 10 seconds, or hand soldering at 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

These parameters are measured at a forward current (I_F) of 20mA and an ambient temperature (T_a) of 25°C, representing typical operating conditions.

• Luminous Intensity (I_v): The typical light output varies significantly by type: R6 (45-180mcd), GH (112-450mcd), BH (28.5-112mcd). The GH (Green) variant offers the highest typical output.
• Viewing Angle (2θ_1/2): A wide 120-degree viewing angle is typical for all colors, providing a broad emission pattern suitable for indicator and backlighting applications.
• Peak & Dominant Wavelength (λ_p, λ_d): Defines the color of the emitted light. Typical values are: R6 (λ_p 632nm, λ_d 615-630nm), GH (λ_p 518nm, λ_d 510-540nm), BH (λ_p 468nm, λ_d 460-480nm).
• Forward Voltage (V_F): The voltage drop across the LED at 20mA. R6 LEDs have a lower typical V_F of 2.0V (min 1.7V, max 2.4V), while GH and BH types have a higher typical V_F of 3.3V (min 2.7V, max 3.7V). This is a key parameter for driver circuit design and power consumption calculation.
• Reverse Current (I_R): The leakage current when 5V is applied in reverse bias is specified as a maximum of 10μA for the R6 type.

3. Binning System Explanation

To ensure color and brightness consistency in production, the LEDs are sorted into bins based on luminous intensity at I_F = 20mA. Each color variant has its own binning structure.

• R6 (Red): Bins P (45.0-72.0 mcd), Q (72.0-112 mcd), R (112-180 mcd).
• GH (Green): Bins R (112-180 mcd), S (180-285 mcd), T (285-450 mcd).
• BH (Blue): Bins N (28.5-45.0 mcd), P (45.0-72.0 mcd), Q (72.0-112 mcd).

The datasheet notes a luminous intensity tolerance of ±11% within each bin. For precise color matching, the dominant wavelength and forward voltage are also controlled with tolerances of ±1nm and ±0.1V, respectively. These are typically indicated by HUE and REF codes on the packaging label.

4. Performance Curve Analysis

The datasheet provides typical characteristic curves for each LED type (R6, GH, BH), which are essential for understanding device behavior under non-standard conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

The curves show the exponential relationship between current and voltage. The R6 (Red) LED has a lower knee voltage (~1.8V) compared to the GH/Green and BH/Blue LEDs (~3.0V), consistent with their different semiconductor materials (AlGaInP vs. InGaN). This graph is vital for selecting an appropriate current-limiting resistor or constant-current driver.

4.2 Luminous Intensity vs. Forward Current

These plots demonstrate that light output increases approximately linearly with current over a significant range. However, operating above the absolute maximum rating will reduce lifetime and can cause failure. The curves help designers optimize the drive current for the desired brightness while maintaining reliability.

4.3 Luminous Intensity vs. Ambient Temperature

All LED types exhibit a decrease in light output as the ambient temperature rises. The output is typically normalized to 100% at 25°C. The rate of decline varies, but understanding this thermal derating is crucial for applications operating over a wide temperature range (e.g., automotive dashboards) to ensure sufficient brightness is maintained at high temperatures.

4.4 Forward Current Derating Curve

This curve dictates the maximum allowable continuous forward current as a function of ambient temperature. As temperature increases, the maximum safe current decreases to prevent exceeding the device's power dissipation limit and causing thermal runaway. Adherence to this curve is mandatory for reliable operation.

4.5 Spectrum Distribution

The graphs display the relative intensity of light emitted across different wavelengths. They show the narrow emission bands typical of LEDs, centered around their peak wavelength (λ_p). The spectral bandwidth (Δλ) is provided in the table (e.g., 20nm for R6).

4.6 Radiation Diagram

These polar plots illustrate the spatial distribution of light intensity, confirming the 120-degree viewing angle. The pattern is generally Lambertian (cosine-like), which is common for LEDs with a simple dome lens.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD footprint. Key dimensions (in mm, tolerance ±0.1mm unless noted) include a body size of approximately 2.0mm x 2.0mm, with a typical height. A detailed dimensioned drawing is provided, showing the anode and cathode pad locations.

5.2 Pad Design and Polarity Identification

A suggested PCB land pattern (pad layout) is included for reference, though designers are advised to modify it based on their specific process requirements. The cathode side of the LED is clearly marked with a green mask on the package itself, which is essential for correct orientation during assembly.

6. Soldering and Assembly Guidelines

The device is compatible with standard infrared and vapor phase reflow soldering processes. The critical parameter is the peak soldering temperature, which must not exceed 260°C for more than 10 seconds. For hand soldering, the iron tip temperature should be limited to 350°C for a maximum of 3 seconds. These limits prevent damage to the LED's internal structure and epoxy lens. The components are moisture-sensitive and are shipped in moisture-resistant packaging with desiccant. If the packaging is opened, standard MSL (Moisture Sensitivity Level) handling procedures should be followed to avoid "popcorning" during reflow.

7. Packaging and Ordering Information

The LEDs are supplied on embossed carrier tape with a width of 8mm, wound onto 7-inch diameter reels. Each reel contains 2000 pieces. The packaging includes a moisture-proof aluminum bag containing desiccant. The reel label contains critical information for traceability and bin selection, including codes for Luminous Intensity Rank (CAT), Dominant Wavelength Rank (HUE), and Forward Voltage Rank (REF), along with the product number (P/N), lot number, and quantity.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for backlighting symbols, switches, and small LCD panels in consumer electronics, automotive dashboards, and industrial control panels.
• Status Indicators: Perfect for power, connectivity, and mode indicators in telecommunications equipment (phones, faxes), computer peripherals, and home appliances.
• General Illumination: Suitable for decorative lighting, accent lighting, and other applications where compact size and low power consumption are priorities.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or constant-current driver to limit the forward current to the desired value (e.g., 20mA for typical specs). Calculate the resistor value using R = (V_supply - V_F) / I_F.
• Thermal Management: While the power is low, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near maximum current to maintain junction temperature within safe limits.
• ESD Protection: Implement ESD protection on input lines if the LED is in a user-accessible location, as the 2000V HBM rating is modest.
• Optical Design: The wide viewing angle may require light guides or diffusers to achieve uniform illumination in backlighting applications.

9. Technical Comparison and Differentiation

The primary advantage of the 22-23 series lies in its combination of a very small form factor (enabling high-density PCB layouts) and the availability of three distinct, bright colors from a single package outline. Compared to larger through-hole LEDs, it offers significant space and weight savings. The use of InGaN technology for green and blue provides higher efficiency and brightness than older technologies. Its compatibility with automated pick-and-place and reflow soldering streamlines manufacturing, reducing assembly costs compared to manual insertion.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak wavelength (λ_p) is the single wavelength at which the emission spectrum has its maximum intensity. Dominant wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED's output. λ_d is more relevant for color specification in applications.

10.2 Can I drive the LED with a 5V supply directly?

No. Applying 5V directly to the LED (especially the red type with a V_F of ~2.0V) would cause excessive current to flow, instantly destroying the device. A current-limiting mechanism (resistor or regulator) is always required.

10.3 Why are the forward voltages different for Red vs. Green/Blue?

The forward voltage is determined by the bandgap energy of the semiconductor material. AlGaInP (Red) has a lower bandgap than InGaN (Green/Blue), resulting in a lower required forward voltage to achieve emission.

10.4 How do I interpret the bin codes (CAT, HUE, REF) on the label?

These codes allow you to select LEDs with tightly controlled parameters. CAT corresponds to the luminous intensity bin (e.g., P, Q, R for Red). HUE corresponds to the dominant wavelength bin. REF corresponds to the forward voltage bin. Using LEDs from the same bin ensures consistency in brightness and color across your product.

11. Practical Design and Usage Case

Scenario: Designing a multi-status indicator for a portable device. A designer needs compact, low-power LEDs to indicate charging (red), fully charged (green), and Bluetooth activity (blue). The 22-23 series is an ideal choice. They would:

1. Select the R6, GH, and BH variants.
2. Design a PCB with three separate driver circuits. For a 3.3V system supply, calculate series resistors: R_red = (3.3V - 2.0V) / 0.020A = 65Ω (use 68Ω standard). R_green/blue = (3.3V - 3.3V) / 0.020A = 0Ω. This indicates the supply voltage is at the typical V_F, requiring a constant-current driver or a slightly higher supply voltage for stable operation with a resistor.
3. Place the LEDs on the board according to the recommended pad layout, ensuring correct polarity alignment via the green mask marker.
4. Program the microcontroller to drive the LEDs at 20mA via its GPIO pins (with appropriate current sinking/sourcing capability).
5. Verify brightness uniformity by specifying the same luminous intensity bin (e.g., Q for Red/Blue, R for Green) during procurement.

12. Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon, called electroluminescence, occurs when electrons recombine with holes within the device, releasing energy in the form of photons. The color (wavelength) of the emitted light is determined by the energy bandgap of the semiconductor material used in the active region. The 22-23 series utilizes AlGaInP (Aluminum Gallium Indium Phosphide) for red light and InGaN (Indium Gallium Nitride) for green and blue light. These compound semiconductors allow for efficient light generation across the visible spectrum. The SMD package encapsulates the tiny semiconductor chip in a clear epoxy resin that acts as a lens, shaping the light output and providing mechanical and environmental protection.

13. Development Trends

The general trend in SMD LEDs like the 22-23 series is towards ever-higher luminous efficacy (more light output per watt of electrical input), improved color rendering, and increased reliability at higher operating temperatures. Packaging continues to evolve to extract more light efficiently and manage heat from increasingly powerful chips. There is also a strong drive towards miniaturization, with even smaller package footprints becoming standard for ultra-compact devices. Furthermore, the integration of control electronics (e.g., constant-current drivers, PWM controllers) directly into the LED package is a growing trend, simplifying circuit design for the end user. The underlying materials science continues to advance, pushing the limits of efficiency and enabling new wavelength ranges.