SMD LED 19-223/R6BHC-A05/2T Datasheet - Multi-Color - Red & Blue - 2.0V/3.3V - 60mW/75mW - English Technical Document

1. Product Overview

The 19-223 is a compact, surface-mount LED designed for high-density electronic assemblies. It is a multi-color type, available in brilliant red (using R6 AlGaInP chip) and blue (using BH InGaN chip) emitted colors, both housed in a water-clear resin package. Its small form factor enables significant reductions in board size, increases packing density, and allows for the design of smaller, lighter end equipment, making it ideal for miniature applications.

1.1 Core Features and Compliance

Key features include packaging on 8mm tape within 7-inch diameter reels for compatibility with automated placement equipment. The component is suitable for both infrared and vapor phase reflow soldering processes. It is a Pb-free product and is compliant with key environmental regulations including RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

This LED is versatile and finds use in various illumination and indication roles. Primary applications include backlighting for dashboards, switches, and symbols; indicator and backlighting in telecommunication devices such as telephones and fax machines; flat backlighting for LCDs; and general-purpose lighting applications.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (Ta) of 25°C.

• Reverse Voltage (VR): 5V for both chip types. Exceeding this can cause junction breakdown.
• Forward Current (IF): R6 (Red): 25 mA (Continuous), BH (Blue): 20 mA (Continuous).
• Peak Forward Current (IFP): At a duty cycle of 1/10 and 1kHz. R6: 50 mA, BH: 40 mA. This rating is for pulsed operation, not continuous DC.
• Power Dissipation (Pd): R6: 60 mW, BH: 75 mW. This is the maximum allowable power the package can dissipate, calculated as IF * VF.
• Electrostatic Discharge (ESD) Human Body Model (HBM): R6: 2000V, BH: 150V. The blue (BH) chip is significantly more sensitive to ESD and requires stricter handling precautions.
• Temperature Range: Operating (Topr): -40°C to +85°C. Storage (Tstg): -40°C to +90°C.
• Soldering Temperature: Reflow: 260°C peak for a maximum of 10 seconds. Hand soldering: 350°C for a maximum of 3 seconds.

2.2 Electro-Optical Characteristics

These are typical performance parameters measured at Ta=25°C and IF=20mA, unless otherwise stated. They define the light output and electrical behavior.

• Luminous Intensity (Iv): R6: 72.0 - 180.0 mcd. BH: 36.0 - 72.0 mcd. This is a measure of perceived brightness. The wide range indicates the need for binning.
• Viewing Angle (2θ1/2): 130 degrees (typical). This defines the angular spread where intensity is at least half of the peak value.
• Peak Wavelength (λp): R6: 632 nm (typical), BH: 468 nm (typical). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): R6: 617.5 - 633.5 nm, BH: 464.5 - 476.5 nm. This correlates to the perceived color of the light.
• Spectrum Radiation Bandwidth (Δλ): R6: 20 nm (typical), BH: 15 nm (typical). The spectral width at half the maximum intensity.
• Forward Voltage (VF): R6: 1.7V (Min), 2.0V (Typ), 2.4V (Max). BH: 2.7V (Min), 3.3V (Typ), 3.7V (Max). The voltage drop across the LED when operating at the specified current.
• Reverse Current (IR): Measured at VR=5V. R6: 10 μA (Max), BH: 50 μA (Max).

Tolerances: Luminous Intensity: ±11%, Dominant Wavelength: ±1nm, Forward Voltage: ±0.1V.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on measured parameters.

3.1 R6 (Red Chip) Binning

Luminous Intensity Bins (IF=20mA):

• Bin Q: 72.0 - 112.0 mcd
• Bin R: 112.0 - 180.0 mcd

Dominant Wavelength Bins (IF=20mA):

• Bin E4: 617.5 - 621.5 nm
• Bin E5: 621.5 - 625.5 nm
• Bin E6: 625.5 - 629.5 nm
• Bin E7: 629.5 - 633.5 nm

3.2 BH (Blue Chip) Binning

Luminous Intensity Bins (IF=20mA):

• Bin N2: 36.0 - 45.0 mcd
• Bin P1: 45.0 - 57.0 mcd
• Bin P2: 57.0 - 72.0 mcd

Dominant Wavelength Bins (IF=20mA):

• Bin A9: 464.5 - 467.5 nm
• Bin A10: 467.5 - 470.5 nm
• Bin A11: 470.5 - 473.5 nm
• Bin A12: 473.5 - 476.5 nm

4. Performance Curve Analysis

The datasheet provides typical characteristic curves which are essential for understanding device behavior under non-standard conditions.

4.1 R6 (Red) Characteristics

Curves typically show:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, usually in a non-linear relationship that saturates at higher currents.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the thermal quenching effect, where light output decreases as junction temperature rises.
• Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic curve.
• Forward Voltage vs. Ambient Temperature: Shows the negative temperature coefficient of the forward voltage.
• Peak Wavelength vs. Ambient Temperature: Indicates how the emitted color (wavelength) shifts with temperature.

4.2 BH (Blue) Characteristics

Curves typically include:

• Spectrum Distribution: A plot of relative intensity versus wavelength, showing the emission peak around 468 nm.
• Forward Voltage vs. Forward Current: The I-V curve for the blue chip.
• Forward Current Derating Curve: Specifies the maximum allowable continuous forward current as a function of ambient temperature to stay within power dissipation limits.
• Radiation Diagram: A polar plot showing the spatial distribution of light intensity (viewing angle pattern).
• Relative Luminous Intensity vs. Ambient Temperature: Thermal performance curve.
• Relative Luminous Intensity vs. Forward Current: Efficiency curve.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The LED is a surface-mount device. The datasheet provides a detailed dimensional drawing (top, side, and bottom views) with critical measurements. Key dimensions typically include the overall length, width, and height, as well as the solder pad locations and dimensions. All tolerances are ±0.1mm unless otherwise specified. The unit of measurement is millimeters (mm).

5.2 Polarity Identification

The cathode is typically marked on the device, often with a notch, a green dot, or a different-colored pad on the bottom of the package. Correct polarity must be observed during assembly to prevent damage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A Pb-free reflow temperature profile is recommended:

• Pre-heating: 150~200°C for 60~120 seconds.
• Time Above Liquidus (217°C): 60~150 seconds.
• Peak Temperature: 260°C maximum.
• Time at Peak: 10 seconds maximum.
• Heating Rate: 6°C/second maximum.
• Time Above 255°C: 30 seconds maximum.
• Cooling Rate: 3°C/second maximum.

Reflow soldering should not be performed more than two times.

6.2 Storage and Handling Precautions

Moisture Sensitivity: The components are packaged in a moisture-resistant bag with desiccant.

1. Do not open the moisture-proof bag until ready for use.
2. After opening, unused LEDs should be stored at ≤30°C and ≤60% RH.
3. The "floor life" after bag opening is 168 hours (7 days).
4. If exceeding floor life or if desiccant indicates moisture, baking at 60 ±5°C for 24 hours is required before use.

ESD Protection: Especially for the BH (Blue) chip with a low 150V HBM rating, proper ESD controls (grounded workstations, wrist straps) are mandatory.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The LEDs are supplied on embossed carrier tape:

• Carrier Tape Width: 8 mm.
• Reel Diameter: 7 inches.
• Quantity per Reel: 2000 pieces.

Detailed drawings for reel dimensions, carrier tape pocket dimensions, and cover tape placement are provided, with tolerances of ±0.1mm unless noted.

7.2 Label Explanation

The packaging label includes several codes:

• CPN: Customer's Product Number.
• P/N: Product Number (e.g., 19-223/R6BHC-A05/2T).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank (Bin code).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank (Bin code).
• REF: Forward Voltage Rank.
• LOT No: Manufacturing Lot Number for traceability.

8. Application Suggestions and Design Considerations

8.1 Current Limiting

Critical: An external current-limiting resistor or constant-current driver must be used in series with the LED. The forward voltage has a negative temperature coefficient and a small change can cause a large, potentially destructive, increase in forward current. The resistor value can be calculated using Ohm's Law: R = (Vsupply - VF) / IF.

8.2 Thermal Management

While the power dissipation is low, proper PCB layout can help manage heat. Ensure adequate copper area around the solder pads to act as a heat sink, especially if operating near maximum ratings or in high ambient temperatures. Refer to the derating curve for the BH chip.

8.3 Optical Design

The 130-degree viewing angle provides a wide beam. For applications requiring focused light, secondary optics (lenses) may be needed. The water-clear resin is suitable for applications where the LED color itself is the indicator. For diffused or color-filtered output, external diffusers or lenses should be considered.

9. Technical Comparison and Differentiation

The primary advantage of this component lies in its combination of a small SMD footprint with the availability of two distinct, high-performance semiconductor technologies (AlGaInP for red and InGaN for blue) in one package style. This simplifies procurement and assembly for designs requiring multiple colors. Compared to larger through-hole LEDs, it offers significant space savings and compatibility with fully automated, high-speed SMT assembly lines, reducing manufacturing costs.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this LED without a resistor?

No. This is explicitly warned against in the "Precautions For Use." The LED's exponential I-V characteristic means it acts like a short circuit if connected directly to a voltage source above its forward voltage, leading to immediate overcurrent and failure.

10.2 Why is the ESD rating for the blue LED so much lower than for the red?

The materials and structure of InGaN-based blue LEDs are inherently more sensitive to electrostatic discharge than AlGaInP-based red LEDs. This is a fundamental characteristic of the semiconductor technology. It necessitates stricter ESD handling procedures for the blue variant.

10.3 What do the bin codes (e.g., R, E5, P2, A10) mean for my design?

If your application requires tight color or brightness consistency (e.g., in a multi-LED array or display), you must specify the required bin codes when ordering. Mixing bins can lead to visible variations in color hue and intensity across your product. For less critical indicator applications, a wider bin spread may be acceptable.

10.4 How do I interpret the "Peak" vs. "Dominant" wavelength?

Peak Wavelength (λp) is the physical wavelength where the spectral power output is highest. Dominant Wavelength (λd) is the wavelength of monochromatic light that would appear to have the same color to the human eye. λd is more relevant for color specification in visual applications.

11. Practical Design and Usage Case

Scenario: Designing a multi-status indicator panel. A control panel requires separate red and blue indicators for "Standby," "Active," and "Fault" states. Using the 19-223 series allows the designer to use identical footprints for both colors, simplifying PCB layout. The designer selects R6 chips (binned to E5 for consistent red hue) for "Fault" and BH chips (binned to A10 for consistent blue) for "Active." A common current-limiting resistor value is calculated for a 5V supply: ~150Ω for Red (IF=20mA, VF=2.0V) and ~85Ω for Blue (IF=20mA, VF=3.3V). The wide 130° viewing angle ensures visibility from various angles. The SMD package allows the panel to be very thin.

12. Principle Introduction

Light emission in LEDs is based on electroluminescence in a semiconductor p-n junction. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material. The R6 chip uses an AlGaInP (Aluminum Gallium Indium Phosphide) structure, which is efficient for producing red to amber light. The BH chip uses an InGaN (Indium Gallium Nitride) structure, which is used for producing blue, green, and white (with phosphor) light. The different material systems account for their differing electrical characteristics (forward voltage, ESD sensitivity) and optical performance.

13. Development Trends

The general trend in LED technology, including components like the 19-223, is towards higher efficiency (more lumens per watt), increased power density in smaller packages, and improved color rendering and consistency. There is also a strong focus on enhancing reliability and longevity under various environmental stresses. The drive for miniaturization in consumer electronics continues to push for ever-smaller SMD LED footprints while maintaining or improving optical output. Furthermore, integration with smart controls and the development of LEDs for specialized wavelengths (e.g., for horticulture or sensing) are active areas of advancement. The compliance with environmental standards (RoHS, Halogen-Free) is now a baseline requirement for global market access.