SMD LED 19-223/S2BHC-A01/2T Datasheet - Package 2.0x1.25x0.8mm - Voltage 2.0V/3.0V - Multi-Color - English Technical Document

1. Product Overview

The 19-223/S2BHC-A01/2T is a compact, multi-color Surface Mount Device (SMD) LED designed for high-density electronic assemblies. Its primary advantage lies in its significantly reduced footprint compared to traditional lead-frame LEDs, enabling smaller printed circuit board (PCB) designs, higher component packing density, and ultimately more compact end-user equipment. The lightweight construction further makes it suitable for miniature and portable applications where weight and space are critical constraints.

The product is offered in a multi-color configuration, specifically supporting brilliant orange (via an AlGaInP chip) and blue (via an InGaN chip) emissions. It is packaged on 8mm tape wound onto 7-inch diameter reels, ensuring compatibility with standard automated pick-and-place assembly equipment. The device is fully compliant with RoHS, EU REACH, and halogen-free directives (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), making it suitable for global markets with stringent environmental regulations.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device's operational limits are defined separately for its two chip variants, S2 (AlGaInP, Orange) and BH (InGaN, Blue), at an ambient temperature (Ta) of 25°C.

• Forward Current (IF): The S2 chip has a maximum continuous forward current rating of 25 mA, while the BH chip is rated for 20 mA. Exceeding these values risks permanent damage.
• Peak Forward Current (IFP): For pulsed operation at a 1/10 duty cycle and 1 kHz frequency, the S2 chip can handle 50 mA peaks, and the BH chip can handle 40 mA peaks.
• Power Dissipation (Pd): The maximum allowable power dissipation is 60 mW for the S2 chip and 75 mW for the BH chip. This parameter is crucial for thermal management.
• Electrostatic Discharge (ESD): The S2 chip offers robust ESD protection up to 2000V (Human Body Model), whereas the BH chip is rated for 150V. Proper ESD handling procedures are essential, especially for the BH variant.
• Temperature Ranges: The operating temperature range is -40°C to +85°C, and the storage temperature range is -40°C to +90°C.
• Soldering Temperature: The LED can withstand reflow soldering at 260°C for 10 seconds or hand soldering at 350°C for 3 seconds.

2.2 Electro-Optical Characteristics

Key performance metrics are measured at Ta=25°C and a forward current (IF) of 20 mA, unless otherwise specified.

• Luminous Intensity (Iv): For the S2 (Orange) chip, the intensity ranges from a minimum of 72.0 mcd to a maximum of 140.0 mcd. The BH (Blue) chip has a range of 36.0 mcd to 72.0 mcd. A tolerance of ±11% applies.
• Viewing Angle (2θ1/2): Both chips feature a wide viewing angle of 120 degrees, typical.
• Wavelength: The S2 chip has a typical peak wavelength (λp) of 611 nm and a dominant wavelength (λd) of 605 nm. The BH chip has a typical peak wavelength of 468 nm and a dominant wavelength of 470 nm.
• Spectrum Bandwidth (Δλ): The spectral width is approximately 17 nm for the S2 chip and 25 nm for the BH chip.
• Forward Voltage (VF): The S2 chip operates at a typical forward voltage of 2.0V, within a range of 1.7V to 2.4V. The BH chip has a typical VF of 3.0V to 3.5V. A tolerance of ±0.1V applies.
• Reverse Current (IR): At a reverse voltage (VR) of 5V, the maximum reverse current is 10 µA for S2 and 50 µA for BH. Important Note: The device is not designed for operation in reverse bias; this test condition is for characterization only.

3. Binning System Explanation

The LEDs are sorted (binned) based on key parameters to ensure consistency within a production batch.

3.1 Luminous Intensity Binning

S2 (Orange) Chip:

• Bin Q1: 72.0 - 90.0 mcd
• Bin Q2: 90.0 - 112.0 mcd
• Bin R1: 112.0 - 140.0 mcd

BH (Blue) Chip:

• Bin N2: 36.0 - 45.0 mcd
• Bin P1: 45.0 - 57.0 mcd
• Bin P2: 57.0 - 72.0 mcd

3.2 Forward Voltage Binning (BH Chip only)

The forward voltage for the BH (Blue) chip is also binned:

• Bin 1: 3.00 - 3.15 V
• Bin 2: 3.15 - 3.30 V
• Bin 3: 3.30 - 3.50 V

This allows designers to select LEDs with tighter VF matching for applications requiring uniform current distribution in parallel strings.

4. Performance Curve Analysis

The datasheet includes typical electro-optical characteristic curves for both the S2 and BH chips. While the specific graphical data is not provided in the text, these curves typically illustrate the relationship between forward current (IF) and forward voltage (VF), the effect of ambient temperature on luminous intensity, and the relative spectral power distribution. Analyzing these curves is essential for understanding device behavior under non-standard conditions (e.g., different drive currents or temperatures) and for accurate circuit design and thermal modeling.

5. Mechanical and Package Information

The LED features a compact SMD package. The package dimensions are provided in a detailed drawing with a note that tolerances are ±0.1mm unless otherwise specified. The unit of measurement is millimeters (mm). This information is critical for PCB footprint design, ensuring proper placement, and avoiding mechanical interference with other components.

6. Soldering and Assembly Guidelines

6.1 Storage and Handling

The LEDs are packaged in moisture-resistant bags with desiccant.

1. Do not open the moisture-proof bag until ready for use.
2. After opening, unused LEDs must be stored at ≤ 30°C and ≤ 60% Relative Humidity.
3. The "floor life" after opening is 168 hours (7 days). Unused LEDs must be resealed in a moisture-proof package.
4. If the desiccant indicates moisture absorption or the floor life is exceeded, a baking treatment at 60 ± 5°C for 24 hours is required before use.

6.2 Soldering Process

Reflow Soldering: A Pb-free reflow temperature profile is recommended. Reflow soldering should not be performed more than two times. Avoid applying mechanical stress to the LED during heating and do not warp the PCB after soldering. Hand Soldering: If necessary, use a soldering iron with a tip temperature < 350°C and a power rating < 25W. Contact time per terminal should not exceed 3 seconds. Allow a minimum 2-second interval between soldering each terminal. Hand soldering carries a higher risk of damage. Repair: Repair after soldering is discouraged. If unavoidable, a double-head soldering iron must be used to simultaneously heat both terminals, preventing thermal stress. The impact on LED characteristics must be evaluated beforehand.

7. Packaging and Ordering Information

The product is supplied in carrier tape on 7-inch reels, with a standard loaded quantity of 2000 pieces per reel. Detailed dimensions for the reel and carrier tape are provided (tolerances ±0.1mm). The packaging label includes fields for Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity/Dominant Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No.).

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: Ideal for dashboard indicators, switch illumination, and flat backlighting for LCDs and symbols.
• Telecommunication Equipment: Suitable as status indicators and keypad backlights in telephones and fax machines.
• General Indicator Use: Can be used in a wide variety of consumer and industrial electronics where a compact, reliable indicator is needed.

8.2 Design Considerations

Current Limiting: An external current-limiting resistor is mandatory. The forward voltage has a negative temperature coefficient, meaning a slight increase in voltage can cause a large, potentially destructive increase in current if not properly controlled. Thermal Management: Adhere to the maximum power dissipation ratings. Ensure adequate PCB copper area or other heatsinking methods if operating near maximum ratings or in high ambient temperatures. ESD Protection: Implement appropriate ESD protection measures on the PCB, especially for the BH (Blue) variant with its lower 150V HBM rating.

9. Technical Comparison and Differentiation

The key differentiation of this LED family lies in its dual-chip offering (AlGaInP for orange and InGaN for blue) within the same compact package footprint. This provides design flexibility. Compared to larger through-hole LEDs, its primary advantages are the dramatic reduction in board space and weight, compatibility with fully automated assembly, and compliance with modern environmental standards. The wide 120-degree viewing angle is suitable for applications requiring broad visibility.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why is a current-limiting resistor absolutely necessary? A: LED forward voltage decreases as junction temperature rises. Without a series resistor to regulate current, this can lead to thermal runaway—a small voltage increase causes more current, which heats the LED, lowering its Vf further, drawing even more current, ultimately causing failure.

Q: What does the 168-hour floor life mean? A: After the moisture-proof bag is opened, the components are exposed to ambient humidity. Absorbed moisture can vaporize during the high-temperature reflow soldering process, causing internal delamination or cracking ("popcorning"). The 168-hour limit is the maximum safe exposure time before this risk becomes unacceptable without re-baking.

Q: Can I drive the LED with a voltage source instead of a current source? A: It is strongly discouraged. Driving with a constant voltage, even with a series resistor, is less stable than a proper constant-current driver because it doesn't compensate for Vf variations due to temperature or binning. Always design for current control.

11. Practical Design and Usage Case

Scenario: Designing a multi-indicator panel. A designer needs compact orange and blue status LEDs on a densely populated control board. They select the 19-223/S2BHC-A01/2T for its small size and dual-color option from a single part number, simplifying procurement. They design separate current-limiting resistor values for the orange (VF~2.0V) and blue (VF~3.2V) LEDs to achieve similar brightness from a common 5V rail. They specify the PCB footprint exactly per the package drawing. During assembly, they ensure the tape reel is used within the floor life after opening and follow the recommended reflow profile to prevent thermal damage.

12. Technical Principle Introduction

Light emission in LEDs is based on electroluminescence in semiconductor materials. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine, releasing energy in the form of photons (light). The color (wavelength) of the emitted light is determined by the bandgap energy of the semiconductor material. The AlGaInP (Aluminum Gallium Indium Phosphide) material system is efficient for producing light in the amber to red-orange spectrum. The InGaN (Indium Gallium Nitride) material system is used for producing blue, green, and white (with phosphor) light. The SMD package encapsulates the semiconductor die in a clear or diffused epoxy resin, which also acts as a lens to shape the light output.

13. Technology Trends

The trend in indicator and backlight LEDs continues toward higher efficiency (more light output per unit of electrical power), smaller package sizes for increased density, and improved reliability. There is also a strong drive for broader adoption of environmentally friendly materials (halogen-free, Pb-free) and processes. Integration, such as incorporating current-limiting resistors or control ICs within the LED package, is another ongoing development to simplify end-user circuit design and improve performance consistency.

Application Restriction Notice: This product is intended for general-purpose applications. It may not be suitable for high-reliability applications without prior consultation and qualification. Such applications include, but are not limited to, military/aerospace systems, automotive safety/security systems (e.g., airbags, braking), and life-critical medical equipment. For these uses, products designed and qualified for the specific harsh environmental and reliability requirements must be sourced.