SMD LED 15-215/R6C-AQ1R2L/2T Datasheet - Brilliant Red - 2.0x1.25x0.8mm - 2.0V - 0.06W - English Technical Document

1. Product Overview

The 15-215/R6C-AQ1R2L/2T is a surface-mount device (SMD) LED designed for high-density PCB applications. It utilizes an AlGaInP chip to produce a brilliant red light output. Its compact form factor enables significant space savings on circuit boards, making it ideal for modern, miniaturized electronic devices where board real estate is at a premium. The component is supplied on 8mm tape mounted on a 7-inch diameter reel, ensuring compatibility with standard automated pick-and-place assembly equipment.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its exceptionally small size, lightweight construction, and suitability for automated high-volume manufacturing. These characteristics directly translate to reduced storage requirements, higher packing density on PCBs, and ultimately, the potential for smaller end-product designs. The device is compliant with lead-free (Pb-free) soldering processes, RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm), making it suitable for global markets with strict environmental regulations. Its target applications are diverse, ranging from backlighting for instrument panels, switches, and LCDs to status indicators in telecommunications equipment and general-purpose illumination.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet, crucial for reliable circuit design.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (I_F): 25mA DC. This is the maximum continuous current recommended for reliable long-term operation.
• Peak Forward Current (I_FP): 60mA at a 1/10 duty cycle and 1kHz. This rating allows for brief current pulses, useful in multiplexing schemes, but the average current must not exceed I_F.
• Power Dissipation (P_d): 60mW. This limit considers the total electrical power converted into heat (V_F * I_F) at the junction.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage). These wide ranges ensure functionality in harsh environments.
• Soldering Temperature: Reflow soldering peak of 260°C for 10 seconds maximum; hand soldering at 350°C for 3 seconds maximum per terminal.
• ESD Sensitivity: Human Body Model (HBM) rating of 2000V. This classifies it as moderately sensitive; standard ESD handling precautions are necessary.

2.2 Electro-Optical Characteristics

These parameters are specified at a junction temperature (T_j) of 25°C and a test current of 20mA. Real-world performance will vary with temperature and drive current.

• Luminous Intensity (I_v): 72.0 to 180.0 mcd (millicandela). The wide range is managed through a binning system (see Section 3). The typical value is not stated, implying selection is based on the specific bin code.
• Viewing Angle (2θ_1/2): 140 degrees (typical). This wide viewing angle indicates a Lambertian or near-Lambertian radiation pattern, suitable for area illumination rather than focused beams.
• Peak Wavelength (λ_p): 632 nm (typical). This is the wavelength at which the spectral power output is maximum.
• Dominant Wavelength (λ_d): 617.5 to 633.5 nm. This is the single-wavelength perception of the LED's color by the human eye and is also managed through binning.
• Spectral Bandwidth (Δλ): 20 nm (typical). This defines the range of wavelengths emitted at half the peak intensity, indicating a relatively pure red color.
• Forward Voltage (V_F): 1.70 to 2.30 V at 20mA. This range is also subject to binning. Lower V_F leads to lower power consumption and less heat generation for a given current.
• Reverse Current (I_R): 10 μA maximum at V_R=5V. A low leakage current is desirable.

3. Binning System Explanation

To ensure consistent color and brightness in production, LEDs are sorted into performance groups or \"bins.\" The 15-215 uses three independent binning criteria.

3.1 Luminous Intensity Binning

Intensity is sorted into four bins (Q1, Q2, R1, R2), with Q1 being the dimmest (72.0-90.0 mcd) and R2 the brightest (140.0-180.0 mcd). Designers must select the appropriate bin based on the required brightness for their application, considering that mixing bins in a single product may cause visible brightness variations.

3.2 Dominant Wavelength Binning

Color is sorted into four bins (E4, E5, E6, E7), covering the range from 617.5nm to 633.5nm. E4 represents a shorter, more orange-red wavelength, while E7 represents a longer, deeper red wavelength. Consistent color appearance requires using LEDs from the same or adjacent wavelength bins.

3.3 Forward Voltage Binning

Voltage is sorted into six bins (19 to 24), each spanning 0.1V from 1.70V to 2.30V. While less critical for simple indicator use with a current-limiting resistor, voltage binning becomes important in series-connected strings or constant-voltage drive scenarios to ensure uniform current distribution and brightness.

4. Performance Curve Analysis

While the provided datasheet excerpt mentions \"Typical Electro-Optical Characteristics Curves,\" the specific graphs are not included in the text. Typically, such curves would illustrate the following relationships, which are critical for advanced design:

• I-V (Current-Voltage) Curve: Shows the exponential relationship between forward voltage and current. The curve shifts with temperature.
• Luminous Intensity vs. Forward Current: Shows how light output increases with current, usually in a near-linear relationship within the operating range before efficiency drops at high currents.
• Luminous Intensity vs. Ambient Temperature: Shows the derating of light output as the junction temperature rises. Red AlGaInP LEDs typically have a more pronounced thermal quenching effect compared to some blue/white LEDs.
• Spectral Distribution: A graph showing the relative power emitted across wavelengths, centered around the peak wavelength (632 nm).

Designers should consult the full datasheet with graphs to accurately model thermal performance and predict behavior under different drive conditions.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a very compact footprint. Key dimensions (in mm, tolerance ±0.1mm unless specified) include a body size of approximately 2.0mm in length, 1.25mm in width, and 0.8mm in height. The datasheet includes a detailed dimensional drawing showing the placement of the cathode identifier (typically a notch or green marking on the package), pad layout, and recommended PCB land pattern. Adherence to these dimensions is essential for proper soldering and alignment.

5.2 Polarity Identification

Correct polarity is vital. The package includes a visual marker to identify the cathode (-) terminal. Designers must ensure the PCB footprint mirrors this orientation to prevent incorrect placement by automated machines.

6. Soldering and Assembly Guidelines

Proper handling is required to prevent damage to these miniature components.

6.1 Reflow Soldering Profile

The component is compatible with infrared and vapor phase reflow. A lead-free (Pb-free) profile is recommended: pre-heating between 150-200°C for 60-120 seconds, a time above liquidus (217°C) of 60-150 seconds, with a peak temperature not exceeding 260°C for a maximum of 10 seconds. The maximum ramp-up rate is 6°C/sec, and the maximum cooling rate is 3°C/sec. Reflow should not be performed more than twice.

6.2 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant. The bag should not be opened until the components are ready for use. After opening, the \"floor life\" is 1 year at ≤30°C and ≤60% RH. If exceeded, a baking treatment at 60±5°C for 24 hours is required before soldering to prevent \"popcorning\" damage during reflow.

6.3 Hand Soldering and Rework

If hand soldering is necessary, use a soldering iron with a tip temperature <350°C, apply heat to each terminal for ≤3 seconds, and use a low-power iron (<25W). A minimum 2-second interval between soldering each terminal is advised. For rework, a dual-head soldering iron is recommended to simultaneously heat both terminals and avoid mechanical stress. The feasibility of rework without damaging the LED should be verified beforehand.

7. Packaging and Ordering Information

The product is supplied in a moisture-shielded packing (MSP) format. Components are placed in a carrier tape with pockets, wound onto a 7-inch diameter reel. Each reel contains 2000 pieces. The reel and carrier tape have specific dimensions provided in the datasheet for compatibility with automated feeders. Labels on the reel and bag provide critical information: Customer Part Number (CPN), Product Number (P/N), quantity (QTY), and the specific bin codes for Luminous Intensity (CAT), Dominant Wavelength (HUE), and Forward Voltage (REF), along with the Lot Number.

8. Application Design Considerations

8.1 Current Limiting is Mandatory

LEDs are current-driven devices. An external current-limiting resistor or constant-current driver circuit is absolutely essential. The forward voltage has a negative temperature coefficient and a small variation can cause a large change in current if driven directly from a voltage source, potentially leading to thermal runaway and failure.

8.2 Thermal Management

Although small, the LED generates heat at the junction. For continuous operation at or near the maximum forward current (25mA), adequate PCB copper area (thermal relief pads) should be used to conduct heat away from the device and maintain a lower junction temperature, which preserves luminous output and longevity.

8.3 Application Restrictions

The datasheet explicitly states that this product is not designed or qualified for high-reliability applications such as military/aerospace, automotive safety/security systems, or medical life-support equipment without prior consultation and approval. For such applications, products with different specifications and qualification levels are required.

9. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive this LED at 30mA for higher brightness?
A: No. The Absolute Maximum Rating for continuous forward current (I_F) is 25mA. Exceeding this rating compromises reliability and may cause premature failure due to excessive junction temperature.

Q: What resistor value should I use with a 5V supply?
A: Using Ohm's Law: R = (V_supply - V_F) / I_F. Use the maximum V_F from your bin (e.g., 2.3V) for a conservative design to ensure current doesn't exceed 20mA. R = (5 - 2.3) / 0.02 = 135 Ω. A standard 150 Ω resistor would provide approximately 18mA, which is safe and within spec.

Q: Why is the luminous intensity range so wide (72-180 mcd)?
A: Manufacturing variations cause natural spreads in performance. The binning system (Q1, Q2, R1, R2) allows manufacturers to sort these parts and customers to select the brightness grade needed for their cost and performance targets.

10. Design and Usage Case Study

Scenario: Designing a status indicator panel with multiple uniform red LEDs.
A designer is creating a control panel that requires 20 identical bright red indicator LEDs. To ensure visual consistency:

1. Bin Selection: They specify bins R2 (140-180 mcd) for high brightness and E6/E7 (625.5-633.5 nm) for a consistent deep red color. They may also specify a tight voltage bin (e.g., 21 or 22) if the LEDs are driven in a shared constant-voltage configuration.
2. Circuit Design: A 5V rail is available. Using a target current of 20mA and a typical V_F of 2.0V, a 150 Ω current-limiting resistor is placed in series with each LED. The resistor power rating is (5-2)^2 / 150 = 0.06W, so a standard 1/8W (0.125W) resistor is sufficient.
3. PCB Layout: The PCB footprint follows the recommended land pattern from the datasheet. Additional copper pour is connected to the cathode and anode pads to aid heat dissipation, especially since the LEDs will be mounted closely together.
4. Assembly: The LEDs are ordered on tape and reel. The assembly house uses the provided reels with automated pick-and-place machines, following the Pb-free reflow profile specified in the datasheet.

This systematic approach, guided by the datasheet parameters, ensures a reliable, consistent, and manufacturable end product.