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SMD LED 17-215/G6C-FN2P2B/3T Datasheet - Brilliant Yellow Green - 2.0x1.25x0.8mm - 2.35V Max - 60mW - English Technical Document

Complete technical datasheet for the 17-215 SMD LED in Brilliant Yellow Green. Features include AIGaInP chip, 575nm peak wavelength, 130° viewing angle, RoHS/REACH/Halogen-Free compliance, and detailed specifications for design and assembly.
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PDF Document Cover - SMD LED 17-215/G6C-FN2P2B/3T Datasheet - Brilliant Yellow Green - 2.0x1.25x0.8mm - 2.35V Max - 60mW - English Technical Document

1. Product Overview

The 17-215/G6C-FN2P2B/3T is a surface-mount device (SMD) LED designed for high-density electronic assemblies. This component utilizes an AIGaInP (Aluminum Gallium Indium Phosphide) semiconductor chip to produce a Brilliant Yellow Green light output. Its primary advantage lies in its miniature footprint, which enables significant reductions in printed circuit board (PCB) size, increased component packing density, and ultimately contributes to the development of smaller and lighter end-user equipment. The device is supplied in industry-standard 8mm tape on 7-inch diameter reels, making it fully compatible with automated pick-and-place assembly equipment, thereby streamlining high-volume manufacturing processes.

The LED is classified as a mono-color type and is constructed using lead-free (Pb-free) materials. It complies with major international environmental and safety regulations, including the European Union's Restriction of Hazardous Substances (RoHS) directive, the Registration, Evaluation, Authorization and Restriction of Chemicals (REACH) regulation, and halogen-free standards (with Bromine <900 ppm, Chlorine <900 ppm, and their sum <1500 ppm). This compliance ensures its suitability for a wide range of global markets and applications with stringent material requirements.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These values are not intended for normal operation. For the 17-215 LED, the maximum continuous forward current (IF) is rated at 25 mA. Under pulsed conditions with a duty cycle of 1/10 at 1 kHz, the peak forward current (IFP) can reach 60 mA. The maximum permissible reverse voltage (VR) is 5 V; it is critical to note that the device is not designed for operation in reverse bias, and this rating primarily applies to the reverse current (IR) test condition. The total power dissipation (Pd) must not exceed 60 mW, calculated as the product of forward voltage and forward current. The device can withstand an electrostatic discharge (ESD) of 2000 V according to the Human Body Model (HBM). The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature (Tstg) extends slightly to +90°C.

2.2 Electro-Optical Characteristics

The electro-optical performance is specified at a standard test condition of an ambient temperature (Ta) of 25°C and a forward current of 20 mA. The luminous intensity (Iv) has a typical range from 36.00 mcd to 72.00 mcd, with a specified tolerance of ±11%. The spatial distribution of light is characterized by a wide viewing angle (2θ1/2) of 130 degrees, providing broad illumination. The spectral characteristics are defined by a peak wavelength (λp) of 575 nm and a dominant wavelength (λd) range from 570.00 nm to 574.50 nm (±1nm tolerance). The spectral bandwidth (Δλ) is approximately 20 nm. The forward voltage (VF) typically ranges from 1.75 V to 2.35 V at 20 mA, with a tolerance of ±0.1 V. The reverse current (IR) is guaranteed to be less than or equal to 10 μA when a reverse voltage of 5 V is applied.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific application requirements for brightness, color, and electrical behavior.

3.1 Luminous Intensity Binning

Luminous intensity is categorized into three primary bins measured at IF = 20 mA:

The tolerance for luminous intensity within a bin is ±11%.

3.2 Dominant Wavelength Binning

The dominant wavelength, which correlates closely with perceived color, is divided into three bins:

The tolerance for dominant wavelength is ±1 nm.

3.3 Forward Voltage Binning

Forward voltage is sorted into three bins to aid in circuit design, particularly for current-limiting resistor calculation and power supply design:

The tolerance for forward voltage is ±0.1 V.

4. Performance Curve Analysis

While the PDF indicates the presence of typical electro-optical characteristic curves on page 5, the specific graphs are not provided in the text content. Typically, such datasheets include curves illustrating the relationship between forward current and luminous intensity, forward voltage versus forward current, and the relative luminous intensity as a function of ambient temperature. These curves are essential for designers to understand the device's behavior under non-standard conditions. For instance, the luminous intensity typically decreases as the ambient temperature rises. The forward voltage also has a negative temperature coefficient, meaning it decreases slightly with increasing temperature. Designers should consult the graphical data to derate performance appropriately for their specific operating environment and to ensure stable current drive across the intended temperature range.

5. Mechanical and Package Information

5.1 Package Dimensions

The 17-215 SMD LED features a compact package. The key dimensions (in millimeters) are as follows, with a general tolerance of ±0.1 mm unless otherwise specified: The overall package length is 2.0 mm, the width is 1.25 mm, and the height is 0.8 mm. The device includes two anode/cathode terminals for electrical connection. Detailed dimensional drawings, including pad spacing, terminal size, and lens geometry, are provided in the datasheet to guide PCB land pattern design for optimal soldering and mechanical stability.

5.2 Polarity Identification

Correct polarity is crucial for LED operation. The datasheet's package drawing clearly indicates the anode and cathode terminals. Typically, one terminal may be marked or have a different shape (e.g., a notch or a chamfered corner) to facilitate visual identification during manual assembly or inspection. Designers must ensure the PCB footprint mirrors this polarity to prevent incorrect placement.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with infrared and vapor phase reflow soldering processes. For Pb-free soldering, a specific temperature profile must be followed:

It is strongly recommended that reflow soldering be performed no more than two times to prevent thermal stress damage to the LED package and internal wire bonds.

6.2 Hand Soldering

If hand soldering is unavoidable, extreme care must be taken. The soldering iron tip temperature should be below 350°C, and contact time with each terminal must not exceed 3 seconds. The soldering iron power should be 25W or less. A minimum interval of 2 seconds should be left between soldering each terminal. Using a double-head soldering iron for repair is suggested to minimize thermal stress, but repair after initial soldering is generally discouraged.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant. The bag must not be opened until the components are ready for use. After opening:

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The product is supplied in a standard "ammo pack" style carrier tape with a width of 8 mm, wound onto a 7-inch (178 mm) diameter reel. Each reel contains 3000 pieces. Detailed dimensions for the reel, carrier tape pockets, and cover tape are provided to ensure compatibility with automated feeders.

7.2 Label Explanation

The packaging label contains several key codes for traceability and specification:

8. Application Recommendations

8.1 Typical Application Scenarios

The Brilliant Yellow Green color and compact size make this LED suitable for various indicator and backlighting functions:

8.2 Critical Design Considerations

Current Limiting is Mandatory: LEDs are current-driven devices. An external current-limiting resistor must always be used in series with the LED. The value is calculated based on the supply voltage (Vsupply), the LED's forward voltage (VF from its bin), and the desired forward current (IF, typically 20 mA or less). The formula is: R = (Vsupply - VF) / IF. Without this resistor, even a small increase in supply voltage can cause a large, destructive increase in current.

Thermal Management: While the power dissipation is low, ensuring adequate PCB copper area around the LED pads can help dissipate heat, especially in high ambient temperature environments or when driven at the maximum continuous current. This helps maintain luminous output and longevity.

Application Restrictions: This standard commercial-grade LED is not specifically designed or qualified for high-reliability applications where failure could lead to safety risks. This includes, but is not limited to, military/aerospace systems, automotive safety-critical systems (e.g., brake lights, airbag indicators), and life-supporting medical equipment. For such applications, components with appropriate qualifications and reliability data should be sourced.

9. Technical Comparison and Differentiation

The primary differentiating factors of the 17-215 LED are its combination of a specific AIGaInP chip material yielding a Brilliant Yellow Green color, its very compact 2012 (2.0x1.25mm) footprint, and its compliance with modern environmental standards (Pb-free, Halogen-Free, RoHS, REACH). Compared to older through-hole or larger SMD LEDs, it enables significant miniaturization. Compared to other yellow-green LEDs, the AIGaInP technology typically offers higher luminous efficiency and better color stability over temperature and current variations than some alternative semiconductor materials used for similar colors. The wide 130-degree viewing angle is also a key feature for applications requiring broad, even illumination rather than a focused beam.

10. Frequently Asked Questions (FAQ)

Q1: What is the difference between peak wavelength (λp) and dominant wavelength (λd)?
A1: Peak wavelength is the wavelength at which the spectral power distribution is maximum. Dominant wavelength is the single wavelength of monochromatic light that matches the perceived color of the LED. For LEDs with a relatively narrow spectrum, they are often close, but λd is more relevant for color specification in applications.

Q2: Can I drive this LED without a current-limiting resistor if I use a constant voltage source set to the LED's forward voltage?
A2: No, this is not recommended and is likely to damage the LED. The forward voltage has a tolerance and a negative temperature coefficient. A slight variation in supply voltage or a rise in LED temperature can cause a significant and uncontrolled increase in current, leading to overheating and failure. Always use a series resistor or a dedicated constant-current driver.

Q3: Why is there a strict "floor life" after opening the moisture barrier bag?
A3: SMD components can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can rapidly vaporize, creating internal pressure that may cause package cracking ("popcorning") or delamination, leading to failure. The floor life and baking procedures manage this moisture sensitivity level (MSL).

Q4: How do I interpret the bin codes (CAT, HUE, REF) when ordering?
A4: You can specify the exact bin codes you require based on your application's needs for brightness (CAT), color (HUE), and forward voltage (REF). Ordering tighter bins ensures greater consistency in your final product's appearance and electrical performance. If not specified, you will receive components from standard production bins.

11. Practical Design and Usage Examples

Example 1: Dashboard Switch Backlighting
In an automotive dashboard, multiple 17-215 LEDs can be placed behind translucent switch caps. A microcontroller GPIO pin, via a transistor, can supply power from the vehicle's 12V system. A series resistor is calculated for each LED. For example, using a 12V supply, a VF of 2.1V (Bin 1), and a target IF of 20mA: R = (12V - 2.1V) / 0.02A = 495 Ohms. A standard 510 Ohm resistor would be suitable, resulting in IF ≈ 19.4 mA. The wide viewing angle ensures the switch is evenly lit.

Example 2: Status Indicator on a Network Device
For a "Link Active" indicator on a router, a single LED can be driven directly from a 3.3V logic signal. Using VF = 1.9V (Bin 0) and IF = 15 mA for reduced power and longer life: R = (3.3V - 1.9V) / 0.015A ≈ 93.3 Ohms. A 100 Ohm resistor would be used. The Brilliant Yellow Green color is highly visible and commonly associated with network activity.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through a process called electroluminescence. The 17-215 LED uses an AIGaInP (Aluminum Gallium Indium Phosphide) compound semiconductor. When a forward voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. When these charge carriers (electrons and holes) recombine, they release energy. In AIGaInP materials, this energy is released primarily as photons (light particles) with a wavelength corresponding to the bandgap energy of the semiconductor material. The specific composition of the Al, Ga, In, and P atoms is engineered to produce a bandgap that results in yellow-green light with a peak wavelength around 575 nm. The epoxy resin lens encapsulates the chip, protects it, and shapes the light output to achieve the desired 130-degree viewing angle.

13. Technology Trends and Developments

The general trend in SMD LED technology continues toward several key areas: Increased Efficiency: Ongoing material science and chip design improvements aim to produce more lumens per watt (lm/W), reducing power consumption for a given light output. Miniaturization: Packages continue to shrink (e.g., from 2012 to 1608, 1005 metric sizes) to support ever-smaller consumer electronics. Improved Color Rendering and Consistency: Advances in phosphor technology (for white LEDs) and epitaxial growth processes (for colored LEDs like AIGaInP) lead to tighter color bins and more stable performance over lifetime and temperature. Higher Reliability: Enhanced packaging materials and manufacturing processes are extending LED lifetimes and improving resistance to thermal and environmental stress. Integrated Solutions: There is a growing market for LEDs with built-in current-limiting resistors, protection diodes, or even driver ICs, simplifying circuit design. The 17-215 represents a mature, widely adopted package and technology that benefits from these ongoing industry-wide refinements in manufacturing yield and performance.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.