SMD LED 17-21/G6C-AP1Q1B/3T Datasheet - Size 1.6x0.8x0.6mm - Voltage 1.75-2.35V - Brilliant Yellow Green - English Technical Document

1. Product Overview

The 17-21/G6C-AP1Q1B/3T is a surface-mount device (SMD) LED designed for high-density, miniature applications. It utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) chip to produce a Brilliant Yellow Green light output. This LED is packaged in a compact 1.6mm x 0.8mm x 0.6mm footprint, enabling significant space savings on printed circuit boards (PCBs) compared to traditional leaded components. Its small size and lightweight nature make it ideal for modern electronics where miniaturization is a key design constraint.

The device is compliant with major environmental and safety standards, including RoHS (Restriction of Hazardous Substances), EU REACH regulations, and is classified as Halogen-Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It is supplied on 8mm tape mounted on 7-inch diameter reels, making it fully compatible with automated pick-and-place assembly equipment. The LED is suitable for both infrared and vapor phase reflow soldering processes.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C. The maximum reverse voltage (VR) is 5V. The continuous forward current (IF) should not exceed 25mA. For pulsed operation, a peak forward current (IFP) of 60mA is permissible under a duty cycle of 1/10 at 1kHz. The maximum power dissipation (Pd) is 60mW. The device can withstand an electrostatic discharge (ESD) of 2000V per the Human Body Model (HBM). The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature range (Tstg) is slightly wider, from -40°C to +90°C. The soldering temperature (Tsol) profile is critical: for reflow soldering, the peak temperature should not exceed 260°C for a maximum of 10 seconds; for hand soldering, the iron tip temperature should be 350°C or less for a maximum of 3 seconds per terminal.

2.2 Electro-Optical Characteristics

The Electro-Optical Characteristics are measured at Ta=25°C and an operating current (IF) of 20mA, which is the standard test condition. The luminous intensity (Iv) has a typical range from 45.0 mcd to 90.0 mcd, with specific values determined by the binning code (see Section 3). The viewing angle (2θ1/2) is typically 140 degrees, providing a wide beam pattern. The peak wavelength (λp) is centered around 575 nm. The dominant wavelength (λd), which defines the perceived color, ranges from 569.5 nm to 577.5 nm. The spectral bandwidth (Δλ) is approximately 20 nm. The forward voltage (VF) ranges from 1.75V to 2.35V, also subject to binning. The reverse current (IR) is a maximum of 10 μA when a reverse voltage (VR) of 5V is applied. It is crucial to note that the device is not designed for operation under reverse bias; the VR rating is for IR testing purposes only.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific application requirements.

3.1 Luminous Intensity Binning

Luminous intensity is binned into three primary codes at IF=20mA: P1 (45.0-57.0 mcd), P2 (57.0-72.0 mcd), and Q1 (72.0-90.0 mcd). The part number suffix \"Q1\" in 17-21/G6C-AP1Q1B/3T indicates it belongs to the highest brightness Q1 bin.

3.2 Dominant Wavelength Binning

Dominant wavelength, which determines the precise shade of yellow-green, is binned into four codes: C16 (569.5-571.5 nm), C17 (571.5-573.5 nm), C18 (573.5-575.5 nm), and C19 (575.5-577.5 nm). The suffix \"C\" in the part number corresponds to this chromaticity coordinate and wavelength rank.

3.3 Forward Voltage Binning

Forward voltage is binned to aid in circuit design, particularly for current-limiting resistor calculation. The bins are: 0 (1.75-1.95 V), 1 (1.95-2.15 V), and 2 (2.15-2.35 V). The suffix \"B\" in the part number indicates the forward voltage rank.

4. Performance Curve Analysis

While specific graphical curves are not detailed in the provided text, typical performance curves for such LEDs would include the relationship between forward current (IF) and forward voltage (VF), showing the exponential nature of the diode. The relationship between luminous intensity and forward current is generally linear within the operating range. The temperature dependence of luminous intensity typically shows a decrease in output as junction temperature increases. The spectral distribution curve would show a single peak centered around 575 nm with the specified 20 nm bandwidth, confirming the monochromatic yellow-green output.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard 17-21 SMD package. The key dimensions are: a length of 1.6 mm, a width of 0.8 mm, and a height of 0.6 mm. The package features a cathode mark for correct polarity identification during assembly. All unspecified tolerances are ±0.1 mm. The compact size is a primary advantage, enabling high-density PCB layouts.

5.2 Polarity Identification

Correct polarity is essential for operation. The package includes a distinct cathode mark. Installing the LED in reverse bias can lead to immediate failure due to the low maximum reverse voltage rating (5V).

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with lead-free (Pb-free) reflow soldering. The recommended temperature profile is critical: pre-heating should occur between 150°C and 200°C for 60-120 seconds. The time above the solder liquidus temperature (217°C) should be 60-150 seconds. The peak temperature must not exceed 260°C, and the time at or above 255°C should be limited to a maximum of 30 seconds. The maximum heating rate should be 6°C/sec, and the maximum cooling rate should be 3°C/sec. Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken. The soldering iron tip temperature should be less than 350°C, and contact time with each terminal should not exceed 3 seconds. The soldering iron power should be 25W or less. A minimum interval of 2 seconds should be left between soldering each terminal to allow heat dissipation and prevent thermal damage.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant. The bag must not be opened until the components are ready for use. After opening, unused LEDs should be stored at 30°C or less and 60% relative humidity (RH) or less. The \"floor life\" after opening is 168 hours (7 days). If this time is exceeded or if the desiccant indicator has changed color, the LEDs must be baked at 60 ±5°C for 24 hours before use to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Packaging and Ordering Information

The device is supplied in moisture-resistant packaging. It is loaded into an 8mm wide carrier tape, which is then wound onto a 7-inch diameter reel. Each reel contains 3000 pieces. The packaging labels include critical information: Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity/Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Recommendations

8.1 Typical Application Scenarios

The Brilliant Yellow Green color and compact size make this LED suitable for various indicator and backlighting applications. Common uses include backlighting for instrument panel dashboards and membrane switches, status indicators and keypad backlighting in telecommunication devices (phones, fax machines), flat backlighting for small LCDs and symbols, and general-purpose indicator applications in consumer and industrial electronics.

8.2 Design Considerations

Current Limiting: An external current-limiting resistor is mandatory. The LED is a current-driven device, and even a small increase in forward voltage can cause a large, potentially destructive increase in current. The resistor value must be calculated based on the supply voltage, the forward voltage bin of the LED (Vf), and the desired operating current (e.g., 20mA).
Thermal Management: Although power dissipation is low, ensuring adequate PCB copper area around the thermal pads (if any) or traces connected to the anode and cathode can help dissipate heat and maintain LED performance and longevity, especially in high ambient temperature environments.
ESD Protection: While the LED has a 2000V HBM ESD rating, standard ESD handling precautions should be observed during assembly and handling.

9. Technical Comparison and Differentiation

The primary advantage of this 17-21 LED is its extremely small footprint (1.6x0.8mm), which is significantly smaller than traditional 3mm or 5mm through-hole LEDs, enabling miniaturization. The use of AlGaInP technology provides high efficiency and a saturated yellow-green color compared to older technologies. The wide 140-degree viewing angle offers good off-axis visibility. Its compliance with modern environmental standards (RoHS, Halogen-Free) makes it suitable for global markets with strict regulations.

10. Frequently Asked Questions (FAQ)

Q: What is the purpose of the binning codes (P1, C17, B, etc.)?
A: Binning ensures consistency. Designers can specify a bin code to guarantee LEDs in their production run have nearly identical brightness (P1/Q1), color (C16-C19), and forward voltage (0-2), leading to uniform appearance and performance in the final product.

Q: Can I drive this LED without a current-limiting resistor?
A: No. Driving an LED directly from a voltage source is a common cause of immediate failure. The forward voltage has a tolerance, and a slight over-voltage causes an over-current, burning out the LED. A series resistor is always required.

Q: The datasheet shows a max current of 25mA but a test condition of 20mA. Which should I use?
A: For reliable long-term operation, it is standard practice to derate components. Operating at 20mA provides a safety margin below the absolute maximum of 25mA, improving lifespan and reliability. 20mA is the recommended operating current.

Q: Why is the storage and baking process so important?
A: SMD packages can absorb moisture from the air. During the high heat of reflow soldering, this moisture can turn to steam rapidly, causing internal delamination or cracking (\"popcorning\"). The baking process safely removes this moisture.

11. Practical Design and Usage Examples

Example 1: Dashboard Indicator: In an automotive dashboard, multiple 17-21 LEDs can be placed behind translucent icons (e.g., check engine, low fuel). Using LEDs from the same luminous intensity (Q1) and dominant wavelength (e.g., C18) bins ensures all icons light up with equal brightness and identical color, providing a professional, consistent look. A simple circuit with a 12V supply, a current-limiting resistor calculated for ~18mA (to account for vehicle voltage variations), and a driver transistor controlled by the vehicle's ECU would be typical.

Example 2: Portable Device Backlight: For backlighting a keypad on a handheld device, the low profile (0.6mm height) of the 17-21 LED is crucial. It can be placed directly under a thin rubber keypad or light guide. Power would be supplied from a low-voltage battery (e.g., 3.3V). The forward voltage bin (e.g., Bin 1: 1.95-2.15V) must be used to accurately calculate the series resistor value to maintain consistent brightness as the battery discharges.

12. Operating Principle Introduction

This LED is a semiconductor photonic device. The core is a chip made of AlGaInP layers grown on a substrate. When a forward voltage exceeding the diode's threshold (around 1.8-2.0V) is applied, electrons and holes are injected into the active region of the chip. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, Brilliant Yellow Green at approximately 575 nm. The epoxy resin lens surrounding the chip is \"water clear\" to maximize light extraction and shape the beam to the 140-degree viewing angle.

13. Technology Trends and Context

The 17-21 package represents a step in the ongoing trend of electronic component miniaturization. As end products like smartphones, wearables, and IoT devices shrink, the demand for smaller, lower-profile LEDs increases. The shift to AlGaInP from older technologies like GaAsP offers higher efficiency, meaning brighter light output for the same current, or the same brightness with lower power consumption—a critical factor for battery-powered devices. Furthermore, the industry-wide move towards Pb-free soldering and halogen-free materials, as seen in this component, is driven by global environmental regulations and consumer demand for \"greener\" electronics. Future trends may push for even smaller packages, higher efficiency, and integrated solutions combining the LED driver circuitry within the package.