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SMD LED 19-217/G7C-AN1P2/3T Datasheet - Brilliant Yellow-Green - 2.0x1.25x0.8mm - 2.0V - 60mW - English Technical Document

Technical datasheet for the 19-217/G7C-AN1P2/3T SMD LED. Features include brilliant yellow-green color, 2.0x1.25x0.8mm package, 2.0V forward voltage, 60mW power dissipation, and RoHS/REACH compliance.
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PDF Document Cover - SMD LED 19-217/G7C-AN1P2/3T Datasheet - Brilliant Yellow-Green - 2.0x1.25x0.8mm - 2.0V - 60mW - English Technical Document

1. Product Overview

The 19-217/G7C-AN1P2/3T is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It utilizes AlGaInP chip technology to produce a brilliant yellow-green light output. Its primary advantage lies in its miniature footprint, enabling significant reductions in printed circuit board (PCB) size and overall equipment dimensions. This contributes to higher packing density and reduced storage requirements. The component is lightweight, making it particularly suitable for applications where space and weight are critical constraints.

The LED is supplied in industry-standard 8mm tape on 7-inch diameter reels, ensuring compatibility with automated pick-and-place assembly equipment. It is formulated to be lead-free (Pb-free) and complies with major environmental regulations including RoHS, EU REACH, and halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). The device is compatible with both infrared and vapor phase reflow soldering processes.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=20mA, unless otherwise specified. They define the optical and electrical performance of the LED.

Tolerances: Luminous Intensity has a ±11% tolerance, and Dominant Wavelength has a ±1nm tolerance from the bin center values.

3. Binning System Explanation

To ensure consistent color and brightness in production, LEDs are sorted into bins based on measured performance.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins (N1, N2, P1, P2) based on their measured luminous intensity at IF=20mA.

3.2 Dominant Wavelength Binning

LEDs are categorized into four bins (C16, C17, C18, C19) based on their dominant wavelength.

This two-dimensional binning (Intensity + Wavelength) allows designers to select components that meet specific brightness and color point requirements for their application, ensuring visual consistency across multiple LEDs.

4. Performance Curve Analysis

The datasheet references typical electro-optical characteristic curves. While the specific graphs are not detailed in the provided text, standard curves for such an LED would typically include:

These curves are essential for predicting real-world performance under non-standard conditions (different drive currents, temperatures) and for proper circuit design.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD package. Key dimensions (in mm, tolerance ±0.1mm unless noted) are:

5.2 Polarity Identification

The cathode is typically marked on the device, often by a notch, a dot, or a green tint on the cathode side of the lens. The PCB footprint should be designed to match this polarity. Incorrect polarity connection will prevent the LED from illuminating and may stress the device.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A lead-free (Pb-free) reflow profile is recommended:

Critical: Reflow soldering should not be performed more than two times on the same LED assembly.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant.

6.4 Rework and Repair

Repair after soldering is strongly discouraged. If absolutely necessary, a specialized double-head soldering iron must be used to simultaneously heat both terminals, minimizing thermal stress. The impact on LED characteristics must be verified beforehand.

7. Packaging and Ordering Information

7.1 Packaging Specifications

The product is supplied for automated assembly:

7.2 Label Information

The reel label contains critical information for traceability and correct application:

8. Application Recommendations

8.1 Typical Application Scenarios

8.2 Design Considerations

9. Technical Comparison and Differentiation

The 19-217 LED differentiates itself primarily through its combination of a specific brilliant yellow-green color (using AlGaInP technology) and a very compact 2.0x1.25mm footprint. Compared to larger lead-frame LEDs, it offers significant space savings. Compared to other SMD colors, the AlGaInP technology typically offers higher luminous efficiency in the amber-yellow-green spectrum than older technologies. Its wide 120-degree viewing angle is a key feature for applications requiring broad visibility, as opposed to narrow-beam LEDs used for focused illumination.

10. Frequently Asked Questions (FAQs)

Q: Why is a current-limiting resistor absolutely necessary?

A: LEDs are current-driven devices. Their forward voltage is not a fixed value but has a manufacturing tolerance and varies with temperature. Connecting an LED directly to a voltage source, even one close to its typical VF, can result in excessive current flow, rapidly overheating and destroying the LED ("thermal runaway"). The series resistor provides a linear, predictable method to set the operating current.

Q: Can I drive this LED with a pulsed current higher than 25mA?

A: Yes, but only under specific conditions. The datasheet specifies a Peak Forward Current (IFP) of 60mA, but this is allowed only with a low duty cycle (1/10 or 10%) and at a frequency of 1kHz. Continuous operation above 25mA is not permitted and will exceed the power dissipation rating, leading to failure.

Q: What do the bin codes (e.g., P1, C18) mean for my design?

A: The bin codes ensure color and brightness consistency. If your product uses multiple LEDs and requires uniform appearance, you must specify and use LEDs from the same intensity and wavelength bins. Mixing bins may result in visibly different brightness or color shades between adjacent LEDs.

Q: How critical is the 7-day floor life after opening the moisture barrier bag?

A: It is very important for soldering reliability. SMD components can absorb moisture from the air. During reflow soldering, this trapped moisture can rapidly vaporize, causing internal delamination or "popcorning," which can crack the package and cause failure. Adhering to the storage and baking guidelines is essential for high-yield manufacturing.

11. Practical Design and Usage Case

Scenario: Designing a status indicator panel with 10 uniform yellow-green LEDs.

  1. Component Selection: Specify to your supplier that you require all LEDs from the same bin, e.g., Intensity Bin P1 (45-57 mcd) and Wavelength Bin C18 (573.5-575.5 nm). This is crucial for visual consistency.
  2. Circuit Design: Using a 5V supply and targeting a drive current of 20mA. Assuming a conservative VF of 2.4V (max), calculate the series resistor: R = (5V - 2.4V) / 0.020A = 130 Ohms. The nearest standard value is 130Ω or 120Ω. The power rating of the resistor: P = I^2 * R = (0.02^2) * 130 = 0.052W, so a standard 1/8W (0.125W) resistor is sufficient.
  3. PCB Layout: Use the exact land pattern from the datasheet's package dimension drawing. Ensure adequate spacing between LEDs for even light distribution and to avoid thermal coupling.
  4. Assembly: Keep the reel sealed until the production line is ready. Follow the reflow profile precisely. After assembly, avoid bending or flexing the PCB near the LEDs to prevent stress on the solder joints.

12. Operating Principle Introduction

This LED is based on AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material. When a forward voltage exceeding the diode's junction potential (approximately 1.7-2.4V) is applied, electrons and holes are injected into the active region of the semiconductor. These charge carriers recombine, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light. In this case, the composition is tuned to produce photons in the yellow-green region of the visible spectrum, centered around 575 nanometers. The epoxy resin lens serves to protect the semiconductor chip, shape the light output beam (resulting in the 120-degree viewing angle), and enhance light extraction from the chip.

13. Technology Trends

The development of SMD LEDs like the 19-217 follows several key industry trends: Miniaturization continues to be a primary driver, enabling ever-smaller electronic devices. Increased Efficiency in materials like AlGaInP leads to higher luminous intensity from the same or smaller chip sizes. Environmental Compliance (RoHS, REACH, Halogen-Free) has become a standard requirement, not an option. Automation Compatibility through standardized tape-and-reel packaging is essential for high-volume, cost-effective manufacturing. Finally, there is a trend towards more precise and tighter Binning and Color Control to meet the demands of applications requiring high color consistency, such as full-color displays and automotive lighting, even though this particular component is a mono-color type.

13.1 Application Restrictions Note

The datasheet includes an important disclaimer regarding high-reliability applications. This product, as specified, may not be suitable for safety-critical systems such as automotive safety (e.g., brake lights), aerospace, military, or medical life-support equipment without additional qualification and possibly a different product grade. For such applications, consultation with the manufacturer is required to identify components designed and tested for the stringent reliability standards of those fields.

LED Specification Terminology

Complete explanation of LED technical terms

Photoelectric Performance

Term Unit/Representation Simple Explanation Why Important
Luminous Efficacy lm/W (lumens per watt) Light output per watt of electricity, higher means more energy efficient. Directly determines energy efficiency grade and electricity cost.
Luminous Flux lm (lumens) Total light emitted by source, commonly called "brightness". Determines if the light is bright enough.
Viewing Angle ° (degrees), e.g., 120° Angle where light intensity drops to half, determines beam width. Affects illumination range and uniformity.
CCT (Color Temperature) K (Kelvin), e.g., 2700K/6500K Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. Determines lighting atmosphere and suitable scenarios.
CRI / Ra Unitless, 0–100 Ability to render object colors accurately, Ra≥80 is good. Affects color authenticity, used in high-demand places like malls, museums.
SDCM MacAdam ellipse steps, e.g., "5-step" Color consistency metric, smaller steps mean more consistent color. Ensures uniform color across same batch of LEDs.
Dominant Wavelength nm (nanometers), e.g., 620nm (red) Wavelength corresponding to color of colored LEDs. Determines hue of red, yellow, green monochrome LEDs.
Spectral Distribution Wavelength vs intensity curve Shows intensity distribution across wavelengths. Affects color rendering and quality.

Electrical Parameters

Term Symbol Simple Explanation Design Considerations
Forward Voltage Vf Minimum voltage to turn on LED, like "starting threshold". Driver voltage must be ≥Vf, voltages add up for series LEDs.
Forward Current If Current value for normal LED operation. Usually constant current drive, current determines brightness & lifespan.
Max Pulse Current Ifp Peak current tolerable for short periods, used for dimming or flashing. Pulse width & duty cycle must be strictly controlled to avoid damage.
Reverse Voltage Vr Max reverse voltage LED can withstand, beyond may cause breakdown. Circuit must prevent reverse connection or voltage spikes.
Thermal Resistance Rth (°C/W) Resistance to heat transfer from chip to solder, lower is better. High thermal resistance requires stronger heat dissipation.
ESD Immunity V (HBM), e.g., 1000V Ability to withstand electrostatic discharge, higher means less vulnerable. Anti-static measures needed in production, especially for sensitive LEDs.

Thermal Management & Reliability

Term Key Metric Simple Explanation Impact
Junction Temperature Tj (°C) Actual operating temperature inside LED chip. Every 10°C reduction may double lifespan; too high causes light decay, color shift.
Lumen Depreciation L70 / L80 (hours) Time for brightness to drop to 70% or 80% of initial. Directly defines LED "service life".
Lumen Maintenance % (e.g., 70%) Percentage of brightness retained after time. Indicates brightness retention over long-term use.
Color Shift Δu′v′ or MacAdam ellipse Degree of color change during use. Affects color consistency in lighting scenes.
Thermal Aging Material degradation Deterioration due to long-term high temperature. May cause brightness drop, color change, or open-circuit failure.

Packaging & Materials

Term Common Types Simple Explanation Features & Applications
Package Type EMC, PPA, Ceramic Housing material protecting chip, providing optical/thermal interface. EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life.
Chip Structure Front, Flip Chip Chip electrode arrangement. Flip chip: better heat dissipation, higher efficacy, for high-power.
Phosphor Coating YAG, Silicate, Nitride Covers blue chip, converts some to yellow/red, mixes to white. Different phosphors affect efficacy, CCT, and CRI.
Lens/Optics Flat, Microlens, TIR Optical structure on surface controlling light distribution. Determines viewing angle and light distribution curve.

Quality Control & Binning

Term Binning Content Simple Explanation Purpose
Luminous Flux Bin Code e.g., 2G, 2H Grouped by brightness, each group has min/max lumen values. Ensures uniform brightness in same batch.
Voltage Bin Code e.g., 6W, 6X Grouped by forward voltage range. Facilitates driver matching, improves system efficiency.
Color Bin 5-step MacAdam ellipse Grouped by color coordinates, ensuring tight range. Guarantees color consistency, avoids uneven color within fixture.
CCT Bin 2700K, 3000K etc. Grouped by CCT, each has corresponding coordinate range. Meets different scene CCT requirements.

Testing & Certification

Term Standard/Test Simple Explanation Significance
LM-80 Lumen maintenance test Long-term lighting at constant temperature, recording brightness decay. Used to estimate LED life (with TM-21).
TM-21 Life estimation standard Estimates life under actual conditions based on LM-80 data. Provides scientific life prediction.
IESNA Illuminating Engineering Society Covers optical, electrical, thermal test methods. Industry-recognized test basis.
RoHS / REACH Environmental certification Ensures no harmful substances (lead, mercury). Market access requirement internationally.
ENERGY STAR / DLC Energy efficiency certification Energy efficiency and performance certification for lighting. Used in government procurement, subsidy programs, enhances competitiveness.