SMD LED 16-213/R6C-AQ2R2B/3T Datasheet - Brilliant Red - 20mA - 1.75-2.35V - English Technical Document

1. Product Overview

The 16-213 is a surface-mount device (SMD) LED designed for high-density, miniature applications. It utilizes AlGaInP semiconductor technology to produce a Brilliant Red light output. Its compact form factor enables significant space savings on printed circuit boards (PCBs) compared to traditional lead-frame components, contributing to smaller end-product designs and reduced storage requirements.

1.1 Core Advantages

• Miniaturization: The small package size allows for higher packing density and enables the design of more compact electronic equipment.
• Lightweight: Ideal for applications where weight is a critical factor.
• Compatibility: Packaged in 8mm tape on 7-inch reels, making it fully compatible with standard automatic pick-and-place assembly equipment.
• Environmental Compliance: The product is Pb-free, compliant with RoHS, EU REACH, and Halogen-Free standards (Br <900ppm, Cl <900ppm, Br+Cl <1500ppm).
• Process Compatibility: Suitable for both infrared (IR) and vapor phase reflow soldering processes.

1.2 Target Applications

This LED is well-suited for a variety of indicator and backlighting functions, including:

• Dashboard and switch backlighting in automotive and industrial controls.
• Status indicators and keypad backlighting in telecommunication devices such as telephones and fax machines.
• Flat backlighting for LCD panels, switches, and symbols.
• General-purpose indicator applications.

2. Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

3. Electro-Optical Characteristics

These parameters are measured at an ambient temperature (T_a) of 25°C and a forward current (I_F) of 20mA, unless otherwise specified. They represent the typical performance of the device.

Notes:

1. Tolerance of Luminous Intensity: ±11%
2. Tolerance of Dominant Wavelength: ±1nm
3. Tolerance of Forward Voltage: ±0.05V

4. Binning System Explanation

To ensure consistency in application performance, LEDs are sorted (binned) based on key parameters. The 16-213 uses a three-code binning system.

4.1 Luminous Intensity Binning (CAT)

This code indicates the minimum and maximum luminous intensity at I_F=20mA.

4.2 Dominant Wavelength Binning (HUE)

This code defines the color purity range of the emitted red light.

4.3 Forward Voltage Binning (REF)

This code groups LEDs by their forward voltage drop at I_F=20mA, which is critical for current-limiting resistor calculation and power supply design.

5. Performance Curve Analysis

The following typical curves provide insight into the device's behavior under varying conditions. All curves are measured at T_a=25°C unless noted.

5.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between applied voltage and resulting current. The forward voltage (V_F) is typically between 1.75V and 2.35V at the standard operating current of 20mA. Designers must use a series current-limiting resistor to prevent thermal runaway, as a small increase in voltage beyond the knee point causes a large, potentially destructive increase in current.

5.2 Luminous Intensity vs. Forward Current

Luminous intensity increases approximately linearly with forward current up to the maximum rated current. Operating above the absolute maximum rating (25mA continuous) will reduce lifetime and reliability.

5.3 Luminous Intensity vs. Ambient Temperature

LED light output decreases as the junction temperature rises. The curve shows the relative luminous intensity dropping as ambient temperature increases from -40°C to +85°C. This derating must be accounted for in designs where the LED operates in high-temperature environments or at high drive currents.

5.4 Forward Current Derating Curve

This critical curve defines the maximum allowable continuous forward current as a function of ambient temperature. To ensure reliable operation and prevent overheating, the forward current must be reduced when operating at high ambient temperatures.

5.5 Spectral Distribution

The spectrum is centered around a typical peak wavelength (λ_p) of 632nm with a full width at half maximum (FWHM) of approximately 20nm, characteristic of AlGaInP-based red LEDs. The dominant wavelength (λ_d) defines the perceived color.

5.6 Radiation Pattern

The LED features a wide viewing angle of 120 degrees (2θ_1/2), providing a broad, even emission pattern suitable for area illumination and indicator applications where wide visibility is required.

6. Mechanical & Packaging Information

6.1 Package Dimensions

The physical outline and critical dimensions of the LED package are provided in the datasheet. Tolerances are typically ±0.1mm unless otherwise specified. Designers should refer to the exact drawing for footprint creation.

6.2 Suggested Pad Layout

A recommended land pattern (footprint) for PCB design is included. This pattern is for reference only and should be optimized based on specific manufacturing processes, solder paste volume, and thermal management requirements.

6.3 Polarity Identification

The cathode is typically marked on the device. Correct polarity orientation is essential during assembly to prevent reverse bias damage.

7. Soldering & Assembly Guidelines

7.1 Reflow Soldering Profile (Pb-free)

The LED is compatible with standard infrared or vapor phase reflow processes using Pb-free solder. The recommended temperature profile includes:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (TAL): 60-150 seconds above 217°C.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Ramp-up Rate: Maximum 3°C/second to 255°C, then maximum 6°C/second to peak.
• Ramp-down Rate: Maximum 6°C/second.

Critical: Reflow soldering should not be performed more than two times on the same device.

7.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:

• Use a soldering iron with a tip temperature not exceeding 350°C.
• Limit contact time to a maximum of 3 seconds per terminal.
• Use an iron with a power rating of 25W or less.
• Allow a cooling interval of at least 2 seconds between soldering each terminal.
• Avoid applying mechanical stress to the LED body during heating.

7.3 Rework & Repair

Repair after the LED is soldered is strongly discouraged. If unavoidable, a specialized double-head soldering iron must be used to simultaneously heat both terminals, minimizing thermal stress. The effect on LED characteristics must be verified post-rework.

8. Storage & Moisture Sensitivity

The LEDs are packaged in a moisture-resistant bag with desiccant.

• Before Opening: Store at ≤30°C and ≤90% Relative Humidity (RH).
• After Opening (Floor Life): Unused devices must be soldered within 1 year when stored at ≤30°C and ≤60% RH. If not used within this period, they must be re-baked and re-bagged.
• Baking Procedure: If the desiccant indicator changes color or the floor life is exceeded, bake at 60 ±5°C for 24 hours before use.

9. Packaging & Ordering Information

9.1 Tape and Reel Specifications

The devices are supplied on 8mm wide embossed carrier tape wound onto 7-inch diameter reels. Each reel contains 3000 pieces.

9.2 Label Explanation

The reel label contains several key codes:

• CPN: Customer's Part Number.
• P/N: Manufacturer's Part Number (e.g., 16-213/R6C-AQ2R2B/3T).
• QTY: Packing quantity per reel.
• CAT: Luminous Intensity Rank (e.g., Q2, R1, R2).
• HUE: Dominant Wavelength Rank (e.g., E4, E5, E6, E7).
• REF: Forward Voltage Rank (e.g., 0, 1, 2).
• LOT No: Traceable manufacturing lot number.

10. Application Design Considerations

10.1 Current Limiting Resistor Calculation

A series resistor is mandatory to set the forward current. The resistor value (R_S) can be calculated using Ohm's Law: R_S = (V_Supply - V_F) / I_F. Use the maximum V_F from the binning table for a conservative design to ensure I_F does not exceed the desired value. The resistor's power rating must also be calculated: P_R = (I_F)² * R_S.

10.2 Thermal Management

While the package is small, power dissipation (up to 60mW) can cause significant junction temperature rise, especially in high ambient temperatures or enclosed spaces. This reduces light output and lifespan. Ensure adequate PCB copper area or thermal vias are used for heat sinking if operating near maximum ratings.

10.3 ESD Protection

Although rated for 2000V HBM, standard ESD handling precautions should always be followed during assembly and handling to prevent latent damage.

11. Technical Comparison & Differentiation

The 16-213 LED, based on AlGaInP technology, offers distinct advantages for red indicator applications:

• vs. Older Technologies (e.g., GaAsP): AlGaInP provides higher luminous efficiency, resulting in brighter output at the same current, and better color purity (more saturated red).
• vs. Broad Spectrum White LEDs with Filter: A monochromatic red LED is far more efficient for producing pure red light than filtering white light, leading to lower power consumption.
• vs. Larger Leaded LEDs: The SMD format enables automated assembly, reduces board space, and improves mechanical reliability by eliminating leads prone to bending and breaking.

12. Frequently Asked Questions (FAQ)

Q1: What is the difference between Peak Wavelength (λp) and Dominant Wavelength (λd)?
A1: Peak Wavelength is the wavelength at which the spectral power distribution is maximum. Dominant Wavelength is the single wavelength of monochromatic light that matches the perceived color of the LED. λd is more relevant for color specification in indicator applications.

Q2: Can I drive this LED without a current-limiting resistor if my power supply is precisely 2.0V?
A2: No. The forward voltage has a tolerance and varies with temperature. A supply voltage equal to the nominal V_F can lead to excessive current due to unit-to-unit variation or temperature drop. A series resistor is always required for reliable operation.

Q3: Why is the storage temperature range wider than the operating range?
A3: The storage rating applies to the device in an inactive, non-powered state. The operating range is narrower because active operation generates heat at the semiconductor junction, and the combined effect of ambient temperature and self-heating must be limited to ensure performance and longevity.

Q4: How do I interpret the part number 16-213/R6C-AQ2R2B/3T?
A4: While the exact decoding may be proprietary, it typically incorporates the base product code (16-213) followed by codes specifying the performance bins (e.g., luminous intensity 'R2', dominant wavelength likely within 'E6/E7', and forward voltage 'B2'), and possibly packaging type ('3T' may refer to tape and reel).

13. Design-in Case Study: Dashboard Switch Backlighting

Scenario: Designing backlighting for an automotive dashboard switch requiring uniform, reliable red illumination in an environment with ambient temperatures up to 70°C.

Design Steps:

1. Current Selection: To ensure longevity at high temperature, derate the current. From the derating curve, at 70°C ambient, the maximum allowable I_F is significantly less than 25mA. Selecting I_F = 15mA provides a good safety margin.
2. Resistor Calculation: Using a 12V automotive supply and the maximum V_F from bin B2 (2.35V). R_S = (12V - 2.35V) / 0.015A ≈ 643Ω. Use a standard 620Ω or 680Ω resistor. Power: P = (0.015)² * 643 ≈ 0.145W. A 1/4W resistor is sufficient.
3. Bin Selection: For uniform appearance across multiple switches, specify tight bins for HUE (Dominant Wavelength, e.g., E6 only) and CAT (Luminous Intensity, e.g., R1 only). This ensures consistent color and brightness.
4. Layout: Place the LED and its current-limiting resistor close together. Use the recommended pad layout from the datasheet, possibly adding small thermal relief connections to aid soldering.

14. Technology Principle

The LED is based on an Aluminum Gallium Indium Phosphide (AlGaInP) semiconductor heterostructure. When a forward voltage is applied across the p-n junction, electrons and holes are injected into the active region where they recombine. The energy released during this recombination is emitted as photons (light). The specific bandgap energy of the AlGaInP alloy determines the wavelength of the emitted light, which in this case is in the red spectrum (approximately 632nm). The water-clear resin lens allows the light to escape with minimal absorption, and its shape determines the wide 120-degree viewing angle.

15. Industry Trends

The market for SMD indicator LEDs like the 16-213 continues to evolve. Key trends include:

• Increased Efficiency: Ongoing material science improvements aim to deliver higher luminous efficacy (more light output per unit of electrical input), allowing for lower power consumption or brighter indicators.
• Miniaturization: The drive for smaller end products pushes for ever-smaller LED packages (e.g., 0402, 0201 metric sizes) while maintaining or improving optical performance.
• Enhanced Reliability: Improvements in packaging materials and die-attach technologies focus on extending operational lifetime and robustness against thermal cycling and humidity.
• Integration: A trend towards integrating multiple LEDs (e.g., RGB clusters) or combining LEDs with control ICs (like driver chips) into single packages to simplify circuit design and save board space.