SMD LED 19-226/R6GHC-A 03/2T Datasheet - Multi-Color - Brilliant Red & Green - 20mA - English Technical Documentation

1. Product Overview

The 19-226/R6GHC-A 03/2T is a compact, surface-mount LED component designed for modern electronic applications requiring high-density packaging and reliable performance. This multi-color type device integrates two distinct LED chip technologies within a single package framework, offering design flexibility.

Core Advantages: The primary advantage of this SMD LED is its significantly reduced footprint compared to traditional lead-frame components. This enables smaller printed circuit board (PCB) designs, higher component packing density, reduced storage requirements, and ultimately contributes to the miniaturization of end equipment. Its lightweight construction further makes it ideal for portable and miniature applications.

Target Applications: This LED is suitable for a variety of indicator and backlighting functions. Key application areas include backlighting for automotive dashboards and switches, status indicators and keypad backlighting in telecommunication devices such as telephones and fax machines, flat backlighting for liquid crystal displays (LCDs), and general-purpose indicator use.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. Operation under or at these conditions is not guaranteed.

• Reverse Voltage (V_R): 5 V (Note: This parameter is for IR test conditions only; the device is not designed for reverse-bias operation).
• Forward Current (I_F): 25 mA for both R6 (Red) and GH (Green) chips.
• Peak Forward Current (I_FP): 60 mA for R6 and 100 mA for GH, permissible at a duty cycle of 1/10 and 1 kHz frequency.
• Power Dissipation (P_d): 60 mW for R6 and 95 mW for GH.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V for R6 and 1000 V for GH.
• Operating Temperature (T_opr): -40 °C to +85 °C.
• Storage Temperature (T_stg): -40 °C to +90 °C.
• Soldering Temperature (T_sol): Compatible with reflow soldering (260 °C for 10 seconds) and hand soldering (350 °C for 3 seconds).

2.2 Electro-Optical Characteristics

These parameters are measured at a standard ambient temperature (T_a) of 25 °C and define the typical performance of the device.

• Luminous Intensity (I_v): Measured at I_F = 20 mA. For the R6 (Red) chip, the typical range is 72.0 to 140.0 mcd. For the GH (Green) chip, the typical range is 112.0 to 285.0 mcd. A tolerance of ±11% applies.
• Viewing Angle (2θ_1/2): Approximately 120 degrees, providing a wide emission pattern.
• Peak Wavelength (λ_p): Typically 632 nm for R6 (Red) and 518 nm for GH (Green).
• Dominant Wavelength (λ_d): R6: 615.0 to 625.0 nm. GH: 520.0 to 530.0 nm. Tolerance is ±1 nm.
• Spectral Bandwidth (Δλ): Typically 20 nm for R6 and 35 nm for GH.
• Forward Voltage (V_F): At I_F = 20 mA. R6: 1.7 to 2.4 V (Typical 2.0 V). GH: 2.7 to 3.7 V (Typical 3.3 V). Tolerance is ±0.1 V.
• Reverse Current (I_R): Maximum 10 µA for R6 and 50 µA for GH at V_R = 5V.

3. Binning System Explanation

The LEDs are sorted (binned) based on key optical parameters to ensure consistency within a production batch. This allows designers to select parts that meet specific brightness and color requirements.

3.1 R6 (Brilliant Red) Binning

Luminous Intensity Bins:

• Q1: 72.0 - 90.0 mcd
• Q2: 90.0 - 112.0 mcd
• R1: 112.0 - 140.0 mcd

• 1: 615.0 - 620.0 nm
• 2: 620.0 - 625.0 nm

3.2 GH (Brilliant Green) Binning

Luminous Intensity Bins:

• R1: 112.0 - 140.0 mcd
• R2: 140.0 - 180.0 mcd
• S1: 180.0 - 225.0 mcd
• S2: 225.0 - 285.0 mcd

• 1: 520.0 - 525.0 nm
• 2: 525.0 - 530.0 nm

4. Performance Curve Analysis

The datasheet provides typical characteristic curves for both chip types. It is crucial to note that these graphs represent typical data and do not show guaranteed minimum or maximum values.

4.1 R6 (Red) Characteristics

Spectrum Distribution: The curve shows a narrow emission peak centered around 632 nm, which is characteristic of AlGaInP-based red LEDs. Radiation Pattern: The polar diagram confirms the approximately 120-degree viewing angle with a near-Lambertian distribution. Forward Current vs. Forward Voltage (I-V Curve): Shows the exponential relationship, with the typical V_F around 2.0V at 20mA. Relative Luminous Intensity vs. Forward Current: Intensity increases with current but may saturate or degrade at higher currents beyond the maximum rating. Relative Luminous Intensity vs. Ambient Temperature: Luminous output decreases as ambient temperature increases, a common trait for LEDs. The derating curve shows how the maximum permissible forward current must be reduced as ambient temperature rises above 25°C to avoid exceeding the power dissipation limit.

4.2 GH (Green) Characteristics

Spectrum Distribution: Exhibits a broader peak centered around 518 nm, typical for InGaN-based green LEDs. Forward Current vs. Forward Voltage (I-V Curve): Shows a higher typical V_F of around 3.3V at 20mA compared to the red chip. Relative Luminous Intensity vs. Forward Current / Ambient Temperature: Similar trends to the red chip are observed, though the specific derating and efficiency curves differ due to the different semiconductor material.

5. Mechanical and Package Information

The device is provided in a surface-mount package. The exact dimensional drawing is provided in the datasheet with a general tolerance of ±0.1 mm unless otherwise specified. Key features include the package outline, lead/pad dimensions, and recommended PCB footprint to ensure proper soldering and alignment. The polarity is indicated by the package marking or cathode identifier.

6. Soldering and Assembly Guidelines

The component is compatible with automatic pick-and-place equipment, supplied on 8mm tape on 7-inch diameter reels. It is qualified for standard infrared (IR) and vapor phase reflow soldering processes.

• Reflow Soldering Profile: The device can withstand a peak temperature of 260°C for up to 10 seconds.
• Hand Soldering: If necessary, a soldering iron tip temperature of 350°C can be applied for a maximum of 3 seconds.
• Moisture Sensitivity: The components are packaged in moisture-resistant barrier bags with desiccant. The bag should not be opened until the parts are ready for use. After opening, unused LEDs should be stored in conditions of 30°C or less and 60% relative humidity (RH) or lower to prevent moisture absorption which can cause "popcorning" during reflow.

7. Packaging and Ordering Information

The product is packaged for automated assembly.

• Carrier Tape: Holds the components. Dimensions for the tape and pocket are specified to ensure compatibility with feeders.
• Reel: Standard 7-inch diameter reel containing 2000 pieces.
• Moisture-Resistant Bag: Includes a desiccant and a humidity indicator label.
• Label Information: The reel label includes fields for Customer Product Number (CPN), Product Number (P/N), Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity/Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Design Considerations

8.1 Current Limiting is Mandatory

Critical Design Rule: LEDs are current-driven devices. An external current-limiting resistor (or constant-current driver) must be used in series with the LED. The forward voltage (V_F) has a tolerance and a negative temperature coefficient (decreases as temperature rises). A slight increase in supply voltage or a decrease in V_F can cause a large, potentially destructive increase in forward current if only a voltage source is used. The resistor value should be calculated based on the supply voltage (V_CC), the typical V_F of the LED at the desired current, and the desired forward current (I_F), using Ohm's Law: R = (V_CC - V_F) / I_F.

8.2 Thermal Management

While this is a low-power device, proper thermal design extends lifetime and maintains brightness. Ensure the PCB pad layout follows the recommended footprint to provide adequate thermal relief. Operating the LED at or near its maximum current rating in high ambient temperatures may require derating the current as shown in the characteristic curves.

8.3 ESD Precautions

Although the device has some ESD protection (2000V/1000V HBM), standard ESD handling procedures should be followed during assembly and handling to prevent latent damage.

9. Technical Comparison and Differentiation

The key differentiation of this specific part is its multi-color capability within a standardized SMD package. By offering both a high-efficiency red (AlGaInP) and a green (InGaN) chip option under the same part number prefix (19-226), it simplifies inventory and design for applications requiring multiple indicator colors. The wide 120-degree viewing angle is suitable for applications requiring broad visibility. Its compliance with RoHS, REACH, and halogen-free standards makes it suitable for global markets with strict environmental regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I operate this LED without a series resistor?

No. As explicitly stated in the "Precautions for Use," a series resistor is mandatory for over-current protection. Direct connection to a voltage source will likely cause immediate failure.

10.2 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_p): The wavelength at which the spectral power distribution is maximum. Dominant Wavelength (λ_d): The single wavelength of monochromatic light that matches the perceived color of the LED. For LEDs, the dominant wavelength is often more relevant for color specification. The datasheet provides binning based on dominant wavelength.

10.3 Why are the maximum currents different for the Red and Green chips?

The different semiconductor materials (AlGaInP for red, InGaN for green) have different electrical and thermal properties, leading to different maximum current and power dissipation ratings as defined in the Absolute Maximum Ratings table.

11. Design and Usage Case Example

Scenario: Multi-status Indicator Panel
A designer is creating a compact control panel with status LEDs for Power (Green), Fault (Red), and Standby (Amber). Using the 19-226 series, they can select the GH (Green) bin for the Power indicator and the R6 (Red) bin for the Fault indicator. For the Amber indicator, they would need to select a different part number with an amber LED chip. By using the same 19-226 package for red and green, they maintain a consistent component footprint on the PCB, simplifying layout. They design the driver circuit with appropriate current-limiting resistors calculated for a 5V supply: R_Green = (5V - 3.3V) / 0.020A = 85 Ω (use 82 Ω or 91 Ω standard value), R_Red = (5V - 2.0V) / 0.020A = 150 Ω. They ensure the panel's operating environment does not exceed 85°C.

12. Operating Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon is called electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material, releasing energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the energy bandgap of the semiconductor material used. The R6 chip uses an AlGaInP (Aluminum Gallium Indium Phosphide) structure to produce red light, while the GH chip uses an InGaN (Indium Gallium Nitride) structure to produce green light. The SMD package houses the semiconductor die, provides electrical connections via metal leads or pads, and includes a molded epoxy lens that shapes the light output and protects the die.

13. Technology Trends

The general trend in LED technology, including components like the 19-226, is towards higher efficiency (more lumens per watt), improved color consistency and saturation, increased reliability, and continued miniaturization. There is also a strong drive for broader adoption of environmentally friendly materials (Pb-free, halogen-free) and manufacturing processes. The integration of multiple colors or even RGB chips into a single, tiny SMD package is a common advancement for space-constrained color indicator and display applications. Furthermore, advancements in phosphor technology for white LEDs and novel semiconductor structures continue to push the performance boundaries of all LED types.