SMD LED 23-21/G6C-AL2N1/2A Datasheet - Brilliant Yellow - 2.0V Typ - 25mA - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a surface-mount device (SMD) LED identified as 23-21/G6C-AL2N1/2A. This component is a brilliant yellow LED designed for modern, compact electronic assemblies.

1.1 Core Features and Advantages

The primary advantages of this LED stem from its SMD package. It is significantly smaller than traditional lead-frame components, enabling higher board density, reduced equipment size, and minimized storage requirements. Its lightweight construction makes it ideal for miniature and portable applications. The device is packaged on 8mm tape wound on a 7-inch diameter reel, ensuring compatibility with standard automated pick-and-place equipment. It is designed for use with both infrared and vapor phase reflow soldering processes.

1.2 Compliance and Environmental Specifications

This product adheres to several key industry and environmental standards. It is a Pb-free (lead-free) component. The product itself remains compliant with the RoHS (Restriction of Hazardous Substances) directive. It also complies with EU REACH regulations and is classified as Halogen-Free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their combined total below 1500 ppm.

1.3 Target Applications

The 23-21 SMD LED is versatile and suitable for various illumination and indication purposes. Key application areas include backlighting for instrument panels, switches, and symbols; status indicators and backlighting in telecommunication devices such as telephones and fax machines; flat backlighting for LCD displays; and general-purpose indicator use.

2. Technical Parameter Deep-Dive

This section details the absolute limits and standard operating characteristics of the LED. All parameters are specified at an ambient temperature (Ta) of 25°C unless otherwise noted.

2.1 Absolute Maximum Ratings

Exceeding these ratings may cause permanent damage to the device. The maximum reverse voltage (VR) is 5V. The continuous forward current (IF) must not exceed 25 mA. A peak forward current (IFP) of 60 mA is permissible under pulsed conditions with a duty cycle of 1/10 at 1 kHz. The maximum power dissipation (Pd) is 60 mW. The device can withstand an electrostatic discharge (ESD) of 2000V per the Human Body Model (HBM). The operating temperature range (Topr) is from -40°C to +85°C, while the storage temperature range (Tstg) is from -40°C to +90°C. For soldering, a reflow profile with a peak of 260°C for 10 seconds or hand soldering at 350°C for 3 seconds is specified.

2.2 Electro-Optical Characteristics

These parameters define the light output and electrical behavior under normal operating conditions (IF=20mA). The luminous intensity (Iv) has a typical range, with minimum and maximum values defined by the binning system. The viewing angle (2θ1/2) is typically 130 degrees, indicating a wide radiation pattern. The peak wavelength (λp) is typically 575 nm, and the dominant wavelength (λd) ranges from 569.5 nm to 577.5 nm, corresponding to a brilliant yellow color. The spectral bandwidth (Δλ) is typically 20 nm. The forward voltage (VF) typically measures 2.0V, with a range from 1.70V to 2.40V. The reverse current (IR) is a maximum of 10 μA when a 5V reverse bias is applied. Important notes specify tolerances for luminous intensity (±11%) and dominant wavelength (±1 nm), and clarify that the 5V reverse rating is for IR testing only; the device is not designed for operation under reverse bias.

3. Binning System Explanation

To ensure color and brightness consistency, LEDs are sorted into bins. This device uses two independent binning parameters.

3.1 Luminous Intensity Binning

The luminous output is categorized into four bins (L2, M1, M2, N1) when driven at 20mA. The L2 bin ranges from 14.5 mcd to 18.0 mcd. The M1 bin covers 18.0 mcd to 22.5 mcd. The M2 bin spans 22.5 mcd to 28.5 mcd. The highest output bin, N1, ranges from 28.5 mcd to 36.0 mcd. The specific part number 23-21/G6C-AL2N1/2A indicates it belongs to the N1 bin for luminous intensity.

3.2 Dominant Wavelength Binning

The color, defined by dominant wavelength, is sorted into four bins (C16, C17, C18, C19). Bin C16 covers 569.5 nm to 571.5 nm. Bin C17 covers 571.5 nm to 573.5 nm. Bin C18 covers 573.5 nm to 575.5 nm. Bin C19 covers 575.5 nm to 577.5 nm. The part number suffix \"C\" likely correlates to one of these chromaticity bins, ensuring a specific yellow hue.

4. Performance Curve Analysis

Graphical data provides insight into the LED's behavior under varying conditions. The spectrum distribution curve shows the relative radiant power as a function of wavelength, centered around 575 nm with a typical width of 20 nm. The forward current vs. forward voltage (I-V) curve illustrates the exponential relationship, crucial for designing current-limiting circuits. The relative luminous intensity vs. ambient temperature curve demonstrates how light output decreases as temperature rises, which is critical for thermal management in designs. The relative luminous intensity vs. forward current curve shows the sub-linear increase in brightness with current, highlighting the point of diminishing returns and increased heat. The forward current derating curve specifies the maximum allowable continuous current as a function of ambient temperature to prevent overheating. The radiation diagram depicts the spatial distribution of light intensity, confirming the wide 130-degree viewing angle.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED conforms to the 23-21 SMD package outline. Detailed dimensional drawings specify the length, width, height, pad sizes, and their positions. All unspecified tolerances are ±0.1 mm. This information is essential for PCB footprint design and ensuring proper placement and soldering.

5.2 Polarity Identification

The datasheet includes diagrams showing the cathode and anode markings on the device body, which are critical for correct orientation during assembly.

6. Soldering and Assembly Guide

6.1 Reflow Soldering Profile

A detailed temperature profile for Pb-free reflow soldering is provided. Key phases include: pre-heating between 150°C and 200°C for 60-120 seconds; a time above liquidus (217°C) of 60-150 seconds; a peak temperature not exceeding 260°C for a maximum of 10 seconds; and controlled ramp-up and cool-down rates (max 6°C/sec and 3°C/sec respectively). Reflow should not be performed more than two times.

6.2 Hand Soldering Instructions

If hand soldering is necessary, the soldering iron tip temperature must be below 350°C, and contact time per terminal must not exceed 3 seconds. A low-power iron (≤25W) is recommended. A minimum 2-second interval should be observed between soldering each terminal to prevent thermal damage.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant. The bag must not be opened until the components are ready for use. After opening, unused LEDs must be stored at ≤30°C and ≤60% Relative Humidity (RH) and used within 168 hours (7 days). If this window is exceeded or the desiccant indicates saturation, a bake-out at 60±5°C for 24 hours is required before use to prevent \"popcorning\" during reflow.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The components are supplied on embossed carrier tape with a width of 8mm, wound onto a 7-inch (178mm) diameter reel. Each reel contains 2000 pieces. Detailed drawings for the reel, carrier tape, and cover tape dimensions are provided, with standard tolerances of ±0.1mm.

7.2 Label Explanation

The reel label contains several key fields: CPN (Customer's Part Number), P/N (Manufacturer's Part Number, e.g., 23-21/G6C-AL2N1/2A), QTY (Packing Quantity), CAT (Luminous Intensity Bin, e.g., N1), HUE (Chromaticity/Dominant Wavelength Bin), REF (Forward Voltage Rank), and LOT No (Traceable Lot Number).

8. Application Suggestions and Design Considerations

8.1 Circuit Design Considerations

Current Limiting is Mandatory: LEDs are current-driven devices. A series resistor must always be used to limit the forward current to the recommended 20mA (or less). A slight increase in supply voltage can cause a large, potentially destructive increase in current due to the diode's exponential I-V characteristic.

8.2 Thermal Management

While the package is small, power dissipation (up to 60mW) and the negative temperature coefficient of luminous intensity must be considered. For continuous operation at high ambient temperatures, refer to the forward current derating curve. Adequate PCB copper area around the thermal pads can help dissipate heat.

8.3 Optical Design

The wide 130-degree viewing angle makes this LED suitable for applications requiring broad, even illumination rather than a focused beam. For backlighting panels or symbols, diffusers may be used to homogenize the light.

9. Precautions for Use

Key operational warnings are summarized: 1) Always use a current-limiting resistor. 2) Adhere strictly to moisture-sensitive device (MSD) handling procedures regarding storage and baking. 3) Follow the specified reflow or hand-soldering profiles precisely to avoid thermal damage. 4) Avoid mechanical stress on the component during and after soldering. 5) Repair after soldering is not recommended. If absolutely necessary, use a dual-tip soldering iron to simultaneously heat both terminals and lift the component to avoid pad damage, but verify device functionality afterwards as characteristics may be altered.

10. Technology Introduction and Context

10.1 Semiconductor Material

This LED utilizes an AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor structure to produce brilliant yellow light. AlGaInP is known for high efficiency in the red to yellow-orange part of the visible spectrum. The resin lens is water-clear, allowing the pure color of the chip to be emitted without tinting.

10.2 SMD Technology Advantage

The transition from through-hole to Surface-Mount Technology for LEDs like the 23-21 package represents a significant advancement. It enables fully automated assembly, reduces parasitic inductance for high-speed applications, improves mechanical reliability by eliminating leads that can bend or break, and is essential for the ongoing miniaturization of electronic products.