Table of Contents
- 1. Product Overview
- 2. Device Selection and Absolute Maximum Ratings
- 2.1 Device Selection Guide
- 2.2 Absolute Maximum Ratings (Ta=25°C)
- 3. Electro-Optical Characteristics (Ta=25°C)
- 3.1 Luminous Intensity and Angular Characteristics
- 3.2 Spectral Characteristics
- 3.3 Electrical Characteristics
- 4. Performance Curve Analysis
- 5. Mechanical and Package Information
- 5.1 Package Dimensions
- 5.2 Polarity Identification
- 6. Soldering, Assembly, and Storage Guidelines
- 6.1 Critical Precautions
- 6.2 Soldering Process
- 7. Packaging and Ordering Information
- 7.1 Packaging Specifications
- 7.2 Label Explanation
- 8. Application Notes and Design Considerations
- 8.1 Typical Applications
- 8.2 Design Considerations
- 8.3 Application Restrictions
- 9. Technical Comparison and Differentiation
- 10. Frequently Asked Questions (FAQ)
- 11. Operational Principles and Technology Trends
- 11.1 Basic Operating Principle
- 11.2 Industry Trends
1. Product Overview
The 12-23C series represents a compact, surface-mount LED solution designed for modern electronic applications requiring miniaturization and high reliability. This multi-color LED family is significantly smaller than traditional lead-frame components, enabling substantial reductions in PCB footprint, increased packing density, and ultimately contributing to the development of smaller end-user equipment. Its lightweight construction makes it particularly suitable for space-constrained and portable applications.
The core advantage of this series lies in its versatility and compliance with contemporary manufacturing and environmental standards. The devices are packaged on 8mm tape wound onto 7-inch diameter reels, ensuring compatibility with high-speed automated pick-and-place assembly equipment. They are qualified for use with both infrared and vapor phase reflow soldering processes, which are standard in high-volume electronics production.
Environmental and regulatory compliance is a key feature. The products are constructed with Pb-free materials, adhere to the RoHS directive, comply with EU REACH regulations, and meet halogen-free standards (with Bromine <900 ppm, Chlorine <900 ppm, and their sum <1500 ppm). This makes them suitable for a wide range of global markets with strict environmental requirements.
2. Device Selection and Absolute Maximum Ratings
2.1 Device Selection Guide
The series offers three distinct color options, each based on different semiconductor chip materials:
- Code R6 (Brilliant Red): Utilizes AlGaInP (Aluminum Gallium Indium Phosphide) chip technology. The resin color is water clear.
- Code GH (Brilliant Green): Utilizes InGaN (Indium Gallium Nitride) chip technology. The resin color is water clear.
- Code BH (Blue): Utilizes InGaN (Indium Gallium Nitride) chip technology. The resin color is water clear.
The clear resin package allows for optimal light extraction and true color representation.
2.2 Absolute Maximum Ratings (Ta=25°C)
These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not advised.
- Reverse Voltage (VR): 5 V (All codes)
- Forward Current (IF): R6: 25 mA, GH: 25 mA, BH: 20 mA
- Peak Forward Current (IFP, Duty 1/10 @1kHz): R6: 60 mA, GH: 100 mA, BH: 100 mA
- Power Dissipation (Pd): R6: 60 mW, GH: 95 mW, BH: 75 mW
- Electrostatic Discharge (ESD) Human Body Model (HBM): R6: 2000 V, GH: 150 V, BH: 150 V. Note the significantly higher ESD robustness of the red (R6) LED compared to the green and blue variants, which require more careful handling.
- Operating Temperature (Topr): -40°C to +85°C
- Storage Temperature (Tstg): -40°C to +90°C
- Soldering Temperature (Tsol): Reflow soldering: 260°C peak for 10 seconds maximum. Hand soldering: 350°C for 3 seconds maximum per terminal.
3. Electro-Optical Characteristics (Ta=25°C)
The following parameters are guaranteed under the specified test conditions. Typical values represent the center of the production distribution.
3.1 Luminous Intensity and Angular Characteristics
- Luminous Intensity (IV) @ IF=20mA:
- R6 (Red): Typical 90 mcd (Min. 63 mcd)
- GH (Green): Typical 180 mcd (Min. 125 mcd)
- BH (Blue): Typical 50 mcd (Min. 32 mcd)
- Viewing Angle (2θ1/2): Typical 100 degrees for all color codes. This wide viewing angle is suitable for indicator and backlighting applications where visibility from off-axis angles is important.
3.2 Spectral Characteristics
- Peak Wavelength (λp): R6: 632 nm, GH: 518 nm, BH: 468 nm.
- Dominant Wavelength (λd): R6: 624 nm, GH: 525 nm, BH: 470 nm. Dominant wavelength is the single-wavelength perception of the LED's color by the human eye.
- Spectral Radiation Bandwidth (Δλ): R6: 20 nm, GH: 35 nm, BH: 25 nm. This defines the spectral purity or width of the emitted light.
3.3 Electrical Characteristics
- Forward Voltage (VF) @ IF=20mA:
- R6: Typical 2.0 V, Maximum 2.4 V
- GH: Typical 3.3 V, Maximum 3.9 V
- BH: Typical 3.3 V, Maximum 3.9 V
- Reverse Current (IR) @ VR=5V: R6: Max. 10 μA, GH/BH: Max. 50 μA.
4. Performance Curve Analysis
The datasheet provides typical electro-optical characteristic curves for each LED code (R6, GH, BH). While specific graph data points are not provided in the text, these curves typically illustrate the relationship between forward current and luminous intensity, forward voltage, and the effect of ambient temperature on light output. Analyzing these curves is crucial for understanding device behavior under non-standard conditions (e.g., different drive currents or temperatures) and for optimizing circuit design for efficiency and longevity. Designers should use these curves to select appropriate operating points and to model thermal effects on performance.
5. Mechanical and Package Information
5.1 Package Dimensions
The 12-23C LED has a compact surface-mount package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include a body size of approximately 3.2mm (length) x 1.6mm (width) x 1.4mm (height). The package features two anode/cathode terminals for soldering. The dimensional drawing provides critical information for PCB land pattern (footprint) design, ensuring proper solder joint formation and mechanical stability. Adherence to the recommended footprint is essential for reliable assembly and thermal management.
5.2 Polarity Identification
The cathode is typically identified by a visual marker on the package, such as a notch, a dot, or a green marking on the tape reel. Correct polarity orientation during assembly is mandatory to ensure proper function.
6. Soldering, Assembly, and Storage Guidelines
6.1 Critical Precautions
- Current Limiting: An external current-limiting resistor is absolutely required in series with the LED. The LED's exponential I-V characteristic means a small increase in voltage causes a large increase in current, leading to immediate burnout without protection.
- Storage Conditions: The devices are moisture-sensitive (MSL).
- Before opening: Store at ≤30°C and ≤90% RH.
- After opening: The "floor life" is 1 year at ≤30°C and ≤60% RH. Unused parts must be resealed in a moisture-proof bag with desiccant.
- If the desiccant indicator changes color or storage time is exceeded, a bake at 60±5°C for 24 hours is required before reflow soldering.
6.2 Soldering Process
- Reflow Profile (Pb-free): A detailed temperature profile is provided. Key parameters include: pre-heating between 150-200°C for 60-120s, time above liquidus (217°C) of 60-150s, peak temperature of 260°C max for 10 seconds max, and controlled ramp-up/cool-down rates (max 3°C/s and 6°C/s respectively).
- Reflow Cycles: Do not exceed two reflow soldering cycles.
- Hand Soldering: If necessary, use a soldering iron with a tip temperature <350°C, capacity ≤25W, and limit contact time to 3 seconds per terminal. Allow a 2-second minimum interval between soldering each terminal. Avoid mechanical stress on the package during heating.
- Repair: Repair after soldering is discouraged. If unavoidable, a dual-head soldering iron must be used to simultaneously heat both terminals and prevent thermal-mechanical stress. Pre-test to ensure the repair process does not degrade LED characteristics.
7. Packaging and Ordering Information
7.1 Packaging Specifications
The LEDs are supplied in moisture-resistant packaging. The standard packing includes:
- Carrier Tape: 8mm width, loaded into the reel.
- Reel: 7-inch diameter. Loaded quantity is 2000 pieces per reel.
- Outer Bag: Sealed within an aluminum moisture-proof bag containing desiccant.
7.2 Label Explanation
The reel label contains critical information for traceability and bin selection:
- CPN (Customer's Product Number)
- P/N (Product Number): e.g., 12-23C/R6GHBHC-A01/2C
- QTY (Packing Quantity)
- CAT (Luminous Intensity Rank)
- HUE (Chromaticity Coordinates & Dominant Wavelength Rank)
- REF (Forward Voltage Rank)
- LOT No (Lot Number for traceability)
8. Application Notes and Design Considerations
8.1 Typical Applications
- Backlighting for instrument panels, switches, and symbols.
- Status indicators and keypad backlighting in telecommunication equipment (phones, fax machines).
- Flat backlighting units for small LCD displays.
- General purpose indicator lights in consumer and industrial electronics.
8.2 Design Considerations
- Circuit Design: Always include a series resistor. Calculate its value using R = (Vsupply - VF) / IF, where VF and IF are the target operating points from the datasheet. Consider power rating of the resistor.
- Thermal Management: While power dissipation is low, maintaining the junction temperature within limits is key for long-term reliability and stable light output. Ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near maximum current.
- ESD Protection: Implement ESD protection measures on PCBs and in handling procedures, especially for the more sensitive GH and BH (InGaN) LEDs.
8.3 Application Restrictions
This product is designed for commercial and general industrial applications. It is not specifically qualified or recommended for high-reliability applications without prior consultation. This includes, but is not limited to:
- Military, aerospace, or aviation systems.
- Automotive safety or security systems (e.g., airbags, braking).
- Life-supporting or critical medical equipment.
9. Technical Comparison and Differentiation
The 12-23C series differentiates itself through its combination of a very compact form factor, multi-color availability from a single package outline, and full compliance with modern environmental regulations (RoHS, Halogen-Free). Compared to larger through-hole LEDs, it enables significant miniaturization. The clear resin package for all colors offers design flexibility. The provided ESD ratings (particularly high for the red variant) and detailed moisture sensitivity handling instructions reflect design for robust manufacturing processes. The inclusion of specific binning parameters (CAT, HUE, REF) on the label indicates a production process capable of delivering consistent color and brightness, which is critical for applications using multiple LEDs.
10. Frequently Asked Questions (FAQ)
Q1: What is the primary difference between the R6, GH, and BH codes?
A1: The primary difference is the semiconductor material and resulting color. R6 uses AlGaInP for red light (624nm dominant) and has a lower forward voltage (~2.0V). GH (Green) and BH (Blue) use InGaN, have higher forward voltage (~3.3V), and emit green (525nm) and blue (470nm) light respectively. The GH and BH codes are also more sensitive to ESD.
Q2: Why is a current-limiting resistor mandatory?
A2: LEDs are diodes with a non-linear, exponential current-voltage relationship. A small increase in voltage beyond the nominal VF causes a very large, potentially destructive, increase in current. A series resistor provides a linear relationship, making the current predictable and safe for a given supply voltage.
Q3: Can I use hand soldering for prototype assembly?
A3: Yes, but with extreme caution. Follow the guidelines strictly: iron tip <350°C, power ≤25W, contact time ≤3 seconds per terminal, and allow cooling between terminals. Reflow soldering is the recommended and more reliable method.
Q4: What does "halogen-free" mean and why is it important?
A4: Halogen-free means the materials contain very low levels of bromine (Br) and chlorine (Cl). These halogens, when burned, can produce toxic and corrosive fumes. Halogen-free electronics are safer and more environmentally friendly, often required by certain regulations and customer specifications.
Q5: How do I interpret the binning information (CAT, HUE, REF) on the label?
A5: This information groups LEDs with similar performance. For consistent appearance in an array, you should source LEDs from the same or adjacent HUE (color) and CAT (brightness) bins. The REF (voltage) bin can be important for power supply design in current-regulated applications.
11. Operational Principles and Technology Trends
11.1 Basic Operating Principle
Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons from the n-type material recombine with holes from the p-type material in the active region. This recombination releases energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material used in the active region. AlGaInP has a bandgap suitable for red/orange/yellow light, while InGaN covers the green, blue, and white (with phosphor) spectrum.
11.2 Industry Trends
The market for SMD LEDs like the 12-23C series continues to be driven by demands for miniaturization, higher efficiency (lumens per watt), improved color consistency, and stricter environmental compliance. There is a trend towards even smaller package sizes (e.g., 0201, 01005) for ultra-compact devices. Furthermore, integration of control circuitry (e.g., constant current drivers) within the LED package is becoming more common for simplified design. The push for higher reliability and longer lifetime under various environmental stresses remains a constant focus for component manufacturers and end-users alike.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |