SMD LED 16-916/T1D-AP1Q2QY/3T Datasheet - Package 1.6x0.8x0.35mm - Voltage 2.7-3.2V - White Color - English Technical Document

1. Product Overview

The 16-916/T1D-AP1Q2QY/3T is a compact, surface-mount LED designed for modern electronic applications requiring miniaturization and high reliability. This mono-color, pure white LED utilizes InGaN chip technology encapsulated in a yellow diffused resin. Its primary advantage lies in its significantly reduced footprint compared to traditional lead-frame components, enabling higher packing density on PCBs, reduced storage requirements, and ultimately contributing to smaller end-product designs. The lightweight construction further makes it ideal for portable and miniature applications.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The device is specified for operation under the following absolute maximum conditions, beyond which permanent damage may occur. The reverse voltage (VR) is rated at 5V. The continuous forward current (IF) should not exceed 25 mA. For pulsed operation, a peak forward current (IFP) of 100 mA is permissible under a duty cycle of 1/10 at 1 kHz. The maximum power dissipation (Pd) is 95 mW. The operational temperature range (Topr) spans from -40°C to +85°C, while the storage temperature (Tstg) range is slightly wider at -40°C to +90°C. The device can withstand an electrostatic discharge (ESD) of 150V per the Human Body Model (HBM). Soldering temperature limits are defined for both reflow (260°C for 10 seconds) and hand soldering (350°C for 3 seconds) processes.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at an ambient temperature (Ta) of 25°C. The luminous intensity (Iv) has a typical range, with a minimum of 45 mcd and a maximum of 112 mcd at a forward current (IF) of 5 mA. The viewing angle (2θ1/2) is typically 130 degrees, providing a wide field of illumination. The forward voltage (VF) ranges from 2.7V to 3.2V under the same 5mA condition. The reverse current (IR) is specified with a maximum of 50 μA when a reverse voltage (VR) of 5V is applied. Tolerances for luminous intensity and forward voltage are noted as ±11% and ±0.05V, respectively.

3. Binning System Explanation

3.1 Luminous Intensity Binning

The LEDs are sorted into bins based on their measured luminous intensity at IF=5mA. This ensures consistency in brightness for production batches. The bin codes and their corresponding minimum and maximum intensity ranges are: P1 (45.0-57.0 mcd), P2 (57.0-72.0 mcd), Q1 (72.0-90.0 mcd), and Q2 (90.0-112.0 mcd).

3.2 Forward Voltage Binning

Similarly, devices are binned by forward voltage to aid in circuit design, particularly for current-limiting resistor calculation. The voltage is grouped under code 'Q' with sub-bins: 29 (2.7-2.8V), 30 (2.8-2.9V), 31 (2.9-3.0V), 32 (2.9-3.0V), and 33 (3.1-3.2V), all measured at IF=5mA.

3.3 Chromaticity Coordinate Binning

For color consistency, the white LEDs are graded into chromaticity bins (Group A, codes 1-6) defined by specific CIE 1931 (x, y) coordinate quadrilaterals on the chromaticity diagram. This binning, with a tolerance of ±0.01, ensures the emitted white light falls within a controlled color space, which is critical for applications requiring uniform appearance.

4. Performance Curve Analysis

The datasheet includes several characteristic curves that provide deeper insight into the LED's behavior under varying conditions. The forward current derating curve shows how the maximum allowable forward current decreases as ambient temperature increases, essential for thermal management. The relative luminous intensity vs. ambient temperature curve illustrates the typical reduction in light output with rising temperature. The luminous intensity vs. forward current graph demonstrates the non-linear relationship between drive current and brightness. The spectrum distribution plot characterizes the spectral power distribution of the emitted white light. A typical radiation diagram depicts the spatial intensity distribution pattern. The forward voltage vs. forward current curve shows the diode's IV characteristic.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED has a compact SMD package. The maximum overall height is 0.35 mm. Detailed dimensional drawings are provided, including body length and width, electrode pad sizes, and recommended PCB land pattern dimensions. Tolerances are typically ±0.1mm unless otherwise specified. The suggested pad layout is for reference and should be modified based on specific assembly process requirements.

5.2 Polarity Identification

The component features markings or structural asymmetry to indicate cathode and anode terminals, which is crucial for correct orientation during assembly to ensure proper circuit function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A detailed Pb-free reflow soldering temperature profile is specified. Key parameters include: a pre-heating stage between 150-200°C for 60-120 seconds, a time above liquidus (217°C) of 60-150 seconds, a peak temperature not exceeding 260°C for a maximum of 10 seconds, and controlled ramp-up and cool-down rates (e.g., 3°C/sec max cooling). Reflow soldering should not be performed more than twice.

6.2 Hand Soldering

For manual repair or prototyping, hand soldering is permissible with specific precautions. The soldering iron tip temperature should be less than 350°C, applied for no more than 3 seconds per terminal. The iron should have a capacity of 25W or less. A minimum interval of 2 seconds should be left between soldering each terminal to prevent thermal damage.

6.3 Storage and Handling

The LEDs are sensitive to moisture and electrostatic discharge (ESD). Before opening, the moisture-proof bag should be stored at ≤30°C and ≤90% RH. After opening, the components have a floor life of 1 year under conditions of ≤30°C and ≤60% RH. Unused parts should be resealed in moisture-proof packaging with desiccant. If the specified storage conditions are exceeded or the desiccant indicator changes color, a baking treatment at 60±5°C for 24 hours is required before use.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The components are supplied in 8mm wide embossed carrier tape wound on 7-inch diameter reels. Each reel contains 3000 pieces. Detailed dimensions for the carrier tape pockets, cover tape, and the reel itself are provided. The packaging is designed to be compatible with standard automated pick-and-place equipment.

7.2 Moisture-Resistant Packaging

The reels are further protected inside an aluminum laminate moisture-proof bag along with a desiccant packet and a humidity indicator card to maintain the specified dry storage conditions during shipment and storage.

7.3 Label Explanation

The reel label contains key information for traceability and correct application: Customer Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity Coordinates (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is well-suited for various applications including: Telecommunication equipment (as status indicators and keypad backlights in telephones and fax machines), flat backlighting for small LCD panels, backlighting for switches and symbols on control panels, and general purpose indicator applications where a small, bright, white light source is needed.

8.2 Design Considerations

Current Limiting: An external current-limiting resistor is mandatory. The forward voltage has a range (2.7-3.2V), and the IV characteristic is exponential, meaning a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value must be calculated based on the supply voltage and the maximum forward current rating (25mA continuous), considering the worst-case forward voltage from the binning information.

Thermal Management: While the package is small, power dissipation (max 95mW) and the derating of forward current with temperature must be considered in the PCB layout. Adequate copper area around the pads can help dissipate heat.

ESD Protection: As a sensitive semiconductor device with an ESD rating of 150V (HBM), standard ESD handling precautions should be observed during assembly and handling.

9. Technical Comparison and Differentiation

The primary differentiation of this component lies in its ultra-compact form factor (max 0.35mm height) and surface-mount design, which offers significant advantages over through-hole LEDs in automated assembly, board space savings, and suitability for low-profile devices. The provision of detailed binning information for intensity, voltage, and chromaticity allows for tighter design control and consistency in mass production compared to unbinned or loosely specified components. The pure white color generated by the InGaN chip with yellow phosphor offers a different chromaticity compared to older blue-chip + yellow phosphor solutions or other white LED technologies.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Why is a current-limiting resistor absolutely necessary?
A: The LED is a diode with a non-linear IV curve. Operating it directly from a voltage source without a series resistor would attempt to force a current limited only by the source's capacity and the diode's internal resistance, which is very low once the forward voltage is exceeded. This would almost certainly exceed the absolute maximum forward current of 25mA, leading to immediate overheating and failure.

Q: How do I interpret the luminous intensity bin codes (P1, Q2, etc.)?
A: These codes represent sorted groups based on measured light output. For example, specifying "Q2" in an order ensures you receive LEDs with an intensity between 90.0 and 112.0 mcd at 5mA. This is crucial for applications requiring uniform brightness across multiple indicators.

Q: Can I use this LED for continuous illumination, not just as an indicator?
A: While possible, its primary design is for indicator use. For continuous illumination, careful thermal design is even more critical due to the constant power dissipation. The light output will also decrease with rising junction temperature, as shown in the performance curves.

Q: What does the 'Pb-free' designation mean for soldering?
A: It means the device's termination finishes are compatible with lead-free solder alloys, which typically have higher melting points than traditional tin-lead solder. Therefore, the specified reflow profile with a peak of 260°C is designed for these higher-temperature processes.

11. Practical Design and Usage Case

Case: Designing a Status Indicator for a Portable Device
A designer is creating a compact Bluetooth module that requires a small, bright white power/connection status LED. The 16-916 LED is selected for its minimal height (0.35mm) to fit within the device's slim enclosure. The design uses a 3.3V supply rail. Using the worst-case forward voltage (Vf_max = 3.2V from bin Q33) and targeting a forward current of 15mA (well below the 25mA max for reliability and battery life), the current-limiting resistor is calculated: R = (V_supply - Vf) / If = (3.3V - 3.2V) / 0.015A ≈ 6.67Ω. A standard 6.8Ω resistor is chosen. The PCB land pattern is adjusted slightly from the suggested layout to match the designer's specific DFM rules. The BOM specifies the CAT (luminous intensity) and HUE (chromaticity) bin codes to ensure visual consistency across production units.

12. Operating Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor diode. The core is an InGaN (Indium Gallium Nitride) chip. When a forward voltage exceeding the diode's junction potential (around 2.7-3.2V) is applied, electrons and holes are injected into the active region and recombine. In a white LED, this recombination in the InGaN layer primarily produces blue light. This blue light then excites a yellow phosphor coating (contained within the yellow diffused resin encapsulation). The combination of the unconverted blue light and the down-converted yellow light from the phosphor results in the perception of white light by the human eye. The diffused resin helps scatter the light, contributing to the wide 130-degree viewing angle.

13. Technology Trends

The development of components like the 16-916 LED reflects broader trends in electronics: continued miniaturization, increased efficiency, and enhanced functionality in smaller packages. The use of InGaN technology for white LEDs represents an advancement in solid-state lighting, offering good color rendering and efficiency. The detailed binning and specification for automated assembly highlight the industry's move towards higher precision and consistency for mass manufacturing. The emphasis on Pb-free and RoHS compliance is driven by global environmental regulations. Future trends may see even smaller package sizes, higher luminous efficacy (more light output per unit of electrical power), tighter color and intensity tolerances, and perhaps integration of drive electronics or multiple dice within a single package for smart lighting applications. The handling and storage precautions underscore the ongoing challenge of managing moisture sensitivity in ever-smaller plastic encapsulated microelectronic devices.