SMD LED 23-23B Datasheet - Multi-Color (Red/Green/Blue) - 3.2x2.8x1.9mm - 3.3V - 20mA - English Technical Document

1. Product Overview

The 23-23B is a compact, surface-mount device (SMD) LED designed for high-density PCB applications. It is significantly smaller than traditional lead-frame type LEDs, enabling reduced board size, higher packing density, and ultimately smaller end equipment. Its lightweight construction makes it ideal for miniature and space-constrained applications.

The series is available in multiple colors through different chip materials: Brilliant Red (R6 code, AlGaInP chip), Brilliant Green (GH code, InGaN chip), and Blue (BH code, InGaN chip). All variants feature a water-clear resin package. The product is compliant with key industry standards including RoHS, EU REACH, and is Halogen-Free (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm). It is supplied in 8mm tape on 7-inch diameter reels, compatible with standard automatic placement equipment.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

All ratings are specified at an ambient temperature (Ta) of 25°C. Exceeding these limits may cause permanent damage.

• Reverse Voltage (VR): 5 V (all codes).
• Forward Current (IF): 25 mA for R6 (Red), 20 mA for GH (Green) and BH (Blue).
• Peak Forward Current (IFP): Duty cycle 1/10 @ 1kHz. 60 mA for R6, 75 mA for GH and BH.
• Power Dissipation (Pd): 60 mW for R6, 95 mW for GH and BH.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V for R6, 150 V for GH and BH. This indicates the Red LED has higher inherent ESD robustness.
• Operating Temperature (Topr): -40°C to +85°C.
• Storage Temperature (Tstg): -40°C to +90°C.
• Soldering Temperature (Tsol): Reflow soldering: 260°C peak for 10 seconds maximum. Hand soldering: 350°C for 3 seconds maximum per terminal.

2.2 Electro-Optical Characteristics

Typical values are measured at Ta=25°C with IF=20mA, unless otherwise noted. Min/Max values define the specification limits.

• Luminous Intensity (Iv):
  • R6 (Red): Typical 100 mcd, Minimum 72 mcd.
  • GH (Green): Typical 200 mcd, Minimum 140 mcd.
  • BH (Blue): Typical 65 mcd, Minimum 45 mcd.
  • Tolerance: ±11%.
• Viewing Angle (2θ1/2): Typical 130 degrees (all codes).
• Peak Wavelength (λp):
  • R6: 632 nm.
  • GH: 518 nm.
  • BH: 468 nm.
• Dominant Wavelength (λd):
  • R6: 624 nm.
  • GH: 525 nm.
  • BH: 470 nm.
• Spectrum Radiation Bandwidth (Δλ):
  • R6: 20 nm.
  • GH: 35 nm.
  • BH: 25 nm.
• Forward Voltage (VF) @ IF=20mA:
  • R6: 2.0V Typ. (1.7V Min., 2.4V Max.)
  • GH/BH: 3.3V Typ. (2.7V Min., 3.7V Max.)
• Reverse Current (IR) @ VR=5V:
  • R6: 10 μA Max.
  • GH/BH: 50 μA Max.

3. Binning System Explanation

The product uses a comprehensive labeling system for traceability and performance sorting, as indicated on the reel label.

• CAT: Denotes the Luminous Intensity Rank.
• HUE: Indicates the Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Specifies the Forward Voltage Rank.
• LOT No: Unique Lot Number for manufacturing traceability.

This binning allows designers to select LEDs with tightly grouped electrical and optical parameters for consistent performance in their application.

4. Performance Curve Analysis

The datasheet includes typical electro-optical characteristic curves for each LED code (R6, GH, BH). While the specific graphs are not detailed in the text, such curves typically illustrate the relationship between:

• Forward Current (IF) vs. Forward Voltage (VF): Shows the diode's IV characteristic, crucial for driver design.
• Forward Current (IF) vs. Luminous Intensity (Iv): Demonstrates how light output scales with current, indicating linearity and saturation points.
• Ambient Temperature (Ta) vs. Relative Luminous Intensity: Shows the derating of light output as temperature increases.
• Spectral Distribution: Depicts the relative power emitted across wavelengths, confirming peak and dominant wavelengths.

These curves are essential for understanding device behavior under non-standard conditions (different currents, temperatures) and for optimizing circuit design.

5. Mechanical and Package Information

5.1 Package Dimension

The LED has a compact SMD footprint. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:

• Overall size: Approximately 3.2mm (L) x 2.8mm (W) x 1.9mm (H).
• Terminal pad size and spacing are defined for reliable soldering.
• Cathode identification is typically marked on the package.

5.2 Polarity Identification

The component features a polarity mark (likely a notch, chamfer, or dot) to identify the cathode terminal. Correct orientation is mandatory during assembly to ensure proper function and avoid reverse bias damage.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

A lead-free (Pb-free) reflow profile is specified:

• Pre-heating: 150–200°C for 60–120 seconds.
• Time above liquidus (217°C): 60–150 seconds.
• Peak Temperature: 260°C maximum.
• Time at Peak: 10 seconds maximum.
• Heating Rate: Maximum 6°C/sec up to 255°C.
• Time above 255°C: Maximum 30 seconds.
• Cooling Rate: Maximum 3°C/sec.
• Limit: Reflow soldering should not be performed more than two times.

6.2 Hand Soldering

If hand soldering is necessary:

• Use a soldering iron with a tip temperature < 350°C.
• Apply heat to each terminal for ≤ 3 seconds.
• Use an iron with power ≤ 25W.
• Allow ≥ 2-second intervals between soldering each terminal.
• Exercise caution as damage often occurs during hand soldering.

6.3 Storage and Moisture Sensitivity

The components are packaged in moisture-resistant barrier bags with desiccant.

• Before opening: Store at ≤ 30°C and ≤ 90% RH.
• After opening: The "floor life" is 1 year at ≤ 30°C and ≤ 60% RH. Unused parts must be resealed in moisture-proof packaging.
• Baking: If the desiccant indicator changes color or storage time is exceeded, bake at 60 ±5°C for 24 hours before use.

6.4 Precautions

• Current Protection: An external current-limiting resistor is mandatory. The LED is a current-driven device; a small voltage change can cause a large current surge leading to burnout.
• Stress Avoidance: Do not apply mechanical stress to the LED during heating (soldering) or by warping the PCB afterward.
• Repairing: Not recommended after soldering. If unavoidable, use a specialized double-head soldering iron to simultaneously heat both terminals and lift the component without stressing one side. Verify post-repair characteristics.

7. Packaging and Ordering Information

7.1 Packaging Specification

• Carrier Tape: 8mm width.
• Reel: 7-inch (178mm) diameter.
• Quantity per Reel: 2000 pieces.
• Moisture Barrier Bag: Aluminum laminate bag containing desiccant and humidity indicator card.

7.2 Model Numbering Rule

The part number 23-23B/R6GHBHC-A01/2A can be interpreted as:

• 23-23B: Base package type and size.
• /R6GHBHC: Indicates the specific chip/color configuration (likely a combination or selection of R6, GH, BH).
• -A01/2A: Internal code for binning, version, or other attributes.

8. Application Suggestions

8.1 Typical Application Scenarios

• Backlighting: For dashboards, switches, and symbols in automotive and consumer electronics.
• Telecommunication Equipment: Status indicators and keypad backlighting in phones and fax machines.
• LCD Flat Backlighting: For small displays.
• General Indicator Use: Status lights, power indicators, etc., in various electronic devices.

8.2 Design Considerations

• Driver Circuit: Always use a constant current source or a voltage source with a series resistor. Calculate the resistor value using R = (V_supply - VF_LED) / IF, considering the Max VF to ensure current never exceeds the Absolute Maximum Rating.
• Thermal Management: While power dissipation is low, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or high duty cycles to maintain performance and longevity.
• ESD Protection: Implement ESD protection measures on PCB lines connected to the LED terminals, especially for the more sensitive Green and Blue (GH/BH) variants.

9. Technical Comparison and Differentiation

The 23-23B series offers distinct advantages:

• vs. Larger Leaded LEDs: Drastically reduced footprint and weight, enabling miniaturization and automated assembly.
• vs. Other SMD LEDs: The specific combination of a 130-degree viewing angle, clear package, and the provided multi-color options (Red, Green, Blue) from a single package outline suits applications requiring color differentiation or RGB mixing.
• Compliance: Its RoHS, REACH, and Halogen-Free compliance is a critical advantage for products targeting global markets with strict environmental regulations.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use with a 5V supply for the Green (GH) LED?

Using the typical VF of 3.3V and IF of 20mA: R = (5V - 3.3V) / 0.02A = 85 Ohms. To ensure safe operation under worst-case conditions (Min VF = 2.7V), recalculate to limit max current: R_min = (5V - 2.7V) / 0.02A = 115 Ohms. Using a standard 120 Ohm resistor would be a safe choice, resulting in a typical current of ~14mA ((5-3.3)/120).

10.2 Can I drive this LED with a PWM signal for dimming?

Yes, PWM dimming is an effective method. Ensure the peak current in the pulse does not exceed the Peak Forward Current (IFP) rating (75mA for GH/BH, 60mA for R6). The frequency should be high enough to avoid visible flicker (typically >100Hz).

10.3 Why is the ESD rating different for the Red LED compared to the Green/Blue?

The Red LED uses an AlGaInP semiconductor material, which generally has a more robust crystal structure against electrostatic discharge compared to the InGaN material used for Green and Blue LEDs. This is a common characteristic in the industry, necessitating stricter ESD handling precautions for the green and blue variants.

10.4 What does "water clear" resin mean for the light output?

"Water clear" means the epoxy encapsulant is non-diffused and transparent. This results in a more focused, intense beam with a well-defined viewing angle (130° in this case), as opposed to a "milky" or diffused resin which scatters light for a wider, softer appearance.

11. Practical Design and Usage Case

Case: Designing a Multi-Status Indicator Panel
A designer needs Red (Power/Fault), Green (Ready/On), and Blue (Active/Connect) indicators on a small consumer device control panel. Using the 23-23B series in R6, GH, and BH codes ensures:

• Uniform Footprint: All three colors share the same PCB land pattern, simplifying layout and assembly.
• Consistent Viewing Angle: All LEDs have the same 130° viewing angle, providing a uniform visual appearance from different angles.
• Simplified BOM: Similar driving circuitry can be used, with only the current-limiting resistor value adjusted slightly based on the different forward voltages (Red ~2.0V, Green/Blue ~3.3V).
• Compliance: The single component series meets all necessary environmental regulations for the target market.

12. Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light when an electric current passes through them. This phenomenon, called electroluminescence, occurs when electrons recombine with electron holes within the device, releasing energy in the form of photons. The color of the emitted light is determined by the energy band gap of the semiconductor material used:

• AlGaInP (Aluminum Gallium Indium Phosphide): Used for the R6 (Red) LED, this material system produces light in the red to yellow-orange spectrum. The specific composition is tuned for a dominant wavelength of 624nm (red).
• InGaN (Indium Gallium Nitride): Used for the GH (Green) and BH (Blue) LEDs. By varying the indium/gallium ratio, the band gap can be adjusted to emit green (~525nm) or blue (~470nm) light. InGaN technology is also the basis for white LEDs, which use a blue LED chip combined with a phosphor coating.

The SMD package protects the fragile semiconductor chip, provides the electrical contacts (anode and cathode), and includes a lens (shaped by the clear resin) to control the light output pattern.

13. Development Trends

The evolution of SMD LEDs like the 23-23B is driven by several key trends in electronics:

• Increased Efficiency (Lumens per Watt): Ongoing material science and chip design improvements lead to higher luminous intensity for the same input current, reducing power consumption and thermal load.
• Miniaturization: The push for smaller devices continues, leading to even smaller package sizes (e.g., 2016, 1608, 1005 metric codes) while maintaining or improving optical performance.
• Improved Color Consistency and Binning: Manufacturing processes are becoming more precise, yielding tighter bins for luminous intensity, wavelength, and forward voltage. This reduces the need for circuit calibration in color-critical applications.
• Higher Reliability and Lifetime: Advancements in packaging materials (epoxy, silicone) and die-attach techniques enhance resistance to thermal cycling, moisture, and other environmental stresses, extending operational lifespan.
• Integration: Trends include integrating multiple LED chips (e.g., RGB) into a single package with built-in control ICs, creating smart LED modules that simplify system design.

The 23-23B represents a mature, reliable component in this ongoing technological progression, balancing performance, size, and cost for a wide range of indicator and backlight applications.