Table of Contents
- 1. Product Overview
- 2. Key Features and Compliance
- 3. Absolute Maximum Ratings
- 4. Electro-Optical Characteristics
- 5. Bin Range and Grading System
- 5.1 Luminous Intensity Bin Range
- 5.2 Forward Voltage Bin Range
- 5.3 Chromaticity Coordinates Bin Grading
- 6. Performance Curve Analysis
- 7. Mechanical and Package Information
- 8. Soldering and Assembly Guidelines
- 8.1 Soldering Process
- 8.2 Storage and Moisture Sensitivity
- 8.3 Circuit Protection
- 9. Packaging and Ordering Information
- 10. Application Suggestions
- 10.1 Typical Applications
- 10.2 Design Considerations
- 11. Technical Comparison and Advantages
- 12. Frequently Asked Questions (FAQ)
- 13. Operational Principle
- 14. Industry Trends and Context
1. Product Overview
The 16-213/T3D-AP1Q2QY/3T is a compact, surface-mount device (SMD) LED designed for modern electronic applications requiring miniaturization and high reliability. This mono-color, pure white LED utilizes InGaN chip technology encapsulated in a yellow diffused resin. Its primary advantage lies in its significantly reduced footprint compared to traditional lead-frame LEDs, enabling higher component packing density on printed circuit boards (PCBs), reduced storage requirements, and ultimately contributing to the development of smaller and lighter end-user equipment. The lightweight construction makes it particularly suitable for space-constrained and portable devices.
2. Key Features and Compliance
This LED is supplied on 8mm tape wound onto a 7-inch diameter reel, making it fully compatible with standard automated pick-and-place assembly equipment, which streamlines high-volume manufacturing. It is designed for use with both infrared (IR) and vapor phase reflow soldering processes, ensuring flexibility in production lines. The device is constructed with environmentally friendly materials: it is lead-free (Pb-free), complies with the EU's RoHS (Restriction of Hazardous Substances) directive, and meets REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) requirements. Furthermore, it is classified as Halogen-Free, with bromine (Br) and chlorine (Cl) content each below 900 ppm and their combined total below 1500 ppm.
3. Absolute Maximum Ratings
The device's operational limits are defined under conditions where the ambient temperature (Ta) is 25°C. Exceeding these ratings may cause permanent damage.
- Reverse Voltage (VR): 5 V
- Continuous Forward Current (IF): 25 mA
- Peak Forward Current (IFP): 100 mA (at 1/10 duty cycle, 1 kHz)
- Power Dissipation (Pd): 110 mW
- Electrostatic Discharge (ESD) Human Body Model: 150 V
- Operating Temperature Range (Topr): -40°C to +85°C
- Storage Temperature Range (Tstg): -40°C to +90°C
- Soldering Temperature (Tsol): Reflow: 260°C max for 10 seconds; Hand soldering: 350°C max for 3 seconds.
4. Electro-Optical Characteristics
All characteristics are measured at an ambient temperature of 25°C and a standard test current (IF) of 5 mA, unless otherwise specified.
- Luminous Intensity (Iv): Minimum 45 mcd, Typical value not specified, Maximum 112 mcd. The luminous intensity is subject to a tolerance of ±11%.
- Viewing Angle (2θ1/2): 120 degrees (typical). This wide viewing angle ensures good visibility from various angles, ideal for indicator and backlight applications.
- Forward Voltage (VF): Minimum 2.7 V, Typical value not specified, Maximum 3.2 V. The forward voltage tolerance is ±0.05V.
- Reverse Current (IR): Maximum 50 μA when a reverse voltage (VR) of 5V is applied.
Note on Tolerances: The dominant wavelength has a tolerance of ±1 nm.
5. Bin Range and Grading System
The LEDs are sorted into performance bins to ensure consistency in batches. This allows designers to select parts that meet specific brightness and electrical requirements.
5.1 Luminous Intensity Bin Range
Binned at IF = 5mA. Tolerance: ±11%.
- P1: 45 mcd (Min) to 57 mcd (Max)
- P2: 57 mcd to 72 mcd
- Q1: 72 mcd to 90 mcd
- Q2: 90 mcd to 112 mcd
5.2 Forward Voltage Bin Range
Binned at IF = 5mA. Tolerance: ±0.1V.
- 29: 2.7 V to 2.8 V
- 30: 2.8 V to 2.9 V
- 31: 2.9 V to 3.0 V
- 32: 3.0 V to 3.1 V
- 33: 3.1 V to 3.2 V
5.3 Chromaticity Coordinates Bin Grading
The white color point is defined by chromaticity coordinates (CIE_x, CIE_y) on the CIE 1931 diagram, with a tolerance of ±0.01. The product is graded into groups (A) and bins (1-6), each defining a quadrilateral area on the chromaticity chart to ensure color consistency. The specific coordinate ranges for bins 1 through 6 are provided in the datasheet, defining the allowable variation in the white point.
6. Performance Curve Analysis
The datasheet includes several characteristic curves that are crucial for circuit design and thermal management.
- Forward Current Derating Curve: Shows the maximum allowable continuous forward current as a function of ambient temperature. The current must be reduced as temperature increases to prevent overheating.
- Relative Luminous Intensity vs. Ambient Temperature: Illustrates how light output decreases as the junction temperature rises. This is critical for applications operating over a wide temperature range.
- Luminous Intensity vs. Forward Current: Demonstrates the non-linear relationship between drive current and light output.
- Forward Voltage vs. Forward Current (I-V Curve): Essential for designing the current-limiting circuitry. The curve shows the typical voltage drop across the LED at various currents.
- Spectrum Distribution: Depicts the spectral power distribution of the emitted white light, showing the relative intensity across wavelengths.
- Radiation Diagram: A polar plot visually representing the 120-degree viewing angle and the spatial distribution of light intensity.
7. Mechanical and Package Information
The LED comes in a standard SMD package. The package drawing shows key dimensions including length, width, height, and pad spacing. All tolerances are ±0.1mm unless otherwise noted. A suggested pad layout for PCB design is provided for reference, but designers are advised to modify it based on their specific manufacturing process and thermal requirements. The drawing also clearly indicates the cathode (negative) and anode (positive) terminals for correct orientation during assembly.
8. Soldering and Assembly Guidelines
8.1 Soldering Process
The device is compatible with lead-free reflow soldering. A recommended temperature profile is provided: pre-heating between 150-200°C for 60-120 seconds, time above liquidus (217°C) for 60-150 seconds, with a peak temperature not exceeding 260°C for a maximum of 10 seconds. The maximum heating rate should be 6°C/sec and the cooling rate 3°C/sec. Reflow soldering should not be performed more than two times. Stress should not be applied to the LED body during heating, and the PCB should not be warped after soldering.
8.2 Storage and Moisture Sensitivity
LEDs are packaged in a moisture-resistant bag with desiccant. Before opening, they should be stored at ≤30°C and ≤90% RH. After opening, the "floor life" (time components can be exposed to ambient factory conditions) is 1 year at ≤30°C and ≤60% RH. Unused parts should be resealed. If the desiccant indicator changes color or the storage time is exceeded, a baking treatment at 60±5°C for 24 hours is required before use to remove absorbed moisture and prevent "popcorning" during reflow.
8.3 Circuit Protection
Critical: An external current-limiting resistor must always be used in series with the LED. The forward voltage has a range (2.7-3.2V), and a small change in supply voltage can cause a large, potentially destructive change in forward current if not properly limited.
9. Packaging and Ordering Information
The LEDs are supplied on embossed carrier tape with dimensions specified in the datasheet. Each reel contains 3000 pieces. Reel dimensions are also provided for automated handling equipment. The label on the reel includes key information: Customer Part Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity & Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).
10. Application Suggestions
10.1 Typical Applications
- Backlighting: Ideal for dashboard indicators, switch backlighting, and providing flat backlighting for LCD panels and symbols.
- Telecommunication Equipment: Status indicators and keypad backlighting in telephones and fax machines.
- General Indicator Use: Any application requiring a small, bright, wide-angle white indicator light.
10.2 Design Considerations
- Current Drive: Always use a constant current source or a voltage source with a series resistor. Calculate the resistor value based on the supply voltage (Vsupply), the LED's maximum forward voltage (VFmax), and the desired forward current (IF): R = (Vsupply - VFmax) / IF. Use the worst-case VF to ensure current never exceeds the maximum rating.
- Thermal Management: Although power dissipation is low, ensure adequate PCB copper area or thermal vias under the LED pads if operating at high ambient temperatures or near maximum current, as heat reduces light output and lifespan.
- ESD Protection: The device is sensitive to electrostatic discharge (150V HBM). Implement standard ESD handling precautions during assembly.
11. Technical Comparison and Advantages
Compared to older through-hole LEDs, the 16-213 SMD LED offers significant advantages: a much smaller footprint enabling miniaturization, suitability for automated assembly reducing labor costs, and a wider viewing angle (120°) for better visibility. Its Halogen-Free and RoHS compliance makes it suitable for global markets with strict environmental regulations. The detailed binning system provides designers with predictable performance, allowing for consistent brightness and color in mass-produced products.
12. Frequently Asked Questions (FAQ)
Q: What is the purpose of the bin codes (P1, Q2, 29, 31, etc.)?
A: Bin codes ensure electrical and optical consistency. Luminous Intensity bins (P1, Q1, etc.) guarantee a minimum brightness. Forward Voltage bins (29, 31, etc.) ensure predictable power consumption. Chromaticity bins ensure consistent white color. Designers can specify bins to match their application's needs.
Q: Why is a current-limiting resistor absolutely necessary?
A: LEDs are current-driven devices. Their V-I characteristic is exponential. A small increase in voltage beyond the nominal VF causes a very large increase in current, which can instantly destroy the LED. The resistor (or constant-current driver) provides a stable, safe operating current.
Q: Can I use this LED outdoors?
A: The operating temperature range is -40°C to +85°C, which covers most outdoor conditions. However, the package is not specifically rated for waterproofing or UV resistance. For direct outdoor exposure, additional environmental protection (conformal coating, lens) would be required.
Q: What does "Pb-free" and "Halogen-Free" mean for my design?
A> "Pb-free" refers to the absence of lead in the solder and plating, complying with environmental regulations. "Halogen-Free" means reduced bromine and chlorine content, which minimizes the emission of toxic fumes if the device is exposed to extreme heat or fire, improving safety and environmental profile.
13. Operational Principle
This LED is based on a semiconductor chip made of Indium Gallium Nitride (InGaN). When a forward voltage exceeding the diode's threshold is applied, electrons and holes recombine within the semiconductor's active region, releasing energy in the form of photons (light). The specific composition of the InGaN layers determines the primary wavelength of emitted light. To create white light, the chip typically emits blue light, which then excites a yellow phosphor layer (contained within the yellow diffused resin encapsulation). The combination of the blue light from the chip and the yellow light from the phosphor results in the perception of white light by the human eye. The diffused resin helps scatter the light, contributing to the wide 120-degree viewing angle.
14. Industry Trends and Context
The 16-213 LED represents a mature product category within the broader trend of electronics miniaturization and efficiency. The move from through-hole to SMD packaging has been a dominant trend for decades, driven by the need for smaller, lighter, and more automatable components. Current industry developments focus on even higher efficiency (more lumens per watt), improved color rendering index (CRI) for white LEDs, and tighter color consistency. There is also a strong push towards higher reliability and longer operational lifetimes, especially for automotive and industrial applications. Furthermore, the emphasis on Halogen-Free and low-outgassing materials aligns with stricter global environmental and safety standards for consumer and professional electronics.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |