SMD LED 0603 Green Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 3.2V - Power 76mW - English Technical Document

1. Product Overview

This document provides the complete technical specifications for a surface-mount device (SMD) Light Emitting Diode (LED) in the 0603 package size. The device utilizes an Indium Gallium Nitride (InGaN) semiconductor material to produce green light. It is designed for automated assembly processes and is compatible with standard infrared and vapor phase reflow soldering techniques, making it suitable for high-volume electronics manufacturing.

The core advantages of this component include its compact footprint, compatibility with RoHS (Restriction of Hazardous Substances) directives, and its design for reliability in automated placement systems. It is intended for use in a wide range of consumer and industrial electronic applications where indicator lights, backlighting, or status displays are required.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These values are not for continuous operation.

• Power Dissipation (Pd): 76 mW. This is the maximum total power the LED package can dissipate as heat at an ambient temperature (Ta) of 25\u00b0C.
• Peak Forward Current (I_F(PEAK)): 100 mA. This is the maximum allowable current under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). Exceeding this can cause immediate catastrophic failure.
• Continuous Forward Current (I_F): 20 mA. This is the recommended maximum current for continuous DC operation to ensure long-term reliability and stable light output.
• DC Current Derating: Above 50\u00b0C ambient, the maximum allowable continuous current decreases linearly at a rate of 0.25 mA per degree Celsius. This is critical for thermal management in enclosed or high-temperature environments.
• Reverse Voltage (V_R): 5 V. Applying a reverse bias voltage greater than this can break down the LED's PN junction.
• Operating & Storage Temperature: The device is rated for operation between -20\u00b0C to +80\u00b0C and can be stored between -30\u00b0C to +100\u00b0C.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25\u00b0C ambient temperature and a forward current (I_F) of 20 mA, unless otherwise specified.

• Luminous Intensity (I_V): Ranges from a minimum of 71.0 mcd to a maximum of 450.0 mcd, with a typical value provided. This wide range is managed through a binning system (detailed later). Intensity is measured using a sensor filtered to match the human eye's photopic response (CIE curve).
• Viewing Angle (2\u03b8_1/2): 130 degrees. This is the full angle at which the luminous intensity drops to half of its value measured on-axis. A 130-degree angle indicates a wide, diffuse light pattern suitable for indicator applications.
• Peak Wavelength (\u03bb_P): 530 nm. This is the wavelength at which the spectral power output is highest.
• Dominant Wavelength (\u03bb_d): 525 nm. This is derived from the CIE chromaticity diagram and represents the single wavelength that best describes the perceived color of the light. It is the key parameter for color consistency.
• Spectral Bandwidth (\u0394\u03bb): 35 nm. This is the width of the emitted spectrum at half its maximum power (Full Width at Half Maximum - FWHM). A narrower bandwidth indicates a more pure, saturated color.
• Forward Voltage (V_F): Ranges from 2.80 V (Min) to 3.60 V (Max), with a typical value of 3.20 V at 20 mA. This variation is managed by voltage binning.
• Reverse Current (I_R): Maximum of 10 \u00b5A when a 5 V reverse bias is applied. A value significantly higher than this in application may indicate a damaged device.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into "bins" based on key performance parameters. This allows designers to select components that meet specific tolerance requirements for their application.

3.1 Forward Voltage Binning

Units are sorted by their forward voltage (V_F) measured at 20 mA. The bins (D7 to D10) have a tolerance of \u00b10.1V within each bin.
Example: Bin D8 contains LEDs with V_F between 3.00V and 3.20V.

3.2 Luminous Intensity Binning

Units are sorted by their luminous intensity (I_V) measured at 20 mA. The bins (Q, R, S, T) have a tolerance of \u00b115% within each bin.
Example: Bin S contains LEDs with intensity between 180.0 mcd and 280.0 mcd.

3.3 Dominant Wavelength Binning

Units are sorted by their dominant wavelength (\u03bb_d) measured at 20 mA. The bins (AP, AQ, AR) have a tolerance of \u00b11 nm within each bin.
Example: Bin AQ contains LEDs with a dominant wavelength between 525.0 nm and 530.0 nm, producing a specific shade of green.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (Fig.1, Fig.6), their implications are standard for LED technology.

• IV Curve: The relationship between forward current (I_F) and forward voltage (V_F) is exponential. A small increase in voltage beyond the "knee" voltage results in a large, potentially damaging, increase in current. This is why constant-current drive is essential.
• Luminous Intensity vs. Current: Light output is approximately proportional to forward current within the operating range. However, efficiency may drop at very high currents due to increased heat.
• Luminous Intensity vs. Temperature: The light output of an LED decreases as the junction temperature increases. This is a critical consideration for applications operating in high ambient temperatures or with poor thermal management.
• Spectral Distribution: The emitted light spectrum is roughly Gaussian, centered around the peak wavelength. The dominant wavelength defines the perceived color point on the CIE chart.

5. Mechanical & Packaging Information

5.1 Package Dimensions

The device conforms to the EIA standard 0603 package footprint, with dimensions of approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height (tolerance \u00b10.10mm). The lens is water clear. Detailed mechanical drawings should be consulted for precise pad layout and component geometry.

5.2 Polarity Identification

Polarity is typically indicated by a marking on the component body or by an asymmetric feature in the package. The cathode is usually marked. Correct polarity must be observed during assembly, as reverse biasing beyond 5V can damage the device.

5.3 Tape and Reel Packaging

The components are supplied on 8mm wide embossed carrier tape wound onto 7-inch (178mm) diameter reels. Standard reel quantity is 3000 pieces. Packaging follows ANSI/EIA 481-1-A standards, ensuring compatibility with automated pick-and-place equipment. The tape has a cover to protect components from contamination.

6. Soldering & Assembly Guidelines

6.1 Reflow Soldering Profile

The LED is compatible with lead-free (Pb-free) soldering processes. A suggested infrared reflow profile is provided:
- Pre-heat: 150\u00b0C to 200\u00b0C.
- Pre-heat Time: Maximum 120 seconds to allow for thermal equalization and flux activation.
- Peak Temperature: Maximum 260\u00b0C.
- Time Above Liquidus: 10 seconds maximum at peak temperature. Reflow should not be performed more than twice.

6.2 Hand Soldering

If hand soldering is necessary, extreme care must be taken:
- Iron Temperature: Maximum 300\u00b0C.
- Soldering Time: Maximum 3 seconds per lead.
- Hand soldering should be performed only once to minimize thermal stress on the plastic package.

6.3 Cleaning

Only specified cleaning agents should be used. Recommended solvents are ethyl alcohol or isopropyl alcohol at room temperature. The LED should be immersed for less than one minute. Unspecified chemicals may damage the epoxy lens or package.

6.4 Storage & Handling

- Store in an environment not exceeding 30\u00b0C and 70% relative humidity.
- Once removed from the original moisture-barrier bag, components should be reflowed within one week.
- For longer storage outside the original packaging, use a sealed container with desiccant or a nitrogen atmosphere.
- Components stored for over a week outside the bag should be baked at approximately 60\u00b0C for at least 24 hours before soldering to remove absorbed moisture and prevent "popcorning" during reflow.

7. Application Design Recommendations

7.1 Drive Circuit Design

LEDs are current-driven devices. To ensure uniform brightness, especially when connecting multiple LEDs in parallel, a series current-limiting resistor for each LED is strongly recommended (Circuit Model A). Driving multiple LEDs in parallel directly from a voltage source (Circuit Model B) is not recommended, as small variations in the forward voltage (V_F) characteristic between individual LEDs will cause significant differences in current sharing and, consequently, brightness.

7.2 Electrostatic Discharge (ESD) Protection

The LED is sensitive to electrostatic discharge. ESD damage can manifest as high reverse leakage current, low forward voltage, or complete failure to emit light. Precautions must be taken:
- Operators should wear grounded wrist straps or anti-static gloves.
- All workstations, equipment, and tools must be properly grounded.
- Use ionizers to neutralize static charge that may accumulate on the plastic lens during handling.
- Follow standard ESD handling procedures (ANSI/ESD S20.20).

7.3 Thermal Management

Although power dissipation is low (76mW max), proper thermal design extends lifespan and maintains stable light output. Ensure adequate PCB copper area for heat sinking, especially when operating at high ambient temperatures or near the maximum current rating. Adhere to the current derating specification above 50\u00b0C.

8. Technical Comparison & Considerations

Compared to older technologies like GaP, this InGaN-based green LED offers higher efficiency and brighter output. The 0603 package provides a significantly smaller footprint than older LED packages like 0805 or 1206, enabling higher-density PCB designs. The wide 130-degree viewing angle is ideal for omnidirectional indicators, whereas narrower-angle LEDs might be preferred for focused beam applications. The comprehensive binning system allows for tighter color and brightness matching in critical applications compared to unbinned or broadly binned components.

9. Frequently Asked Questions (FAQ)

Q: Can I drive this LED directly from a 5V logic output?
A: No. With a typical V_F of 3.2V, connecting it directly to 5V would cause excessive current and destroy the LED. You must use a series current-limiting resistor. Calculate the resistor value using R = (V_supply - V_F) / I_F.

Q: Why is there such a wide range in luminous intensity (71-450 mcd)?
A: This is the full production spread. Through the binning system (Q, R, S, T), you can purchase LEDs from a specific, narrower intensity range (e.g., Bin S: 180-280 mcd) to ensure consistency in your product.

Q: Is this LED suitable for outdoor use?
A: The operating temperature range is -20\u00b0C to +80\u00b0C. While it can function in many outdoor conditions, prolonged exposure to direct sunlight, moisture, and UV radiation may degrade the epoxy lens over time. For harsh environments, consider LEDs with conformal coating or specifically rated for outdoor use.

Q: What happens if I exceed the reverse voltage rating?
A: Exceeding 5V in reverse bias can cause avalanche breakdown of the PN junction, leading to immediate and permanent damage, often a short circuit.

10. Design and Usage Case Study

Scenario: Designing a status indicator panel for a network router.
The panel requires 10 identical bright green LEDs to show link activity and power status. To ensure all LEDs have the same brightness and color, the designer specifies Bin S for intensity (180-280 mcd) and Bin AQ for dominant wavelength (525-530 nm). To guarantee consistent current, each LED is driven by a GPIO pin on a microcontroller via a 100-ohm series resistor (calculated for a 3.3V supply and ~20mA target current). The PCB layout includes a small thermal relief pad connected to a ground plane for heat dissipation. During assembly, the factory uses the recommended IR reflow profile, and operators follow ESD protocols. The result is a panel with uniform, reliable indicator lights.

11. Operating Principle

This is a semiconductor photonic device. When a forward voltage exceeding the junction's built-in potential is applied, electrons and holes are injected into the active region (the InGaN quantum well). These charge carriers recombine, releasing energy in the form of photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the InGaN semiconductor material, which is engineered during the epitaxial growth process to produce green light (~525-530 nm). The epoxy lens serves to protect the semiconductor die, shape the light output beam, and enhance light extraction from the chip.

12. Technology Trends

The underlying technology for green LEDs, InGaN, continues to evolve. Trends include:
- Increased Efficiency: Ongoing research aims to reduce "efficiency droop" (the drop in efficiency at higher drive currents) and improve internal quantum efficiency, leading to brighter LEDs at lower power.
- Miniaturization: Package sizes continue to shrink (e.g., from 0603 to 0402 and smaller) to meet the demands of ultra-compact consumer electronics.
- Improved Color Consistency: Advances in epitaxial growth and binning algorithms allow for tighter color tolerances straight from production, reducing the need for secondary sorting.
- Higher Reliability: Improvements in packaging materials and die attach technologies are extending operational lifetimes and increasing resistance to thermal and mechanical stress.