SMD LED 0603 Green Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 2.8-3.8V - Power 80mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface-Mount Device (SMD) Light Emitting Diode (LED) in a standard 0603 package. This component is designed for automated printed circuit board (PCB) assembly and is ideal for space-constrained applications. The LED emits green light using an InGaN (Indium Gallium Nitride) semiconductor material, providing a bright and efficient light source suitable for a wide range of modern electronic equipment.

1.1 Core Advantages and Target Market

The primary advantages of this LED include its extremely compact size, compatibility with automated pick-and-place machinery, and suitability for high-volume infrared (IR) reflow soldering processes. It is designed to meet RoHS (Restriction of Hazardous Substances) compliance. Its target markets span consumer electronics, telecommunications, computing, and industrial equipment. Typical applications include status indicators, backlighting for front panels and keypads, signal illumination, and decorative lighting in devices such as mobile phones, laptops, networking hardware, home appliances, and indoor signage.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed breakdown of the LED's electrical, optical, and thermal characteristics. Understanding these parameters is crucial for reliable circuit design and system integration.

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These values are specified at an ambient temperature (Ta) of 25°C.

• Power Dissipation (Pd): 80 mW. This is the maximum amount of power the LED package can dissipate as heat without exceeding its thermal limits.
• Peak Forward Current (I_FP): 100 mA. This is the maximum allowable instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (I_F): 20 mA. This is the recommended maximum continuous forward current for normal operation.
• Operating Temperature Range: -40°C to +85°C. The LED is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored without applied power within this range.

2.2 Electrical and Optical Characteristics

These are the typical performance parameters measured at Ta=25°C and I_F=20mA, unless otherwise noted.

• Luminous Intensity (I_V): 450 - 1400 mcd (millicandela). This is a measure of the perceived brightness of the LED as seen by the human eye. The wide range indicates the device is available in different brightness bins (see Section 3).
• Viewing Angle (2θ_1/2): 110 degrees (typical). This is the full angle at which the luminous intensity is half of the intensity measured on-axis (0 degrees). A 110-degree angle indicates a wide, diffuse viewing pattern.
• Peak Emission Wavelength (λ_P): 518 nm (typical). This is the wavelength at which the optical output power is at its maximum.
• Dominant Wavelength (λ_d): 520 - 535 nm. This is the single wavelength perceived by the human eye that best matches the color of the LED's light output. It is the key parameter for color specification.
• Spectral Line Half-Width (Δλ): 35 nm (typical). This indicates the spectral purity or bandwidth of the emitted light, measured as the full width at half maximum (FWHM) of the emission spectrum.
• Forward Voltage (V_F): 2.8 - 3.8 V at I_F=20mA. This is the voltage drop across the LED when it is conducting current. The range corresponds to different voltage bins.
• Reverse Current (I_R): 10 μA (max) at V_R=5V. LEDs are not designed for reverse bias operation. This parameter is primarily for quality assurance testing.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted into bins based on key performance parameters. This allows designers to select components that meet specific requirements for brightness, color, and voltage.

3.1 Forward Voltage (V_F) Binning

LEDs are categorized into bins based on their forward voltage drop at 20mA. Each bin has a tolerance of ±0.1V. The bins are: D7 (2.8-3.0V), D8 (3.0-3.2V), D9 (3.2-3.4V), D10 (3.4-3.6V), and D11 (3.6-3.8V). Selecting LEDs from the same V_F bin helps ensure uniform brightness when multiple LEDs are connected in parallel.

3.2 Luminous Intensity (I_V) Binning

LEDs are sorted by brightness into five intensity bins, each with a tolerance of ±11%. The bins are: U1 (450-560 mcd), U2 (560-710 mcd), V1 (710-900 mcd), V2 (900-1120 mcd), and W1 (1120-1400 mcd). This allows for selection based on application brightness requirements.

3.3 Dominant Wavelength (λ_d) Binning

The color (hue) of the green light is controlled by binning the dominant wavelength, with a tolerance of ±1nm per bin. The bins are: AP (520-525 nm), AQ (525-530 nm), and AR (530-535 nm). This ensures color consistency across multiple LEDs in a display or indicator array.

4. Performance Curve Analysis

Graphical representations of the LED's characteristics provide deeper insight into its behavior under varying conditions. The datasheet includes typical curves for the following relationships (refer to the original document for the specific graphs).

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between the current flowing through the LED and the voltage across it. It is non-linear, meaning a small change in voltage can cause a large change in current. This is why LEDs should be driven by a current-limited source, not a constant voltage source.

4.2 Luminous Intensity vs. Forward Current

This graph illustrates how the light output (in mcd) increases with increasing forward current. It is generally linear over a range but will saturate at very high currents due to thermal effects and efficiency droop.

4.3 Luminous Intensity vs. Ambient Temperature

This curve demonstrates the thermal dependence of light output. Typically, luminous intensity decreases as the ambient temperature rises. Understanding this derating is critical for applications operating in high-temperature environments.

4.4 Spectral Distribution

This plot shows the relative optical power emitted across different wavelengths. It is centered around the peak wavelength (518 nm) and has a characteristic shape defined by the half-width (35 nm).

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a standard EIA 0603 package. Key dimensions (in millimeters) include a body length of 1.6mm, a width of 0.8mm, and a height of 0.6mm. The anode and cathode terminals are clearly marked. All dimensional tolerances are ±0.1mm unless otherwise specified. A detailed dimensioned drawing is provided in the original datasheet.

5.2 Recommended PCB Attachment Pad Layout

A land pattern diagram is provided for designing the solder pads on the PCB. This pattern is optimized for reliable soldering during IR reflow processes, ensuring proper solder fillet formation and mechanical stability.

5.3 Polarity Identification

The LED package has a marking or a specific shape (often a notch or a green dot) to identify the cathode terminal. Correct polarity must be observed during assembly to ensure proper operation.

6. Soldering and Assembly Guidelines

6.1 Recommended IR Reflow Profile

For lead-free soldering processes, a specific reflow temperature profile is recommended, compliant with J-STD-020B. Key parameters include a pre-heat zone (150-200°C, max 120 sec), a peak temperature not exceeding 260°C, and a time above liquidus (TAL) appropriate for the solder paste used. The component can withstand this profile a maximum of two times.

6.2 Storage Conditions

Unopened, moisture-sensitive devices should be stored at ≤30°C and ≤70% RH and used within one year. Once the moisture barrier bag is opened, LEDs should be stored at ≤30°C and ≤60% RH. Components exposed to ambient air for more than 168 hours require a baking procedure (approximately 60°C for at least 48 hours) before reflow to prevent "popcorning" or delamination during soldering.

6.3 Cleaning

If cleaning is necessary after soldering, only specified alcohol-based solvents like ethyl alcohol or isopropyl alcohol should be used at normal temperature for less than one minute. Unspecified chemicals may damage the LED package.

6.4 Manual Soldering

If hand soldering is required, a soldering iron temperature should not exceed 300°C, and the soldering time should be limited to a maximum of 3 seconds per terminal. Manual soldering should be performed only once.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on 12mm wide embossed carrier tape wound onto 7-inch (178mm) diameter reels. Each reel contains 4000 pieces. The tape and reel dimensions conform to ANSI/EIA-481 standards to ensure compatibility with automated assembly equipment.

7.2 Minimum Order Quantity

The standard packing quantity is 4000 pieces per reel. A minimum packing quantity of 500 pieces is available for remainder quantities.

8. Application Suggestions

8.1 Typical Application Circuits

LEDs are current-driven devices. For consistent brightness, especially when multiple LEDs are used in parallel, each LED should be driven by its own current-limiting resistor connected in series. Driving LEDs directly from a microcontroller pin requires ensuring the pin's current sourcing/sinking capability and the total V_F of the LED chain are within the system's voltage limits.

8.2 Design Considerations

• Current Limiting: Always use a series resistor or a constant-current driver to set the operating current to 20mA or less for continuous operation.
• Thermal Management: While the package is small, ensure adequate PCB copper area or thermal vias if operating at high ambient temperatures or near maximum current to maintain performance and longevity.
• ESD Protection: Although not explicitly stated, standard ESD (Electrostatic Discharge) handling precautions for semiconductor devices should be observed during assembly.

9. Technical Comparison and Differentiation

This 0603 green LED, based on InGaN technology, offers several key advantages. Compared to older technologies like AlGaInP (used for red/yellow), InGaN provides higher efficiency and brightness for green and blue wavelengths. The 0603 package is one of the smallest standardized SMD LED footprints, offering significant space savings over larger packages like 0805 or 1206. Its wide 110-degree viewing angle makes it suitable for applications requiring broad visibility, as opposed to narrow-angle LEDs used for focused illumination.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Can I drive this LED directly with a 5V supply?

No. Connecting a 5V supply directly across the LED would cause excessive current to flow, likely destroying it instantly. You must always use a series current-limiting resistor. The resistor value can be calculated using Ohm's Law: R = (V_supply - V_F) / I_F. For example, with a 5V supply, a V_F of 3.2V, and a desired I_F of 20mA: R = (5 - 3.2) / 0.02 = 90 ohms. A standard 91-ohm or 100-ohm resistor would be appropriate.

10.2 Why is there such a wide range in luminous intensity (450-1400 mcd)?

This range represents the total spread across all production. Through the binning process (Section 3.2), LEDs are sorted into specific, narrower brightness ranges (e.g., U1, V2, W1). Designers can specify a particular bin code when ordering to guarantee LEDs with consistent and predictable brightness for their application.

10.3 What is the difference between peak wavelength and dominant wavelength?

Peak wavelength (λ_P) is the physical wavelength where the LED emits the most optical power, as measured by a spectrometer. Dominant wavelength (λ_d) is a psychophysical measure; it is the single wavelength of monochromatic light that would appear to have the same color to the human eye as the LED's broad-spectrum output. λ_d is more relevant for color specification in visual applications.

11. Practical Design and Usage Case

Scenario: Designing a multi-LED status indicator panel for a network router. The panel requires 10 green LEDs to indicate link activity on different ports. Uniform brightness and color are critical for a professional appearance.

1. Component Selection: Specify LEDs from the same Intensity bin (e.g., V1: 710-900 mcd) and the same Dominant Wavelength bin (e.g., AQ: 525-530 nm) to ensure visual consistency.
2. Circuit Design: Design ten identical driver circuits, each consisting of the LED in series with a current-limiting resistor. Connect each circuit between a microcontroller GPIO pin and ground. The resistor value is calculated based on the microcontroller's output high voltage (e.g., 3.3V) and the LED's typical V_F from its voltage bin.
3. PCB Layout: Use the recommended land pattern. Ensure adequate spacing between LEDs for even light distribution and to prevent thermal crosstalk.
4. Assembly: Follow the IR reflow profile guidelines. After assembly, clean if necessary using isopropyl alcohol.

12. Principle Introduction

An LED is a semiconductor p-n junction diode. When a forward voltage is applied, electrons from the n-type region and holes from the p-type region are injected into the junction region. When these charge carriers recombine, they release energy. In a standard diode, this energy is released as heat. In an LED, the semiconductor material (in this case, InGaN) is chosen so that this energy is released primarily as photons (light). The specific wavelength (color) of the emitted light is determined by the bandgap energy of the semiconductor material. The wide viewing angle is achieved through the geometry of the LED chip and the properties of the encapsulating lens.

13. Development Trends

The general trend in SMD LEDs for indicator applications is toward even smaller package sizes (e.g., 0402, 0201) to enable higher-density PCB designs. There is a continuous drive for increased luminous efficacy (more light output per unit of electrical power input) and improved color consistency through tighter binning tolerances. Furthermore, advancements in packaging materials aim to enhance reliability under higher temperature reflow profiles and improve resistance to environmental factors like moisture and thermal cycling.