SMD LED 19-213/GHC-YR1S2/3T Datasheet - Brilliant Green - 3.5V - 25mA - 120° Viewing Angle - English Technical Document

1. Product Overview

The 19-213/GHC-YR1S2/3T is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It represents a significant advancement over traditional lead-frame type components, enabling substantial reductions in board size, increased packing density, and minimized storage requirements. This ultimately contributes to the development of smaller and more efficient end-user equipment.

Its lightweight construction makes it particularly suitable for miniature and space-constrained applications where weight and size are critical factors. The device is a mono-color type, emitting a brilliant green light, and is constructed using Pb-free materials, ensuring compliance with contemporary environmental and safety regulations.

1.1 Core Advantages and Compliance

The primary advantages of this LED stem from its SMD packaging and material composition.

• Miniaturization: The significantly smaller footprint compared to through-hole LEDs allows for higher component density on printed circuit boards (PCBs).
• Automation Compatibility: Packaged in 8mm tape on 7-inch diameter reels, it is fully compatible with high-speed automatic pick-and-place equipment, streamlining the manufacturing process.
• Robust Soldering: Compatible with both infrared and vapor phase reflow soldering processes, offering flexibility in assembly lines.
• Environmental Compliance: The product is Pb-free and designed to remain within RoHS (Restriction of Hazardous Substances) compliant specifications. It also complies with EU REACH regulations and is Halogen-Free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their sum below 1500 ppm.

2. Technical Parameter Deep Dive

This section provides a detailed, objective analysis of the LED's electrical, optical, and thermal specifications as defined in the Absolute Maximum Ratings and Electro-Optical Characteristics tables.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or near these limits is not recommended for reliable performance.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (I_F): 25mA (continuous). This is the maximum recommended DC current for normal operation.
• Peak Forward Current (I_FP): 50mA (at 1/10 duty cycle, 1kHz). This rating allows for short pulse operation but must adhere strictly to the duty cycle to avoid overheating.
• Power Dissipation (P_d): 95mW. This is the maximum power the package can dissipate at an ambient temperature (T_a) of 25°C. Derating is necessary at higher temperatures.
• Electrostatic Discharge (ESD): 150V (Human Body Model). Proper ESD handling procedures are essential during assembly and handling.
• Operating Temperature (T_opr): -40°C to +85°C. The device is rated for industrial temperature range applications.
• Storage Temperature (T_stg): -40°C to +90°C.
• Soldering Temperature (T_sol): The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds, or hand soldering at 350°C for up to 3 seconds per terminal.

2.2 Electro-Optical Characteristics

Measured at T_a=25°C and I_F=20mA, these parameters define the device's performance under standard test conditions.

• Luminous Intensity (I_v): Ranges from a minimum of 112.0 mcd to a maximum of 285.0 mcd. The actual value is binned (see Section 3). The tolerance is ±11%.
• Viewing Angle (2θ_1/2): 120 degrees (typical). This wide viewing angle makes the LED suitable for applications requiring broad illumination or visibility from multiple angles.
• Peak Wavelength (λ_p): 518 nm (typical). This is the wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λ_d): Ranges from 520.0 nm to 535.0 nm. This is the perceived color of the light and is also binned. Tolerance is ±1 nm.
• Spectral Bandwidth (Δλ): 35 nm (typical). This indicates the spread of the emitted spectrum around the peak wavelength.
• Forward Voltage (V_F): 3.5V (typical), with a maximum of 4.0V at I_F=20mA. Tolerance is ±0.1V. This parameter is crucial for designing the current-limiting circuit.
• Reverse Current (I_R): Maximum 50 μA at V_R=5V. It is critical to note that the device is not designed for operation in reverse bias; this test condition is for characterization only.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into bins based on key parameters.

3.1 Luminous Intensity Binning

LEDs are categorized into four bins (R1, R2, S1, S2) based on their measured luminous intensity at I_F=20mA.

• Bin R1: 112.0 – 140.0 mcd
• Bin R2: 140.0 – 180.0 mcd
• Bin S1: 180.0 – 225.0 mcd
• Bin S2: 225.0 – 285.0 mcd

Selecting the appropriate bin is essential for applications requiring uniform brightness across multiple LEDs.

3.2 Dominant Wavelength Binning

LEDs are also binned by their dominant wavelength to control color variation. Three bins (X, Y, Z) are defined.

• Bin X: 520.0 – 525.0 nm
• Bin Y: 525.0 – 530.0 nm
• Bin Z: 530.0 – 535.0 nm

For applications where precise color matching is critical (e.g., status indicators, backlighting arrays), specifying a tight wavelength bin is necessary.

4. Performance Curve Analysis

The datasheet provides typical characteristic curves that illustrate how the LED's performance varies with operating conditions. These are essential for robust circuit design.

4.1 Relative Luminous Intensity vs. Ambient Temperature

This curve shows the derating of light output as ambient temperature increases. Like all LEDs, the luminous efficiency decreases with rising junction temperature. Designers must account for this thermal derating, especially in high-temperature environments or high-current applications, to ensure the desired brightness is maintained.

4.2 Forward Current vs. Forward Voltage (I-V Curve)

The I-V curve demonstrates the exponential relationship between current and voltage in the LED's forward-biased state. The typical forward voltage (V_F) of 3.5V at 20mA is a key design point. A small increase in voltage can lead to a large, potentially damaging increase in current, underscoring the absolute necessity of using a current-limiting resistor or constant-current driver.

4.3 Relative Luminous Intensity vs. Forward Current

This curve shows that light output increases with current but not necessarily linearly across the entire range. It also tends to saturate at higher currents due to thermal and efficiency effects. Operating near the maximum rated current (25mA) may provide higher brightness but will also generate more heat and reduce long-term reliability.

4.4 Radiation Pattern

The radiation diagram visually confirms the 120-degree viewing angle. The intensity is typically highest at 0 degrees (perpendicular to the LED surface) and decreases towards the edges of the viewing cone. This pattern is important for designing light guides, lenses, or determining the optimal placement for indicators.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED features a standard SMD package. The dimensional drawing provides critical measurements for PCB land pattern design, including pad size, spacing, and component height. All unspecified tolerances are ±0.1mm. Accurate adherence to these dimensions in the PCB layout is vital for reliable soldering and mechanical stability.

5.2 Polarity Identification

The cathode is typically marked on the device, often by a notch, a green dot, or a different pad size. Correct polarity must be observed during placement to ensure proper circuit operation.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical to yield and long-term reliability.

6.1 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150–200°C for 60–120 seconds.
• Time Above Liquidus (217°C): 60–150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating Rate: Maximum 6°C/sec.
• Time Above 255°C: Maximum 30 seconds.
• Cooling Rate: Maximum 3°C/sec.

Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is unavoidable:

• Use a soldering iron with a tip temperature below 350°C.
• Limit contact time to 3 seconds per terminal.
• Use an iron with a power rating below 25W.
• Allow a minimum 2-second interval between soldering each terminal.

Hand soldering poses a higher risk of thermal damage.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant.

• Do not open the bag until ready for use.
• After opening, unused LEDs should be stored at ≤30°C and ≤60% RH.
• The "floor life" after bag opening is 168 hours (7 days).
• If exceeded, or if the desiccant indicates saturation, a bake-out at 60±5°C for 24 hours is required before reflow to prevent "popcorning" (package cracking due to vaporized moisture).

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The device is supplied in embossed carrier tape:

• Carrier Tape Width: 8mm.
• Reel Diameter: 7 inches.
• Quantity per Reel: 3000 pieces.

Detailed reel and carrier tape dimensions are provided for compatibility with automated feeders.

7.2 Label Explanation

The reel label contains several key identifiers:

• P/N: Product Number (e.g., 19-213/GHC-YR1S2/3T).
• QTY: Packing Quantity.
• CAT: Luminous Intensity Rank (Bin code: R1, R2, S1, S2).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank (Bin code: X, Y, Z).
• REF: Forward Voltage Rank.
• LOT No: Traceable manufacturing lot number.

8. Application Suggestions

8.1 Typical Application Scenarios

Based on its brilliant green color, wide viewing angle, and SMD form factor, this LED is well-suited for:

• Backlighting: Dashboard illumination, switch backlighting, and flat backlighting for LCDs and symbols.
• Status Indicators: In telecommunications equipment (telephones, fax machines), consumer electronics, and industrial control panels.
• General Purpose Indication: Any application requiring a compact, bright, green visual signal.

8.2 Critical Design Considerations

• Current Limiting is Mandatory: Always use a series resistor or constant-current driver. The forward voltage has a negative temperature coefficient and production tolerance, making direct connection to a voltage source unsafe.
• Thermal Management: While the power dissipation is low, ensuring adequate PCB copper area or thermal vias under the thermal pad (if present) helps maintain lower junction temperature, preserving brightness and lifespan.
• ESD Protection: Implement ESD protection on signal lines if the LED is in a user-accessible location, and follow ESD-safe handling procedures during assembly.
• Optical Design: The 120° viewing angle provides wide coverage. For focused light, an external lens or light guide may be necessary.

9. Technical Comparison and Differentiation

Compared to older through-hole LEDs, this SMD device offers clear advantages:

• Size & Density: Drastically smaller, enabling modern miniaturized electronics.
• Manufacturing Efficiency: Tape-and-reel packaging allows for fully automated, high-speed assembly.
• Performance: Typically offers better brightness consistency and wider viewing angles than many radial-leaded counterparts.
• Reliability: SMD construction often provides better resistance to vibration and mechanical shock.

Its specific combination of brilliant green color (using InGaN material), 120° viewing angle, and standard SMD footprint differentiates it within the broad category of green SMD LEDs.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 Why is a current-limiting resistor absolutely necessary?

The LED's I-V characteristic is exponential. A small increase in supply voltage or a decrease in the LED's forward voltage (due to temperature rise) can cause a large, uncontrolled surge in current, rapidly exceeding the Absolute Maximum Rating and destroying the device. A resistor sets a defined, safe operating current.

10.2 Can I drive this LED with a 5V supply?

Yes, but you must use a series resistor. With a typical V_F of 3.5V at 20mA, the voltage drop across the resistor would be 1.5V (5V - 3.5V). Using Ohm's Law (R = V/I), the required resistor value would be 1.5V / 0.020A = 75 Ohms. A standard 75Ω or 82Ω resistor would be appropriate, but the power rating of the resistor (P = I²R) must also be checked.

10.3 What do the bin codes (R1, S2, X, Y) mean for my design?

If your design uses multiple LEDs and requires uniform appearance, you must specify the same intensity and wavelength bin codes for all units. Mixing bins can result in visibly different brightnesses or color tints between adjacent LEDs. For single-LED applications or where variation is acceptable, a wider bin selection may be used.

10.4 How does temperature affect performance?

As ambient temperature rises:

• Luminous Intensity Decreases: Light output drops (see derating curve).
• Forward Voltage Decreases: The V_F has a negative temperature coefficient (~ -2mV/°C for InGaN). This can cause current to rise in a simple resistor-limited circuit if not accounted for.
• Wavelength Shifts Slightly: The dominant wavelength may shift, usually towards longer wavelengths (red shift).

Designs for high-temperature environments should use constant-current drivers and consider thermal derating in brightness calculations.

11. Practical Design and Usage Case

Scenario: Designing a multi-LED status indicator panel.

1. Requirements: 10 uniformly bright green LEDs indicating different system states on a front panel.
2. Selection: Specify the 19-213 LED. To ensure uniformity, order all units from the same luminous intensity bin (e.g., S1) and the same dominant wavelength bin (e.g., Y).
3. Circuit Design: Use a 5V rail. Calculate series resistor: R = (5V - 3.5V) / 0.020A = 75Ω. Resistor power: P = (0.020A)² * 75Ω = 0.03W, so a standard 1/10W (0.1W) resistor is sufficient. Place one resistor per LED for individual control.
4. PCB Layout: Follow the recommended land pattern from the package dimensions. Ensure adequate spacing between LEDs for the desired aesthetic.
5. Assembly: Use the specified reflow profile. Keep the moisture-sensitive devices in sealed bags until the moment of use on the assembly line.
6. Result: A reliable, consistent-looking indicator panel with controlled brightness and color.

12. Principle Introduction

This LED is based on a semiconductor diode structure. The active region is composed of Indium Gallium Nitride (InGaN), a direct bandgap semiconductor material. When a forward voltage is applied, electrons and holes are injected into the active region where they recombine. In a direct bandgap material like InGaN, this recombination event releases energy primarily in the form of photons (light), a process called electroluminescence. The specific composition of the InGaN alloy determines the bandgap energy, which in turn dictates the wavelength (color) of the emitted light—in this case, brilliant green (~518-535 nm). The epoxy resin encapsulant protects the semiconductor chip, acts as a lens to shape the light output (contributing to the 120° viewing angle), and may contain phosphors or dyes, though for this mono-color type, it is water clear.

13. Development Trends

The evolution of SMD LEDs like the 19-213 follows several clear industry trends:

• Increased Efficiency: Ongoing material science and chip design improvements aim to produce more lumens per watt (higher efficacy), reducing power consumption for a given light output.
• Miniaturization: The drive for smaller packages (e.g., 0402, 0201 metric sizes) continues to enable ever-more compact electronic devices.
• Improved Color Consistency: Advances in epitaxial growth and binning processes lead to tighter tolerances in wavelength and intensity, reducing the need for stringent bin selection in some applications.
• Higher Reliability & Power Handling: Enhancements in package materials, thermal paths, and solder joint design allow for higher maximum drive currents and power dissipation in similarly sized packages.
• Broadened Environmental Compliance: The move towards halogen-free, low VOC (Volatile Organic Compound), and fully recyclable materials aligns with global sustainability initiatives.

These trends focus on delivering more performance, reliability, and environmental friendliness from increasingly smaller and more cost-effective components.