SMD LED 19-213 Datasheet - Brilliant Green - 120° Viewing Angle - 2.7-3.2V - 25mA - Water Clear Resin - English Technical Document

1. Product Overview

The 19-213 is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It utilizes InGaN (Indium Gallium Nitride) chip technology to produce a brilliant green light output. The primary advantage of this component is its miniature size, which enables significant reductions in PCB (Printed Circuit Board) footprint, allows for higher component packing density, and contributes to the overall miniaturization of end-user equipment. Its lightweight construction further makes it an ideal choice for applications where space and weight are critical constraints.

The LED is packaged on 8mm tape wound onto 7-inch diameter reels, making it fully compatible with high-speed automated pick-and-place assembly equipment. This compatibility streamlines the manufacturing process for volume production.

1.1 Core Advantages and Target Market

The core advantages of the 19-213 SMD LED stem from its SMD form factor and material compliance. The elimination of traditional lead frames results in a more robust connection to the PCB and better performance in high-vibration environments. The product is classified as Pb-free, is compliant with the EU's RoHS (Restriction of Hazardous Substances) directive, and adheres to REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) regulations. It is also Halogen Free, with Bromine (Br) and Chlorine (Cl) content each below 900 ppm and their combined total below 1500 ppm, making it suitable for environmentally conscious designs.

The target applications are diverse, focusing on indicator and backlighting functions. Key markets include automotive interiors (e.g., dashboard and switch backlighting), telecommunications equipment (e.g., indicator lights on phones and fax machines), and consumer electronics (e.g., flat backlighting for LCDs, switches, and symbols). Its general-purpose nature also makes it suitable for a wide array of other indicator applications.

2. In-Depth Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet. Understanding these limits and typical values is crucial for reliable circuit design.

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. These are not conditions for normal operation.

• Reverse Voltage (VR): 5V - Applying a reverse bias voltage exceeding 5V can cause immediate junction breakdown. The datasheet explicitly notes the device is not designed for reverse operation; this rating is primarily for the IR test condition.
• Forward Current (IF): 25mA - The maximum continuous DC current that can flow through the LED. Exceeding this value will generate excessive heat, leading to accelerated lumen depreciation or catastrophic failure.
• Peak Forward Current (IFP): 100mA - This is the maximum allowable pulsed current, specified at a duty cycle of 1/10 and a frequency of 1kHz. It allows for brief periods of higher brightness but must be used with careful timing control.
• Power Dissipation (Pd): 95mW - The maximum power the package can dissipate as heat, calculated as VF * IF. Operating near this limit requires careful thermal management of the PCB.
• Electrostatic Discharge (ESD): 150V (HBM) - This Human Body Model rating indicates a moderate level of ESD sensitivity. Proper ESD handling procedures during assembly and handling are mandatory to prevent latent or immediate failures.
• Operating Temperature (Topr): -40°C to +85°C - The ambient temperature range over which the device is guaranteed to function within its published specifications.
• Storage Temperature (Tstg): -40°C to +90°C - The temperature range for non-operating storage.
• Soldering Temperature (Tsol): Specifies two profiles: Reflow soldering (peak of 260°C for up to 10 seconds) and Hand soldering (iron tip at 350°C for up to 3 seconds per terminal).

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of Ta=25°C and IF=5mA, unless otherwise stated. They define the optical performance of the LED.

• Luminous Intensity (Iv): 45 - 112 mcd (Min - Max) - The perceived brightness of the LED as measured in millicandelas. The wide range indicates a binning system is used (detailed in Section 3). The typical value is not stated, falling somewhere within this range.
• Viewing Angle (2θ1/2): 120° (Typical) - The angular span at which the luminous intensity drops to half of its peak value. This is a very wide viewing angle, ideal for applications requiring visibility from off-axis positions.
• Peak Wavelength (λp): 518 nm (Typical) - The wavelength at which the spectral power distribution of the emitted light is at its maximum.
• Dominant Wavelength (λd): 520 - 535 nm - The single wavelength of monochromatic light that would evoke the same perceived color as the LED's output. This is the key parameter for color specification and is also binned.
• Spectral Bandwidth (Δλ): 35 nm (Typical) - The width of the emitted spectrum, measured at half the maximum power (Full Width at Half Maximum - FWHM). A value of 35nm is characteristic of InGaN green LEDs.
• Forward Voltage (VF): 2.70 - 3.20 V - The voltage drop across the LED when driven at the test current of 5mA. This range is also subject to binning. The tolerance for this parameter is ±0.05V from the binned value.
• Reverse Current (IR): 50 μA (Max) - The maximum leakage current when the specified reverse voltage (5V) is applied.

3. Binning System Explanation

To ensure color and brightness consistency in production, LEDs are sorted into performance bins. The 19-213 uses three independent binning parameters.

3.1 Luminous Intensity Binning

LEDs are sorted into four bins (P1, P2, Q1, Q2) based on their measured luminous intensity at IF=5mA. The bins have the following ranges: P1 (45.0-57.0 mcd), P2 (57.0-72.0 mcd), Q1 (72.0-90.0 mcd), and Q2 (90.0-112.0 mcd). A tolerance of ±11% applies to the binned value. Designers must select the appropriate bin to meet the required brightness level for their application.

3.2 Dominant Wavelength Binning

Color consistency is managed by binning the dominant wavelength into three groups: X (520-525 nm), Y (525-530 nm), and Z (530-535 nm). A tolerance of ±1nm applies. This ensures that all LEDs in a given batch produce a very similar shade of green.

3.3 Forward Voltage Binning

Forward voltage is binned into five groups with 0.1V steps: 29 (2.70-2.80V), 30 (2.80-2.90V), 31 (2.90-3.00V), 32 (3.00-3.10V), and 33 (3.10-3.20V). The tolerance is ±0.05V. Knowing the VF bin can help in designing more precise current-limiting circuits, especially when driving multiple LEDs in series.

4. Performance Curve Analysis

The datasheet includes several typical characteristic curves which are essential for understanding the LED's behavior under non-standard conditions.

4.1 Relative Luminous Intensity vs. Ambient Temperature

This curve shows how light output decreases as the ambient temperature (Ta) increases. Like all LEDs, the 19-213 experiences lumen depreciation with rising temperature. Designers must account for this thermal derating in applications where the LED or its environment may get warm, to ensure sufficient brightness is maintained at the maximum operating temperature.

4.2 Relative Luminous Intensity vs. Forward Current

This graph illustrates the non-linear relationship between drive current and light output. While increasing current boosts brightness, the efficiency (lumens per watt) typically decreases at higher currents due to increased heat generation. It also shows that light output saturates as current approaches the maximum rating.

4.3 Forward Voltage vs. Forward Current (IV Curve)

The IV curve is fundamental for circuit design. It shows the exponential relationship between voltage and current in a diode. The "knee" of the curve, around the typical forward voltage, is where the LED begins to emit light significantly. This curve is crucial for selecting the appropriate current-limiting method (e.g., resistor value or constant-current driver settings).

4.4 Radiation Pattern

A polar diagram depicts the spatial distribution of light intensity. The 19-213's 120° viewing angle results in a broad, lambertian-like emission pattern. This confirms its suitability for wide-area illumination and indicators that need to be seen from various angles.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The datasheet provides a detailed 2D drawing of the LED package with critical dimensions. Key measurements include the overall length, width, and height, the size and position of the solder pads, and the location of the cathode identifier (typically a notch or a green mark on one corner). All unspecified tolerances are ±0.1mm. This drawing is essential for creating the PCB land pattern (footprint) in CAD software.

5.2 Polarity Identification

Correct polarity is vital for operation. The package includes a visual marker to identify the cathode (-) terminal. Designers and assembly technicians must reference the dimension drawing to correctly orient the component on the PCB.

6. Soldering and Assembly Guidelines

Adherence to these guidelines is critical for achieving reliable solder joints without damaging the LED.

6.1 Reflow Soldering Profile

A recommended Pb-free reflow temperature profile is provided. Key parameters include: a pre-heating zone between 150-200°C for 60-120 seconds, a time above liquidus (217°C) of 60-150 seconds, a peak temperature not exceeding 260°C, and a maximum time at peak of 10 seconds. The maximum ramp-up rate is 6°C/sec, and the maximum cooling rate is 3°C/sec. Reflow soldering should not be performed more than two times.

6.2 Hand Soldering Precautions

If hand soldering is necessary, extreme care is required. The soldering iron tip temperature must be below 350°C, and contact time with each terminal must not exceed 3 seconds. A low-power iron (≤25W) is recommended. A minimum interval of 2 seconds should be left between soldering each terminal to allow heat dissipation.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in a moisture-resistant barrier bag with desiccant. The bag must not be opened until the components are ready for use. After opening, unused LEDs should be stored at ≤30°C and ≤60% Relative Humidity and used within 168 hours (7 days). If the storage time is exceeded or the desiccant indicates moisture absorption, a baking treatment at 60±5°C for 24 hours is required before use to prevent "popcorning" during reflow.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The components are supplied in embossed carrier tape with dimensions specified in the datasheet. The tape is wound onto a standard 7-inch (178mm) diameter reel. Each reel contains 3000 pieces. Reel dimensions (hub diameter, flange diameter, width) are provided for compatibility with automated assembly equipment.

7.2 Label Explanation

The reel label contains several key codes: P/N (Product Number), QTY (Packing Quantity), CAT (Luminous Intensity Rank/Bin), HUE (Chromaticity/Dominant Wavelength Rank), REF (Forward Voltage Rank), and LOT No (Traceable Lot Number). Understanding this labeling is important for inventory control and ensuring the correct performance bin is used in production.

8. Application Design Considerations

8.1 Current Limiting is Mandatory

The datasheet emphatically states that an external current-limiting resistor (or a constant-current driver) must be used. LEDs exhibit a sharp exponential rise in current with a small increase in voltage beyond their forward voltage. Without current limiting, even a minor supply voltage fluctuation can cause current to exceed the maximum rating, leading to immediate failure.

8.2 Thermal Management

While the package itself dissipates heat, the primary path for heat removal is through the solder pads into the PCB copper. For applications operating at high ambient temperatures or near maximum current, consider using a PCB with adequate thermal relief, wider copper traces, or even a dedicated thermal pad connected to a ground plane to help dissipate heat.

8.3 ESD Protection

Given the 150V HBM ESD rating, incorporating basic ESD protection on lines connected to the LED (e.g., using a transient voltage suppression diode or a series resistor) may be advisable in environments prone to static discharge, especially if the LED is user-accessible.

9. Technical Comparison and Differentiation

The 19-213 differentiates itself primarily through its combination of a very wide 120° viewing angle and water-clear resin. Many indicator LEDs use a diffused resin to widen the viewing angle, but this reduces peak on-axis intensity. The 19-213 achieves a wide angle with a clear resin, which can provide higher perceived brightness directly on-axis while maintaining good off-axis visibility. Its full compliance with modern environmental regulations (RoHS, REACH, Halogen-Free) is also a standard but essential requirement for most new designs.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use with a 5V supply?

The resistor value (R) depends on the desired forward current (IF) and the forward voltage (VF) of the specific LED bin. Use Ohm's Law: R = (V_supply - VF) / IF. For example, with a 5V supply, a VF of 3.0V (Bin 31), and a target IF of 20mA: R = (5 - 3.0) / 0.020 = 100 Ohms. Always calculate power dissipation in the resistor: P_resistor = (V_supply - VF) * IF. In this case, P = 2V * 0.02A = 0.04W, so a standard 1/8W (0.125W) resistor is sufficient.

10.2 Can I drive this LED with a PWM signal for dimming?

Yes, pulse-width modulation (PWM) is an excellent method for dimming LEDs. It works by rapidly switching the LED on and off. The perceived brightness is proportional to the duty cycle (the percentage of time the LED is on). PWM dimming maintains the color consistency of the LED, unlike analog dimming (reducing current), which can cause a color shift. Ensure the PWM frequency is high enough (typically >100Hz) to avoid visible flicker.

10.3 Why is the storage and baking process so important?

SMD packages can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating steam pressure inside the package. This can lead to internal delamination, cracking of the resin, or failure of the wire bonds—a phenomenon known as "popcorning." The moisture-sensitive packaging and baking procedures are designed to prevent this failure mode.

11. Practical Design and Usage Examples

11.1 Multi-LED Array for Panel Backlighting

For backlighting a small LCD or a switch panel, multiple 19-213 LEDs can be arranged in an array. Due to the forward voltage binning, it is generally more reliable to connect LEDs in parallel, each with its own current-limiting resistor, rather than in series. This configuration ensures that variations in VF between individual LEDs do not cause uneven current distribution and brightness. A constant-current driver IC designed for multiple parallel LED channels would provide the most uniform and efficient solution for larger arrays.

11.2 Status Indicator with Microcontroller

When driven directly from a microcontroller GPIO pin, the pin's current sourcing/sinking capability must be checked. Many MCU pins have a limit of 20-25mA, which aligns well with this LED's maximum. The circuit would consist of the LED and a series resistor connected between the MCU pin and ground (for a current-sinking configuration) or VCC (for a current-sourcing configuration). The resistor value is calculated using the MCU's output voltage (e.g., 3.3V) and the LED's VF.

12. Operating Principle Introduction

The 19-213 LED is based on a semiconductor diode structure fabricated from Indium Gallium Nitride (InGaN). When a forward voltage exceeding the diode's junction potential (approximately 2.7-3.2V) is applied, electrons and holes are injected into the active region of the semiconductor. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN alloy determines the bandgap energy of the semiconductor, which directly dictates the wavelength (color) of the emitted light. In this case, the alloy is tuned to produce photons in the green spectrum (520-535 nm). The water-clear epoxy resin encapsulant protects the semiconductor chip, provides mechanical stability, and acts as a lens to shape the emitted light into the 120° viewing angle.

13. Technology Trends and Context

The 19-213 represents a mature and widely adopted technology in the SMD LED market. The trend in this sector continues towards several key developments. First, there is a constant drive for increased luminous efficacy (more light output per watt of electrical input), which improves energy efficiency. Second, the pursuit of higher color purity and saturation, especially in the green spectrum, remains active. Third, package miniaturization continues, with even smaller form factors than the 19-213 becoming common for ultra-compact devices. Finally, integration is a growing trend, with multi-color LEDs (RGB) or LEDs with integrated control circuits (like I2C addressable LEDs) combining multiple functions into a single package, simplifying design and assembly. The 19-213, with its focus on reliability, wide availability, and compliance, serves as a fundamental building block in a vast ecosystem of indicator and illumination applications.