SMD LED 19-213/GHC-XS1T1N/3T Datasheet - Brilliant Green - 120° Viewing Angle - Water Clear Resin - 2.7-3.7V - 25mA - English Technical Document

1. Product Overview

The 19-213/GHC-XS1T1N/3T is a surface-mount device (SMD) LED designed for modern, compact electronic applications. It represents a significant advancement over traditional lead-frame LEDs, offering substantial benefits in terms of board space utilization, assembly efficiency, and final product miniaturization.

1.1 Core Advantages and Product Positioning

This LED's primary advantage lies in its miniature footprint, which directly enables smaller printed circuit board (PCB) designs, higher component packing density, and reduced requirements for storage space. The lightweight construction further makes it an ideal choice for applications where weight is a critical factor. It is positioned as a reliable, general-purpose indicator and backlighting solution suitable for automated high-volume manufacturing.

1.2 Target Market and Applications

The device is targeted at a broad range of industries requiring compact, efficient lighting. Key application areas include:

• Automotive Interior: Backlighting for dashboard instruments, switches, and control panels.
• Telecommunications: Status indicators and keypad backlighting in telephones, fax machines, and other communication devices.
• Consumer Electronics: Flat backlighting for liquid crystal displays (LCDs), switch illumination, and symbolic indicators.
• General Purpose: Any application requiring a small, bright, green indicator light.

2. Technical Specifications and Objective Interpretation

This section provides a detailed, objective analysis of the LED's electrical, optical, and thermal characteristics as defined in the datasheet.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation under or at these limits is not guaranteed.

• Reverse Voltage (V_R): 5V. Exceeding this voltage in reverse bias can cause immediate junction breakdown.
• Continuous Forward Current (I_F): 25mA. The maximum DC current for reliable long-term operation.
• Peak Forward Current (I_FP): 100mA (at 1/10 duty cycle, 1kHz). Suitable for pulsed operation but not for DC.
• Power Dissipation (P_d): 95mW. The maximum power the package can dissipate without exceeding its thermal limits.
• Electrostatic Discharge (ESD): 150V (Human Body Model). Indicates moderate sensitivity; standard ESD handling precautions are necessary.
• Operating & Storage Temperature: -40°C to +85°C (operating), -40°C to +90°C (storage). Suitable for industrial and extended temperature range applications.
• Soldering Temperature: Reflow: 260°C for 10 seconds max. Hand soldering: 350°C for 3 seconds max per terminal.

2.2 Electro-Optical Characteristics (T_a=25°C)

These are the typical performance parameters under standard test conditions.

• Luminous Intensity (I_v): 180-360 mcd (at I_F=20mA). This defines the perceived brightness. The wide range indicates a binning system is used (see Section 3).
• Viewing Angle (2θ_1/2): 120 degrees (typical). This wide angle provides a broad, even illumination pattern suitable for backlighting and indicators viewed from various angles.
• Peak Wavelength (λ_p): 518 nm (typical). The spectral peak of the emitted light, in the brilliant green region.
• Dominant Wavelength (λ_d): 515-530 nm. Defines the perceived color hue. This range is also subject to binning.
• Spectral Bandwidth (Δλ): 35 nm (typical). The width of the emitted spectrum at half the peak intensity.
• Forward Voltage (V_F): 2.70-3.70 V (at I_F=20mA). Important for driver circuit design and power consumption calculation. This parameter is binned.
• Reverse Current (I_R): < 50 µA (at V_R=5V). A low leakage current specification.

Critical Note: The datasheet explicitly states the device is not designed for reverse operation. The reverse voltage rating is for leakage current testing only.

3. Binning System Explanation

To ensure consistency in mass production, LEDs are sorted (binned) based on key parameters. The 19-213 uses a three-dimensional binning system.

3.1 Luminous Intensity Binning

Bins: S1 (180-225 mcd), S2 (225-285 mcd), T1 (285-360 mcd). Designers must select the appropriate bin to meet the required brightness in their application, considering a ±11% tolerance within each bin.

3.2 Dominant Wavelength Binning

Bins: W (515-520 nm), X (520-525 nm), Y (525-530 nm). This ensures color consistency across multiple LEDs in an array. Tolerance within a bin is ±1 nm.

3.3 Forward Voltage Binning

Bins: 10 (2.70-2.90V), 11 (2.90-3.10V), 12 (3.10-3.30V), 13 (3.30-3.50V), 14 (3.50-3.70V). Selecting LEDs from the same V_F bin helps achieve uniform current sharing when connected in parallel and predictable power supply requirements. Tolerance within a bin is ±0.1V.

4. Performance Curve Analysis

The datasheet provides several characteristic curves essential for understanding device behavior under varying conditions.

4.1 Forward Current vs. Forward Voltage (I-V Curve)

This curve shows the exponential relationship between current and voltage. For a typical LED, a small increase in voltage beyond the turn-on point causes a large increase in current. This underscores the necessity of using a current-limiting resistor or constant-current driver to prevent thermal runaway.

4.2 Relative Luminous Intensity vs. Ambient Temperature

The light output decreases as the ambient temperature increases. This curve is crucial for applications operating in high-temperature environments (e.g., inside automotive dashboards). Designers must derate the expected brightness based on the operating temperature.

4.3 Relative Luminous Intensity vs. Forward Current

Light output is generally proportional to forward current, but the relationship is not perfectly linear, especially at higher currents. Efficiency may drop at very high currents due to increased thermal effects.

4.4 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of ambient temperature. As temperature rises, the maximum safe current decreases to prevent exceeding the junction temperature limit and ensure long-term reliability.

4.5 Spectrum Distribution

The curve shows a single peak centered around 518 nm, confirming the monochromatic green output. The 35 nm bandwidth indicates a relatively pure green color.

4.6 Radiation Diagram

Illustrates the spatial distribution of light intensity, confirming the 120-degree viewing angle with a typical lambertian or near-lambertian emission pattern.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The datasheet includes a detailed dimensional drawing. Key features include the overall length, width, and height, the solder pad layout, and the polarity indicator (typically a notch or a marked cathode). All dimensions have a standard tolerance of ±0.1mm unless otherwise specified. Precise adherence to the recommended pad layout is essential for reliable soldering and proper alignment during reflow.

5.2 Polarity Identification

Correct polarity connection is mandatory. The package includes a visual marker (e.g., a green dot, a cut corner, or a cathode mark) to identify the cathode terminal. Connecting the LED in reverse bias can damage it.

6. Soldering and Assembly Guidelines

Proper handling and soldering are critical for yield and reliability.

6.1 Reflow Soldering Profile

A lead-free (Pb-free) reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (TAL): >217°C for 60-150 seconds.
• Peak Temperature: 260°C maximum, held for 10 seconds maximum.
• Ramp Rates: Heating: 3°C/sec max. Cooling: 6°C/sec max.

Important: Reflow soldering should not be performed more than two times.

6.2 Hand Soldering Instructions

If hand soldering is unavoidable:

• Use a soldering iron with a tip temperature < 350°C.
• Limit soldering time to 3 seconds per terminal.Use an iron with a power rating < 25W.Allow a minimum 2-second interval between soldering each terminal.The datasheet cautions that damage often occurs during hand soldering.

6.3 Storage and Moisture Sensitivity

This component is moisture-sensitive.

• Before Use: Do not open the moisture-proof barrier bag until ready for use.
• After Opening: Use within 168 hours (7 days). Store unused parts at ≤30°C and ≤60% RH.
• Rebaking: If the exposure time is exceeded or the desiccant indicates moisture, bake at 60±5°C for 24 hours.

6.4 Critical Precautions

• Over-current Protection: An external current-limiting resistor is mandatory. A small voltage change can cause a large current change, leading to immediate failure.
• Mechanical Stress: Avoid applying stress to the LED body during soldering or in the final application. Do not warp the PCB after assembly.
• Repair: Not recommended. If absolutely necessary, use a dual-head soldering iron to simultaneously heat both terminals and avoid thermal stress. Verify device functionality after repair.

7. Packaging and Ordering Information

7.1 Standard Packaging

The device is supplied in 8mm tape on 7-inch diameter reels, compatible with standard automated pick-and-place equipment. Each reel contains 3000 pieces.

7.2 Moisture-Resistant Packaging

For extended shelf life, reels are packaged in aluminum moisture-proof bags with desiccant and humidity indicator cards.

7.3 Label Explanation

Reel labels contain key information:

• CPN: Customer's part number.
• P/N: Manufacturer's part number (e.g., 19-213/GHC-XS1T1N/3T).
• QTY: Quantity on the reel.
• CAT: Luminous Intensity bin code (e.g., S1, T1).
• HUE: Chromaticity/Dominant Wavelength bin code (e.g., W, X, Y).
• REF: Forward Voltage bin code (e.g., 10, 11, 12).
• LOT No.: Traceability lot number.

8. Application Suggestions and Design Considerations

8.1 Driver Circuit Design

Always drive this LED with a constant current or use a series resistor calculated based on the worst-case forward voltage (max V_F bin) and the supply voltage to ensure the current never exceeds 25mA DC. For example, with a 5V supply and a V_F of 3.7V, a series resistor of at least (5V - 3.7V) / 0.025A = 52 Ohms is required. Use a higher value for a safety margin.

8.2 Thermal Management

While the package is small, effective thermal management on the PCB is important for longevity and maintaining brightness. Use adequate copper area connected to the thermal pads (if any) or the anode/cathode traces to dissipate heat, especially when operating near the maximum current or in high ambient temperatures.

8.3 Optical Design

The 120-degree viewing angle and water-clear resin make this LED suitable for wide-angle indicators. For focused light or specific beam patterns, secondary optics (lenses, light guides) will be required. The clear resin provides the highest light output but may cause a visible "hot spot"; diffused resin alternatives (not this part) are better for even illumination.

9. Compliance and Environmental Specifications

This product adheres to several key international standards, simplifying its use in global markets:

• RoHS Compliant: Free of restricted hazardous substances like lead, mercury, and cadmium.
• EU REACH Compliant: Compliant with the Registration, Evaluation, Authorisation and Restriction of Chemicals regulation.
• Halogen-Free: Meets strict limits: Bromine (Br) < 900 ppm, Chlorine (Cl) < 900 ppm, Br+Cl < 1500 ppm. This is important for reducing toxic emissions in case of fire.
• Pb-Free: The soldering finish and materials are lead-free.

10. Technical Comparison and Differentiation

Compared to older through-hole LED technologies, this SMD LED offers:

• Size Reduction: Drastically smaller, enabling miniaturization.
• Manufacturing Efficiency: Compatible with fully automated SMT assembly lines, reducing labor cost and increasing placement speed and accuracy.
• Performance: Typically offers better thermal path to the PCB than many through-hole designs, potentially improving longevity at high currents.

Compared to other SMD green LEDs, its specific combination of 120° viewing angle, water-clear lens, and the defined binning structure for intensity, wavelength, and voltage are its key differentiating factors for designers requiring predictable performance.

11. Frequently Asked Questions (FAQ)

Q: Can I drive this LED directly from a 3.3V or 5V microcontroller pin? A: No. You must use a series current-limiting resistor. The forward voltage is ~3V, and a GPIO pin cannot safely source/sink 20mA while also controlling the voltage drop. Use a transistor or dedicated LED driver.

Q: Why is the luminous intensity range so wide (180-360 mcd)? A: This is the total production range. Devices are sorted into specific bins (S1, S2, T1). You must specify the required bin when ordering to ensure brightness consistency.

Q: The datasheet says "do not open bag before use." What happens if I do? A: Moisture can be absorbed into the plastic package. During reflow soldering, this trapped moisture can rapidly expand ("popcorn effect"), causing internal delamination and cracking, leading to immediate or latent failure.

Q: Can I use this for outdoor applications? A: The operating temperature range (-40°C to +85°C) supports many outdoor environments. However, long-term exposure to UV light and weather may degrade the resin. For harsh outdoor use, LEDs with specifically formulated, UV-resistant encapsulants are recommended.

12. Design and Usage Case Study

Scenario: Designing a status indicator panel for an industrial controller. Requirement: Multiple green LEDs to indicate "system ready," "communication active," etc. Uniform brightness and color are critical for user perception.

Design Steps:

1. Binning Selection: To ensure uniformity, specify a single, tight bin for all LEDs: e.g., Luminous Intensity Bin T1 (285-360 mcd), Dominant Wavelength Bin X (520-525 nm), and Forward Voltage Bin 12 (3.10-3.30V). This guarantees all LEDs will behave very similarly.
2. Circuit Design: Use a constant current LED driver IC capable of driving multiple channels. This provides identical current to each LED regardless of small V_F variations, ensuring perfect brightness matching. Alternatively, if using a resistor per LED, calculate the resistor value based on the highest V_F in the bin (3.30V) to guarantee no LED is over-driven.
3. PCB Layout: Place the LEDs with consistent orientation. Include a generous copper pour connected to the cathode pads to aid heat dissipation, as the panel may be on continuously.
4. Assembly: Follow the specified reflow profile precisely. Keep the reels sealed until the moment they are loaded into the pick-and-place machine feeder to comply with moisture sensitivity level (MSL) requirements.

This approach results in a professional-looking panel with consistent, reliable indicator lights.

13. Operating Principle Introduction

This LED is based on an Indium Gallium Nitride (InGaN) semiconductor chip. When a forward voltage exceeding the diode's turn-on threshold (the V_F) is applied, electrons and holes are injected into the active region of the semiconductor junction. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the InGaN material determines the wavelength (color) of the emitted light; in this case, tuned to produce brilliant green light with a peak at 518 nm. The water-clear epoxy resin encapsulant protects the delicate semiconductor die, provides mechanical stability, and acts as a primary lens, shaping the initial light output pattern.

14. Technology Trends and Context

The 19-213 LED represents a mature and widely adopted SMD LED technology. Current trends in LED development relevant to such components include:

• Increased Efficiency: Ongoing improvements in epitaxial growth and chip design lead to higher luminous efficacy (more light output per watt of electrical input), allowing for either brighter indicators or lower power consumption.
• Miniaturization: The drive for smaller devices continues, with even smaller package footprints (e.g., 0402, 0201 metric) becoming common for space-constrained applications, though often with a trade-off in light output and thermal performance.
• Enhanced Reliability: Improvements in packaging materials and die attach technologies continue to extend operational lifetime and resistance to thermal cycling and humidity.
• Integrated Solutions: A broader trend is the integration of control electronics (current drivers, PWM controllers) directly with the LED die into more complex modules, simplifying end-user circuit design.

While this specific part may not incorporate the latest ultra-miniature or smart LED features, its well-characterized performance, robust packaging, and comprehensive binning make it a dependable and cost-effective choice for a vast array of standard indicator and backlighting applications.