Table of Contents
- 1. Product Overview
- 1.1 Core Advantages & Compliance
- 1.2 Target Applications
- 2. Technical Specifications Deep Dive
- 2.1 Device Selection & Chip Materials
- 2.2 Absolute Maximum Ratings
- 2.3 Electro-Optical Characteristics
- 3. Binning System Explanation
- 3.1 Luminous Intensity Binning
- 3.2 Forward Voltage Binning
- 4. Performance Curve Analysis
- 4.1 Forward Current vs. Forward Voltage (I-V Curve)
- 4.2 Luminous Intensity vs. Forward Current
- 4.3 Luminous Intensity vs. Ambient Temperature
- 4.4 Spectral Distribution
- 5. Mechanical & Package Information
- 5.1 Package Dimensions
- 6. Soldering, Assembly & Storage Guidelines
- 6.1 Current Protection & Circuit Design
- 6.2 Storage Conditions
- 6.3 Reflow Soldering Profile (Pb-free)
- 6.4 Hand Soldering & Rework
- 7. Packaging & Ordering Information
- 7.1 Reel and Tape Specifications
- 7.2 Label Explanation
- 8. Application Design Considerations
- 8.1 Driver Circuit Design
- 8.2 Thermal Management
- 8.3 ESD Protection
- 9. Technical Comparison & Differentiation
- 10. Frequently Asked Questions (FAQ)
- LED Specification Terminology
- Photoelectric Performance
- Electrical Parameters
- Thermal Management & Reliability
- Packaging & Materials
- Quality Control & Binning
- Testing & Certification
1. Product Overview
The 17-223/BHR7C-C30/3C is a multi-color Surface Mount Device (SMD) LED available in Blue (BH) and Dark-Red (R7) variants. This component is designed for high-density PCB applications where space and weight are critical constraints. Its compact SMD package enables significant reductions in board size and equipment footprint compared to traditional lead-frame LEDs.
The LED is supplied on 8mm tape mounted on 7-inch diameter reels, making it fully compatible with automated pick-and-place assembly equipment. It is qualified for standard infrared and vapor phase reflow soldering processes.
1.1 Core Advantages & Compliance
The product offers several key advantages and complies with major environmental and safety standards:
- Miniaturization: Enables smaller PCBs, higher packing density, and reduced storage requirements.
- Lightweight: Ideal for portable and miniature electronic applications.
- Environmental Compliance: The product is Pb-free (lead-free), compliant with the EU RoHS directive, and adheres to EU REACH regulations.
- Halogen-Free: Compliant with halogen-free requirements (Bromine <900 ppm, Chlorine <900 ppm, Br+Cl < 1500 ppm).
- Process Compatibility: Designed for reliable performance in standard SMT reflow soldering.
1.2 Target Applications
This LED is suitable for a variety of indicator and backlighting functions:
- Backlighting for automotive dashboards and switches.
- Status indicators and keypad backlighting in telecommunication devices (telephones, fax machines).
- Flat backlighting for LCD panels, switches, and symbols.
- General-purpose indicator applications.
2. Technical Specifications Deep Dive
2.1 Device Selection & Chip Materials
The specific variant is defined by a product code. The two main chip materials used are:
- Code BH: Utilizes InGaN (Indium Gallium Nitride) semiconductor material to produce Blue light. The lens resin is water clear.
- Code R7: Utilizes AlGaInP (Aluminum Gallium Indium Phosphide) semiconductor material to produce Dark-Red light.
2.2 Absolute Maximum Ratings
Stresses beyond these limits may cause permanent damage. All ratings are specified at an ambient temperature (Ta) of 25°C.
| Parameter | Symbol | Code | Rating | Unit |
|---|---|---|---|---|
| Reverse Voltage | VR | All | 5 | V |
| Forward Current | IF | BH | 10 | mA |
| R7 | 25 | mA | ||
| Peak Forward Current (Duty 1/10 @1kHz) | IFP | BH | 100 | mA |
| R7 | 60 | mA | ||
| Power Dissipation | Pd | BH | 40 | mW |
| R7 | 60 | mW | ||
| Electrostatic Discharge (HBM) | ESD | BH | 150 | V |
| R7 | 2000 | V | ||
| Operating Temperature | Topr | All | -40 to +85 | °C |
| Storage Temperature | Tstg | All | -40 to +90 | °C |
Soldering Temperature: The device can withstand reflow soldering with a peak temperature of 260°C for up to 10 seconds. For hand soldering, the iron tip temperature must not exceed 350°C for a maximum of 3 seconds per terminal.
2.3 Electro-Optical Characteristics
Typical performance parameters measured at Ta=25°C and IF=5mA, unless otherwise stated.
| Parameter | Symbol | Code | Min. | Typ. | Max. | Unit | Condition |
|---|---|---|---|---|---|---|---|
| Luminous Intensity | Iv | BH | 22.5 | - | 57.0 | mcd | IF=5mA |
| R7 | 14.5 | - | 36.0 | mcd | IF=5mA | ||
| Viewing Angle (2θ1/2) | 2θ1/2 | All | - | 130 | - | deg | - |
| Peak Wavelength | λp | BH | - | 468 | - | nm | - |
| R7 | - | 639 | - | nm | - | ||
| Dominant Wavelength | λd | BH | 465 | - | 475 | nm | - |
| R7 | 625 | - | 635 | nm | - | ||
| Spectrum Bandwidth | Δλ | BH | - | 25 | - | nm | - |
| R7 | - | 20 | - | nm | - | ||
| Forward Voltage | VF | BH | 2.70 | - | 3.20 | V | IF=5mA |
| R7 | 1.55 | - | 2.15 | V | IF=5mA | ||
| Reverse Current | IR | BH | - | - | 50 | μA | VR=5V |
| R7 | - | - | 10 | μA | VR=5V |
Important Notes:
- Tolerance of Luminous Intensity is ±11%.
- Tolerance of Dominant Wavelength is ±1nm.
- Tolerance of Forward Voltage is ±0.1V.
- Radiant intensity (RA) is tested at 5mA.
- Reverse voltage testing is for characterization only; the LED must not be operated in reverse bias.
3. Binning System Explanation
To ensure consistency in production, LEDs are sorted into bins based on key parameters.
3.1 Luminous Intensity Binning
LEDs are categorized based on their light output at 5mA.
For Blue (BH) LEDs:
- Bin 1: 22.5 mcd (Min) to 36.0 mcd (Max)
- Bin 2: 36.0 mcd (Min) to 57.0 mcd (Max)
For Dark-Red (R7) LEDs:
- Bin 1: 14.5 mcd (Min) to 22.5 mcd (Max)
- Bin 2: 22.5 mcd (Min) to 36.0 mcd (Max)
3.2 Forward Voltage Binning
LEDs are also sorted by their forward voltage drop to aid in circuit design for current regulation.
For Blue (BH) LEDs: Five bins from 2.70V to 3.20V in 0.1V steps (e.g., Bin 1: 2.70-2.80V, Bin 5: 3.10-3.20V).
For Dark-Red (R7) LEDs: Three bins from 1.55V to 2.15V in 0.2V steps (e.g., Bin 1: 1.55-1.75V, Bin 3: 1.95-2.15V).
Note: Voltage bin tolerance is ±0.05V.
4. Performance Curve Analysis
The datasheet includes typical characteristic curves for both LED types. While specific graph data points are not provided in the text, the curves typically illustrate the following relationships, which are critical for design:
4.1 Forward Current vs. Forward Voltage (I-V Curve)
This curve shows the exponential relationship between current and voltage. The Blue (BH) LED, based on InGaN, will have a higher typical forward voltage (≈3.0V) compared to the Dark-Red (R7) AlGaInP LED (≈1.8V). This difference is crucial for selecting the appropriate current-limiting resistor or driver circuit.
4.2 Luminous Intensity vs. Forward Current
This graph demonstrates how light output increases with current. It is typically linear within the recommended operating current range but will saturate at higher currents. Designers use this to determine the drive current needed to achieve a desired brightness level.
4.3 Luminous Intensity vs. Ambient Temperature
LED light output decreases as junction temperature rises. This curve is vital for applications operating in high-temperature environments or where thermal management is challenging. It helps in derating the LED's performance for reliable operation.
4.4 Spectral Distribution
These curves plot relative intensity against wavelength, showing the peak wavelength (λp) and the spectral bandwidth (Δλ). The Blue LED has a typical peak at 468nm with a 25nm bandwidth, while the Dark-Red peaks at 639nm with a 20nm bandwidth.
5. Mechanical & Package Information
5.1 Package Dimensions
The 17-223 LED has a standard SMD package. Key dimensions (in mm, tolerance ±0.1mm unless specified) include:
- Overall Length: 3.2 mm
- Overall Width: 2.8 mm
- Overall Height: 1.9 mm
- Lead (Pad) Dimensions: Specific pad size and spacing are defined to ensure proper soldering and mechanical stability.
Polarity Identification: The package includes a polarity mark, typically a notch or a dot on the top or a chamfered corner, to indicate the cathode. Correct orientation is essential for circuit operation.
6. Soldering, Assembly & Storage Guidelines
6.1 Current Protection & Circuit Design
Critical: An external current-limiting resistor must be used in series with the LED. The LED is a diode with a steep I-V curve; a small increase in voltage can cause a large, potentially destructive increase in current. The resistor value is calculated using Ohm's Law: R = (Vsupply - VF) / IF, where VF is the LED's forward voltage at the desired current IF.
6.2 Storage Conditions
The LEDs are packaged in a moisture-sensitive barrier bag with desiccant.
- Do not open the moisture-proof bag until ready for assembly.
- After opening, unused LEDs should be stored at ≤30°C and ≤60% Relative Humidity (RH).
- The "floor life" after opening is 1 year under these conditions.
- If the bag is opened and parts remain, they should be resealed or stored in a dry cabinet.
- If the desiccant indicator changes color or the storage time is exceeded, a baking treatment is required: 60°C ±5°C for 24 hours before reflow soldering.
6.3 Reflow Soldering Profile (Pb-free)
A recommended temperature profile is provided:
- Pre-heating: 150-200°C for 60-120 seconds.
- Time Above Liquidus (TAL): 60-150 seconds above 217°C.
- Peak Temperature: Maximum of 260°C, held for no more than 10 seconds.
- Heating Rate: Maximum 6°C/second up to 255°C.
- Cooling Rate: Maximum 3°C/second.
Important Rules:
- Reflow soldering should not be performed more than two times.
- Avoid mechanical stress on the LED body during heating.
- Do not warp the PCB after soldering.
6.4 Hand Soldering & Rework
If hand soldering is unavoidable:
- Use a soldering iron with a tip temperature ≤350°C.
- Apply heat to each terminal for ≤3 seconds.
- Use an iron with power ≤25W.
- Allow a cooling interval of ≥2 seconds between soldering each terminal.
- Avoid repair/rework after the LED is soldered. If absolutely necessary, use a dual-head soldering iron to simultaneously heat both terminals and lift the component to prevent pad damage. Verify LED functionality after rework.
7. Packaging & Ordering Information
7.1 Reel and Tape Specifications
The product is supplied for automated assembly:
- Carrier Tape Width: 8 mm.
- Reel Diameter: 7 inches (178 mm).
- Pocket Pitch: Defined in the carrier tape drawing.
- Quantity per Reel: 3000 pieces.
7.2 Label Explanation
The reel label contains codes that specify the exact product characteristics:
- CPN: Customer's Part Number (optional).
- P/N: Manufacturer's Part Number (e.g., 17-223/BHR7C-C30/3C).
- QTY: Packing Quantity on the reel.
- CAT: Luminous Intensity Rank (Bin code for brightness).
- HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
- REF: Forward Voltage Rank (Bin code for VF).
- LOT No: Manufacturing Lot Number for traceability.
8. Application Design Considerations
8.1 Driver Circuit Design
Due to the different forward voltages of the Blue (≈3.0V) and Dark-Red (≈1.8V) LEDs, they cannot be connected in parallel directly to the same voltage source with a single shared current-limiting resistor. Each color string should have its own independently calculated resistor to ensure proper current and brightness. For constant brightness across temperature or supply voltage variations, consider using a constant current driver instead of a simple resistor.
8.2 Thermal Management
While SMD LEDs are small, their performance and lifetime are temperature-dependent. Ensure adequate thermal relief in the PCB pad design (thermal vias to inner layers or ground planes) if operating at high ambient temperatures or near maximum current. The maximum junction temperature is indirectly limited by the power dissipation (Pd) rating.
8.3 ESD Protection
The Blue (BH) LED has a relatively low ESD withstand voltage (150V HBM). Implement standard ESD precautions during handling and assembly. The Dark-Red (R7) LED is more robust (2000V HBM).
9. Technical Comparison & Differentiation
The 17-223 series offers a combination of features suitable for cost-effective, high-volume applications:
- Dual-Color Option in One Package Series: Provides design flexibility for multi-indicator panels using the same footprint.
- Wide Viewing Angle (130°): Ensures good visibility from various angles, ideal for panel indicators.
- Full Environmental Compliance: Meets modern RoHS, REACH, and Halogen-Free requirements, simplifying end-product certification.
- Robust Packaging: The specified reflow profile and moisture sensitivity level (implied by baking requirements) indicate it is suitable for standard industrial SMT processes.
10. Frequently Asked Questions (FAQ)
Q1: Can I drive this LED directly from a 3.3V or 5V logic supply?
A: No. You must always use a series current-limiting resistor. For example, to drive the Blue LED at 5mA from a 3.3V supply: R = (3.3V - 3.0V) / 0.005A = 60Ω. Use the actual VF from the binning information for accurate calculation.
Q2: Why is the storage and baking information so important?
A: SMD packages can absorb moisture from the air. During reflow soldering, this moisture can turn to steam rapidly, causing internal delamination or "popcorning," which cracks the package and destroys the LED. Proper storage and baking prevent this.
Q3: What does the "Peak Forward Current" rating mean?
A: This is the maximum allowable current for very short pulses (with a 10% duty cycle at 1kHz). It is useful for multiplexing schemes or PWM dimming where the average current is within the continuous (IF) rating, but instantaneous current is higher.
Q4: How do I interpret the binning codes (CAT, HUE, REF) on the label?
A: These codes allow you to select LEDs with tightly controlled parameters. For consistent appearance in an array, specify and use LEDs from the same CAT (brightness) and HUE (color) bins. Using the same REF (voltage) bin can help ensure uniform current sharing in parallel connections.
LED Specification Terminology
Complete explanation of LED technical terms
Photoelectric Performance
| Term | Unit/Representation | Simple Explanation | Why Important |
|---|---|---|---|
| Luminous Efficacy | lm/W (lumens per watt) | Light output per watt of electricity, higher means more energy efficient. | Directly determines energy efficiency grade and electricity cost. |
| Luminous Flux | lm (lumens) | Total light emitted by source, commonly called "brightness". | Determines if the light is bright enough. |
| Viewing Angle | ° (degrees), e.g., 120° | Angle where light intensity drops to half, determines beam width. | Affects illumination range and uniformity. |
| CCT (Color Temperature) | K (Kelvin), e.g., 2700K/6500K | Warmth/coolness of light, lower values yellowish/warm, higher whitish/cool. | Determines lighting atmosphere and suitable scenarios. |
| CRI / Ra | Unitless, 0–100 | Ability to render object colors accurately, Ra≥80 is good. | Affects color authenticity, used in high-demand places like malls, museums. |
| SDCM | MacAdam ellipse steps, e.g., "5-step" | Color consistency metric, smaller steps mean more consistent color. | Ensures uniform color across same batch of LEDs. |
| Dominant Wavelength | nm (nanometers), e.g., 620nm (red) | Wavelength corresponding to color of colored LEDs. | Determines hue of red, yellow, green monochrome LEDs. |
| Spectral Distribution | Wavelength vs intensity curve | Shows intensity distribution across wavelengths. | Affects color rendering and quality. |
Electrical Parameters
| Term | Symbol | Simple Explanation | Design Considerations |
|---|---|---|---|
| Forward Voltage | Vf | Minimum voltage to turn on LED, like "starting threshold". | Driver voltage must be ≥Vf, voltages add up for series LEDs. |
| Forward Current | If | Current value for normal LED operation. | Usually constant current drive, current determines brightness & lifespan. |
| Max Pulse Current | Ifp | Peak current tolerable for short periods, used for dimming or flashing. | Pulse width & duty cycle must be strictly controlled to avoid damage. |
| Reverse Voltage | Vr | Max reverse voltage LED can withstand, beyond may cause breakdown. | Circuit must prevent reverse connection or voltage spikes. |
| Thermal Resistance | Rth (°C/W) | Resistance to heat transfer from chip to solder, lower is better. | High thermal resistance requires stronger heat dissipation. |
| ESD Immunity | V (HBM), e.g., 1000V | Ability to withstand electrostatic discharge, higher means less vulnerable. | Anti-static measures needed in production, especially for sensitive LEDs. |
Thermal Management & Reliability
| Term | Key Metric | Simple Explanation | Impact |
|---|---|---|---|
| Junction Temperature | Tj (°C) | Actual operating temperature inside LED chip. | Every 10°C reduction may double lifespan; too high causes light decay, color shift. |
| Lumen Depreciation | L70 / L80 (hours) | Time for brightness to drop to 70% or 80% of initial. | Directly defines LED "service life". |
| Lumen Maintenance | % (e.g., 70%) | Percentage of brightness retained after time. | Indicates brightness retention over long-term use. |
| Color Shift | Δu′v′ or MacAdam ellipse | Degree of color change during use. | Affects color consistency in lighting scenes. |
| Thermal Aging | Material degradation | Deterioration due to long-term high temperature. | May cause brightness drop, color change, or open-circuit failure. |
Packaging & Materials
| Term | Common Types | Simple Explanation | Features & Applications |
|---|---|---|---|
| Package Type | EMC, PPA, Ceramic | Housing material protecting chip, providing optical/thermal interface. | EMC: good heat resistance, low cost; Ceramic: better heat dissipation, longer life. |
| Chip Structure | Front, Flip Chip | Chip electrode arrangement. | Flip chip: better heat dissipation, higher efficacy, for high-power. |
| Phosphor Coating | YAG, Silicate, Nitride | Covers blue chip, converts some to yellow/red, mixes to white. | Different phosphors affect efficacy, CCT, and CRI. |
| Lens/Optics | Flat, Microlens, TIR | Optical structure on surface controlling light distribution. | Determines viewing angle and light distribution curve. |
Quality Control & Binning
| Term | Binning Content | Simple Explanation | Purpose |
|---|---|---|---|
| Luminous Flux Bin | Code e.g., 2G, 2H | Grouped by brightness, each group has min/max lumen values. | Ensures uniform brightness in same batch. |
| Voltage Bin | Code e.g., 6W, 6X | Grouped by forward voltage range. | Facilitates driver matching, improves system efficiency. |
| Color Bin | 5-step MacAdam ellipse | Grouped by color coordinates, ensuring tight range. | Guarantees color consistency, avoids uneven color within fixture. |
| CCT Bin | 2700K, 3000K etc. | Grouped by CCT, each has corresponding coordinate range. | Meets different scene CCT requirements. |
Testing & Certification
| Term | Standard/Test | Simple Explanation | Significance |
|---|---|---|---|
| LM-80 | Lumen maintenance test | Long-term lighting at constant temperature, recording brightness decay. | Used to estimate LED life (with TM-21). |
| TM-21 | Life estimation standard | Estimates life under actual conditions based on LM-80 data. | Provides scientific life prediction. |
| IESNA | Illuminating Engineering Society | Covers optical, electrical, thermal test methods. | Industry-recognized test basis. |
| RoHS / REACH | Environmental certification | Ensures no harmful substances (lead, mercury). | Market access requirement internationally. |
| ENERGY STAR / DLC | Energy efficiency certification | Energy efficiency and performance certification for lighting. | Used in government procurement, subsidy programs, enhances competitiveness. |