SMD LED Orange AlInGaP Datasheet - Dimensions 3.2x2.8x1.9mm - Voltage 1.8-2.6V - Power 130mW - English Technical Document

1. Product Overview

This document details the specifications for a surface-mount device (SMD) Light Emitting Diode (LED) utilizing an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material to produce an orange light output. These LEDs are designed in miniature packages specifically for automated printed circuit board (PCB) assembly, making them ideal for space-constrained applications across a broad spectrum of consumer and industrial electronics.

1.1 Core Advantages and Target Market

The primary advantages of this LED series include compliance with RoHS (Restriction of Hazardous Substances) directives, compatibility with automated pick-and-place equipment, and suitability for infrared (IR) reflow soldering processes. The devices are packaged on 8mm tape wound onto 7-inch diameter reels, adhering to EIA (Electronic Industries Alliance) standards for efficient manufacturing. Key target markets encompass telecommunications equipment, office automation devices, home appliances, industrial control systems, and various indoor signage and display applications where reliable, compact indicator lighting is required.

2. Technical Parameters: In-Depth Objective Interpretation

This section provides a detailed breakdown of the device's operational limits and performance characteristics under defined conditions.

2.1 Absolute Maximum Ratings

The absolute maximum ratings define the stress limits beyond which permanent damage to the device may occur. These ratings are specified at an ambient temperature (Ta) of 25°C and must not be exceeded under any circumstances.

• Power Dissipation (Pd): 130 mW. This is the maximum amount of power the LED package can dissipate as heat.
• Peak Forward Current (IFP): 100 mA. This is the maximum allowable instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (IF): 50 mA. This is the maximum continuous forward current recommended for reliable long-term operation.
• Reverse Voltage (VR): 5 V. Applying a reverse voltage exceeding this limit can cause breakdown and damage the LED junction. The datasheet explicitly notes the device is not designed for reverse operation.
• Operating Temperature Range: -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored without degradation within these limits.

2.2 Electrical and Optical Characteristics

These parameters define the typical performance of the LED when operated under normal conditions (Ta=25°C, IF=20mA).

• Luminous Intensity (Iv): 1260 - 2500 mcd (millicandela). This is the measured light output intensity along the central axis. The wide range indicates a binning system is used (see Section 3).
• Viewing Angle (2θ½): 120 degrees (typical). This is the full angle at which the luminous intensity drops to half of its axial value, defining the beam width.
• Dominant Wavelength (λd): 600 - 610 nm. This single wavelength value perceptually defines the orange color of the emitted light, derived from the CIE chromaticity diagram.
• Spectral Line Half-Width (Δλ): 18 nm (typical). This indicates the spectral purity, representing the width of the emitted spectrum at half its maximum intensity.
• Forward Voltage (VF): 1.8 - 2.6 V. The voltage drop across the LED when conducting 20mA. A tolerance of ±0.1V applies within bins.
• Reverse Current (IR): 10 µA (max). The small leakage current when 5V reverse voltage is applied, relevant for testing purposes only.

3. Bin Rank System Explanation

To ensure consistency in production runs, LEDs are sorted into performance bins. This allows designers to select parts that meet specific voltage, brightness, and color requirements.

3.1 Forward Voltage (Vf) Rank

LEDs are categorized by their forward voltage drop at 20mA. Bin Code D2: 1.8V - 2.0V Bin Code D3: 2.0V - 2.2V Bin Code D4: 2.2V - 2.4V Bin Code D5: 2.4V - 2.6V Tolerance within each bin is ±0.1V.

3.2 Luminous Intensity (Iv) Rank

LEDs are sorted based on their light output intensity at 20mA. Bin Code W1: 1260 mcd - 1780 mcd Bin Code W2: 1780 mcd - 2500 mcd Tolerance within each bin is ±11%.

3.3 Dominant Wavelength (Wd) Rank

LEDs are grouped according to their precise color point (dominant wavelength). Bin Code P: 600 nm - 605 nm Bin Code Q: 605 nm - 610 nm Tolerance within each bin is ±1 nm.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet, their implications are critical for design. Designers should expect curves depicting:

• Relative Luminous Intensity vs. Forward Current: Shows how light output increases with current, typically in a non-linear fashion, approaching saturation at higher currents.
• Forward Voltage vs. Forward Current: Illustrates the diode's I-V characteristic, crucial for designing current-limiting circuits.
• Relative Luminous Intensity vs. Ambient Temperature: Demonstrates the reduction in light output as junction temperature rises, a key factor for thermal management.
• Spectral Distribution: A plot of relative intensity versus wavelength, showing the peak at the dominant wavelength and the shape defined by the spectral half-width.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a standard SMD package. Key dimensional notes include: - Lens Color: Water Clear. - Source Color: AlInGaP Orange. - All dimensions are in millimeters. - General tolerance is ±0.2mm unless otherwise specified. Designers must refer to the detailed mechanical drawing for exact length, width, height, and pad spacing.

5.2 Recommended PCB Attachment Pad

A land pattern (footprint) recommendation is provided for infrared or vapor phase reflow soldering. Adhering to this recommended pad layout is essential for achieving proper solder joint formation, alignment, and mechanical stability during and after the assembly process.

5.3 Polarity Identification

The datasheet includes markings or structural features (e.g., a notch, a cut corner, or a cathode mark on the package) to identify the anode and cathode terminals. Correct polarity orientation is mandatory for the device to function.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Parameters

A suggested reflow profile compliant with J-STD-020B for lead-free processes is provided. Key parameters include: - Pre-heat Temperature: 150°C - 200°C. - Pre-heat Time: Maximum 120 seconds. - Peak Body Temperature: Maximum 260°C. - Time Above Liquidus: Maximum 10 seconds (with a maximum of two reflow cycles allowed). These parameters are generic targets; board-specific characterization is recommended.

6.2 Hand Soldering (Soldering Iron)

If hand soldering is necessary: - Iron Tip Temperature: Maximum 300°C. - Soldering Time: Maximum 3 seconds per lead. - This should be performed only once to avoid thermal stress.

6.3 Storage Conditions

Proper storage is vital to prevent moisture absorption, which can cause "popcorning" during reflow. - Sealed Package: Store at ≤ 30°C and ≤ 70% RH. Use within one year. - Opened Package: Store at ≤ 30°C and ≤ 60% RH. - For components out of their original packaging for more than 168 hours, a bake at 60°C for at least 48 hours is recommended before soldering.

6.4 Cleaning

If cleaning after soldering is required, use only specified solvents such as ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute. Unspecified chemicals may damage the LED package.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied in embossed carrier tape with a protective cover tape, wound onto 7-inch (178mm) diameter reels. - Quantity: 2000 pieces per standard reel. - Minimum Order Quantity: 500 pieces for remainder quantities. - Packaging conforms to ANSI/EIA-481 specifications.

8. Application Suggestions

8.1 Typical Application Scenarios

This LED is suitable for status indication, backlighting, and decorative lighting in: - Consumer electronics (phones, laptops, appliances). - Networking and communication equipment. - Industrial control panels and instrumentation. - Indoor informational signs and displays.

8.2 Design Considerations and Drive Method

Critical: An LED is a current-operated device. To ensure consistent brightness and longevity, it must be driven with a constant current or with a voltage source and a series current-limiting resistor. When connecting multiple LEDs in parallel, a separate resistor for each LED is strongly recommended to prevent current hogging and uneven brightness due to natural variations in forward voltage (Vf) between individual devices.

9. Technical Comparison and Differentiation

Compared to older technologies like standard GaAsP (Gallium Arsenide Phosphide) LEDs, this AlInGaP-based orange LED offers significantly higher luminous efficiency, resulting in greater brightness for the same drive current. The wide 120-degree viewing angle makes it suitable for applications requiring broad visibility, as opposed to narrow-beam LEDs used for focused illumination. Its compatibility with standard SMD assembly and reflow processes differentiates it from through-hole LEDs, enabling high-volume, automated manufacturing.

10. Frequently Asked Questions Based on Technical Parameters

Q: Can I drive this LED directly from a 3.3V or 5V logic supply? A: No. You must always use a series current-limiting resistor. The resistor value is calculated as R = (Vcc - Vf) / If, where Vcc is your supply voltage, Vf is the LED's forward voltage (use the max value from the bin for a safe design), and If is the desired forward current (e.g., 20mA).

Q: Why is there such a wide range in Luminous Intensity (1260-2500 mcd)? A: This reflects the production spread. The binning system (W1, W2) allows you to select parts with a tighter brightness range for your application, ensuring visual consistency in your product.

Q: What happens if I exceed the Absolute Maximum Ratings? A: Exceeding these limits, even briefly, can cause immediate or latent damage. Over-current can destroy the semiconductor junction. Excessive reverse voltage can cause breakdown. Operating outside the temperature range can lead to premature failure or parametric shift.

11. Practical Design and Usage Case

Case: Designing a status indicator panel with 10 uniformly bright orange LEDs. 1. Circuit Design: Use a constant current driver or, for simplicity, a voltage rail (e.g., 5V) with a dedicated current-limiting resistor for each LED. For bin D4 (VF max 2.4V) at 20mA: R = (5V - 2.4V) / 0.02A = 130 Ohms. Use the next standard value (e.g., 150 Ohms) for a slightly safer current. 2. Component Selection: Specify the required bins when ordering: e.g., LTST-M670VFKT with bins D4 (for consistent voltage), W2 (for high brightness), and P (for specific orange hue). 3. PCB Layout: Follow the recommended pad layout from the datasheet for reliable soldering. 4. Assembly: Follow the IR reflow profile guidelines. If the boards will be in storage after assembly, ensure the storage conditions are met.

12. Principle Introduction

This LED operates on the principle of electroluminescence in a semiconductor. The AlInGaP material forms a p-n junction. When a forward voltage is applied, electrons from the n-region and holes from the p-region are injected into the junction region. When these charge carriers recombine, they release energy in the form of photons (light). The specific composition of the Aluminum, Indium, Gallium, and Phosphide determines the bandgap energy of the semiconductor, which directly defines the wavelength (color) of the emitted light—in this case, in the orange spectrum (~605 nm). The water-clear lens encapsulates and protects the semiconductor die while allowing the light to exit.

13. Development Trends

The general trend in SMD indicator LEDs like this one is towards ever-higher luminous efficacy (more light output per watt of electrical input), enabling lower power consumption for the same brightness. There is also a continuous drive for miniaturization while maintaining or improving optical performance. Furthermore, advancements in packaging materials and processes aim to enhance reliability, thermal performance, and compatibility with lead-free and high-temperature soldering profiles. The standardization of footprints and electrical characteristics across manufacturers simplifies design and sourcing for engineers.