SMD LED Orange AlInGaP 0603 Datasheet - Dimensions 1.6x0.8x0.6mm - Voltage 1.8-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document details the specifications for a compact, high-performance Surface-Mount Device (SMD) Light Emitting Diode (LED). The device is designed in the industry-standard 0603 package footprint, making it suitable for automated assembly processes and space-constrained applications. The LED emits light in the orange spectrum using an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material, known for its efficiency and color purity.

1.1 Features

• Compliant with RoHS (Restriction of Hazardous Substances) directives.
• Packaged on 8mm tape for compatibility with 7-inch diameter reels, facilitating automated pick-and-place operations.
• Standard EIA (Electronic Industries Alliance) package outline.
• Input/output compatible with integrated circuit (IC) logic levels.
• Designed for compatibility with automatic placement equipment.
• Suitable for use with infrared (IR) reflow soldering processes.
• Preconditioned to JEDEC (Joint Electron Device Engineering Council) Moisture Sensitivity Level 3, indicating a floor life of 168 hours at <30°C/60% RH after the bag is opened.

1.2 Applications

This LED is versatile and finds use in a broad range of electronic equipment where a compact, reliable indicator is required. Typical application areas include:

• Telecommunication Equipment: Status indicators on routers, modems, and handsets.
• Office Automation: Panel lights on printers, scanners, and multifunction devices.
• Home Appliances: Power-on/operational status lights.
• Industrial Equipment: Machine status and fault indicators.
• General Purpose: Status and signal indication.
• Symbol Luminary: Backlighting for icons and symbols on front panels.
• Front Panel Backlighting: Illumination for buttons and displays.

2. Technical Specifications Deep Dive

2.1 Absolute Maximum Ratings

The following ratings define the limits beyond which permanent damage to the device may occur. Operation under these conditions is not guaranteed. All values are specified at an ambient temperature (Ta) of 25°C.

• Power Dissipation (Pd): 72 mW. This is the maximum amount of power the device can dissipate as heat.
• Peak Forward Current (I_F(peak)): 80 mA. This is the maximum allowable instantaneous forward current, typically specified under pulsed conditions (1/10 duty cycle, 0.1ms pulse width) to prevent overheating.
• DC Forward Current (I_F): 30 mA. This is the maximum continuous forward current recommended for reliable long-term operation.
• Operating Temperature Range: -40°C to +85°C. The device is designed to function within this ambient temperature range.
• Storage Temperature Range: -40°C to +100°C. The device can be stored within this range without degradation when not powered.

2.2 Electrical and Optical Characteristics

The following table lists the typical performance parameters measured at Ta=25°C and a forward current (I_F) of 20mA, unless otherwise noted. These are the expected values under normal operating conditions.

Key Parameter Definitions:

• Luminous Intensity (I_V): A measure of the perceived power of light emitted in a specific direction, measured in millicandelas (mcd). It is measured with a filter that mimics the human eye's spectral response (CIE curve).
• Viewing Angle (2θ_1/2): The total angle (e.g., 110°) at which the luminous intensity is half of its value at 0° (on-axis). A wider angle provides a more diffuse light pattern.
• Peak Emission Wavelength (λ_p): The wavelength at which the optical output power is maximum (e.g., 611 nm).
• Dominant Wavelength (λ_d): The single wavelength that defines the perceived color of the light, derived from the CIE chromaticity diagram. It is the key parameter for color specification.
• Spectral Line Half-Width (Δλ): The width of the emission spectrum at half of its maximum intensity, indicating the color purity (e.g., 17 nm). A smaller value indicates a more monochromatic light.
• Forward Voltage (V_F): The voltage drop across the LED when a specified forward current is flowing (e.g., 1.8V to 2.4V at 20mA).
• Reverse Current (I_R): The small leakage current that flows when a reverse voltage (e.g., 5V) is applied. The device is not designed for reverse bias operation.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into different performance groups or \"bins\" based on key parameters. This allows designers to select parts that meet specific requirements for color, brightness, and voltage.

3.1 Forward Voltage (V_F) Binning

LEDs are categorized by their forward voltage at 20mA. This is crucial for designing current-limiting circuits and ensuring uniform brightness in multi-LED arrays.

3.2 Luminous Intensity (I_V) Binning

LEDs are sorted based on their minimum luminous intensity. This binning ensures a predictable minimum brightness level for the selected part.

3.3 Dominant Wavelength (λ_d) Binning

This is the primary color binning. LEDs are grouped by their dominant wavelength to guarantee a consistent orange hue within a tight tolerance of ±1 nm per bin.

4. Performance Curve Analysis

While specific graphs are referenced in the datasheet, typical performance curves for such LEDs provide valuable design insights:

• I-V (Current-Voltage) Curve: Shows the relationship between forward current and forward voltage. It is non-linear, with a characteristic \"knee\" voltage (around 1.8-2.4V for this device) above which current increases rapidly with small voltage increases. This necessitates the use of a current-limiting resistor or constant-current driver.
• Luminous Intensity vs. Forward Current: Typically shows that light output increases approximately linearly with current up to a point, after which efficiency may drop due to heating or other effects.
• Luminous Intensity vs. Ambient Temperature: Shows that light output generally decreases as ambient temperature increases. This is a critical consideration for applications in high-temperature environments.
• Spectral Distribution: A plot of relative optical power versus wavelength, showing a peak around 611 nm with a characteristic width (17 nm half-width).

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to the standard 0603 (metric 1608) package size: approximately 1.6mm in length, 0.8mm in width, and 0.6mm in height. Detailed dimensional drawings with tolerances (±0.2mm unless noted) are provided for PCB land pattern design.

5.2 Polarity Identification and Pad Design

The cathode is typically marked on the device. A recommended PCB land pattern (pad layout) for infrared or vapor phase reflow soldering is provided to ensure proper solder joint formation, component alignment, and thermal relief during soldering.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A suggested infrared reflow profile compliant with J-STD-020B for lead-free processes is included. Key parameters include:

• Pre-heat: 150-200°C for a maximum of 120 seconds to gradually heat the board and activate flux.
• Peak Temperature: Maximum of 260°C.
• Time Above Liquidus (TAL): Typically 60-90 seconds, though specific time is profile-dependent.
• Total Soldering Time: Maximum of 10 seconds at peak temperature, with a maximum of two reflow cycles allowed.

Note: The optimal profile depends on the specific PCB design, solder paste, and oven. The provided profile serves as a generic target based on JEDEC standards.

6.2 Hand Soldering

If hand soldering is necessary, use a soldering iron with a temperature not exceeding 300°C. The contact time should be limited to a maximum of 3 seconds, and this should be performed only once to prevent thermal damage to the LED chip and package.

6.3 Cleaning

Only use specified cleaning agents. Immersing the LED in ethyl alcohol or isopropyl alcohol at room temperature for less than one minute is acceptable if cleaning is required. Avoid unspecified chemicals that may damage the epoxy lens or package.

6.4 Storage Conditions

• Sealed Package: Store at ≤30°C and ≤70% Relative Humidity (RH). The product has a recommended use-by period of one year from the date code when stored in its original moisture-barrier bag with desiccant.
• Opened Package: For components removed from the sealed bag, the storage ambient should not exceed 30°C and 60% RH. It is strongly recommended to complete the IR reflow process within 168 hours (1 week) of exposure.
• Extended Storage (Opened): For storage beyond 168 hours, place components in a sealed container with desiccant or in a nitrogen desiccator. Components stored out of the original bag for more than 168 hours should be baked at approximately 60°C for at least 48 hours before soldering to remove absorbed moisture and prevent \"popcorning\" during reflow.

7. Packaging and Ordering Information

7.1 Tape and Reel Specifications

The LEDs are supplied on embossed carrier tape with a protective cover tape.

• Reel Size: Standard 7-inch (178mm) diameter.
• Quantity per Reel: 4000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Tape Dimensions: 8mm pitch tape width. Detailed dimensions for the pocket, tape, and reel are provided, conforming to ANSI/EIA-481 specifications.
• Quality: Empty component pockets are sealed. The maximum number of consecutive missing components (skips) on a reel is two.

8. Application Notes and Design Considerations

8.1 Typical Application Circuits

The most common drive method is a series current-limiting resistor. The resistor value (R_s) can be calculated using Ohm's Law: R_s = (V_supply - V_F) / I_F. Use the maximum V_F from the datasheet (or the specific bin) to ensure the current does not exceed the desired I_F (e.g., 20mA) under worst-case conditions. For applications requiring consistent brightness or operation over a wide voltage range, a constant-current driver is recommended.

8.2 Design Considerations

• Thermal Management: Although small, the LED generates heat. Ensure adequate PCB copper area or thermal vias, especially when operating near maximum current or in high ambient temperatures, to maintain performance and longevity.
• ESD (Electrostatic Discharge) Protection: LEDs are sensitive to ESD. Handle with appropriate ESD precautions during assembly and integration.
• Optical Design: The wide 110-degree viewing angle provides diffuse light. For focused light, external lenses or light pipes may be required.

9. Frequently Asked Questions (FAQs)

9.1 What is the difference between Peak Wavelength and Dominant Wavelength?

Peak Wavelength (λ_p) is the physical wavelength where the emitted optical power is highest. Dominant Wavelength (λ_d) is the perceptual wavelength that defines the color as seen by the human eye, calculated from the CIE diagram. For monochromatic LEDs like this orange one, they are often close, but λ_d is the standard for color specification and binning.

9.2 Can I drive this LED without a current-limiting resistor?

No. The forward voltage of an LED has a negative temperature coefficient and varies from unit to unit. Connecting it directly to a voltage source even slightly above its V_F will cause excessive current to flow, leading to rapid overheating and failure. A series resistor or constant-current circuit is mandatory.

9.3 Why is there a storage time limit after opening the bag?

SMD packages can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can vaporize rapidly, creating internal pressure that may crack the package (\"popcorning\"). The 168-hour limit and baking procedure are precautions against this failure mode.

9.4 How do I interpret the bin codes when ordering?

Specify the part number along with the desired bin codes for V_F, I_V, and λ_d (e.g., requesting bins D3, S1, R) to ensure you receive LEDs with the specific forward voltage range, minimum brightness, and color wavelength required for your application, ensuring consistency across your production run.

10. Technical Principles and Trends

10.1 Operating Principle

This LED is based on an AlInGaP (Aluminum Indium Gallium Phosphide) semiconductor structure. When a forward voltage is applied, electrons and holes are injected into the active region from the n-type and p-type materials, respectively. They recombine, releasing energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—in this case, orange (~611 nm).

10.2 Industry Trends

The market for miniature SMD LEDs continues to evolve. Key trends include:

• Increased Efficiency: Ongoing material and epitaxial growth improvements yield higher luminous efficacy (more light output per electrical watt input).
• Miniaturization: Packages smaller than 0603 (e.g., 0402, 0201) are becoming more common for ultra-compact devices.
• Enhanced Reliability: Improved packaging materials and processes lead to longer operational lifetimes and better performance under harsh environmental conditions.
• Tighter Binning: Demand for consistent color and brightness in applications like displays and signage drives the need for narrower binning tolerances.
• Integration: LEDs are increasingly being integrated with control ICs or packaged in multi-chip arrays for smart lighting solutions.