SMD LED Orange AllnGaP Chip Datasheet - EIA Package - 20mA - 2.4V - English Technical Document

1. Product Overview

This document details the specifications for a high-performance, surface-mount device (SMD) Light Emitting Diode (LED). The device utilizes an Ultra Bright Aluminum Indium Gallium Phosphide (AllnGaP) semiconductor chip to produce orange light. It is designed with a dome lens for enhanced light output and viewing angle. The LED is packaged in a standard EIA-compliant format, supplied on 8mm tape wound onto 7-inch diameter reels, making it fully compatible with automated pick-and-place assembly equipment. It is classified as a Green Product and complies with RoHS (Restriction of Hazardous Substances) directives.

1.1 Core Advantages

The primary advantages of this LED stem from its AllnGaP chip technology, which offers high luminous efficiency and excellent color purity for orange wavelengths. The dome lens package further improves light extraction and provides a consistent viewing angle. Its compatibility with standard infrared (IR) and vapor phase reflow soldering processes, as well as wave soldering, allows for flexible integration into modern electronic manufacturing lines. The device is also I.C. (Integrated Circuit) compatible, simplifying drive circuit design.

2. Technical Parameters Deep Objective Interpretation

2.1 Absolute Maximum Ratings

The device's operational limits are defined under an ambient temperature (Ta) of 25°C. The maximum continuous DC forward current is 30 mA. For pulsed operation, a peak forward current of 80 mA is permissible under a 1/10 duty cycle with a 0.1ms pulse width. The maximum power dissipation is 75 mW. The device can withstand a reverse voltage of up to 5 V. The operating and storage temperature range is specified from -55°C to +85°C. For soldering, it can endure wave or infrared reflow at 260°C for 5 seconds, or vapor phase reflow at 215°C for 3 minutes. A derating factor of 0.4 mA/°C applies for the forward current above 50°C.

2.2 Electro-Optical Characteristics

Key performance parameters are measured at Ta=25°C and a forward current (IF) of 20 mA. The luminous intensity (Iv) has a typical value of 1200 mcd (millicandela) with a minimum of 450 mcd. The viewing angle (2θ1/2), defined as the full angle at which intensity drops to half its axial value, is 25 degrees. The dominant wavelength (λd), which defines the perceived color, ranges from 600 nm to 610 nm with a typical value of 605 nm. The peak emission wavelength (λp) is typically 611 nm, and the spectral line half-width (Δλ) is 17 nm, indicating a relatively narrow color spectrum. The forward voltage (VF) is typically 2.0 V with a maximum of 2.4 V at 20 mA. The reverse current (IR) is a maximum of 10 μA at a reverse voltage (VR) of 5V. The device capacitance (C) is typically 40 pF measured at 0V and 1 MHz.

3. Binning System Explanation

The LEDs are sorted into bins based on key optical parameters to ensure consistency in application. This binning allows designers to select parts that meet specific brightness and color requirements.

3.1 Luminous Intensity Binning

Luminous intensity is binned at a test condition of IF=20mA. The bin codes and their corresponding ranges are: U (450-710 mcd), V (710-1120 mcd), W (1120-1800 mcd), X (1800-2800 mcd), and Y (2800-4500 mcd). A tolerance of +/-15% is applied to each intensity bin.

3.2 Dominant Wavelength Binning

Dominant wavelength is also binned at IF=20mA. The bin codes are: 1 (600-605 nm) and 2 (605-610 nm). A tighter tolerance of +/- 1 nm is specified for each dominant wavelength bin, ensuring precise color control.

4. Performance Curve Analysis

The datasheet references typical characteristic curves which are essential for understanding device behavior under varying conditions. These curves, typically plotted, would illustrate the relationship between forward current and luminous intensity (I-Iv curve), forward voltage versus forward current (I-V curve), and the variation of luminous intensity with ambient temperature. The spectral distribution curve shows the relative light output across wavelengths, centered around the 611 nm peak. Analyzing these curves helps in designing appropriate current drivers and thermal management systems to maintain consistent performance.

5. Mechanical and Packaging Information

5.1 Package Dimensions

The LED is housed in a standard EIA package. Detailed dimensional drawings are provided, with all measurements in millimeters. Tolerances are typically ±0.10 mm unless otherwise specified. The package features a dome lens constructed from a water-clear material.

5.2 Polarity Identification and Pad Design

The datasheet includes a diagram for suggested soldering pad dimensions on a printed circuit board (PCB). This layout is critical for ensuring proper solder joint formation, mechanical stability, and thermal dissipation during reflow. The diagram also clearly indicates the anode and cathode connections for correct electrical orientation.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profiles

Two suggested infrared (IR) reflow profiles are provided: one for normal (tin-lead) solder process and one for Pb-free solder process. The Pb-free profile is specifically recommended for use with SnAgCu (Tin-Silver-Copper) solder paste. These profiles define the time-temperature relationship during soldering, including preheat, soak, reflow peak, and cooling stages, to prevent thermal shock and ensure reliable solder joints without damaging the LED.

6.2 Cleaning and Storage

If cleaning is necessary after soldering, only specified chemicals should be used. Immersing the LED in ethyl alcohol or isopropyl alcohol at normal temperature for less than one minute is recommended. Unspecified chemicals may damage the package. For storage, LEDs should be kept in an environment not exceeding 30°C and 70% relative humidity. Components removed from their original moisture-barrier packaging should be reflow-soldered within one week. For longer storage outside the original pack, they should be kept in a sealed container with desiccant or in a nitrogen ambient and baked before use.

7. Packaging and Ordering Information

The LEDs are supplied on 8mm carrier tape sealed with a top cover tape. The tape is wound onto standard 7-inch (178 mm) diameter reels. Each full reel contains 1500 pieces. For quantities less than a full reel, a minimum packing quantity of 500 pieces applies for remainder lots. The packaging conforms to ANSI/EIA 481-1-A-1994 specifications. A maximum of two consecutive missing components (empty pockets) is allowed per reel.

8. Application Suggestions

8.1 Typical Application Scenarios

This high-brightness orange LED is suitable for a wide range of applications requiring clear, vibrant indicator lights. Common uses include status indicators on office equipment (printers, routers), communication devices, household appliances, control panels, and automotive interior lighting. Its compatibility with automatic placement makes it ideal for high-volume consumer electronics.

8.2 Design Considerations and Drive Method

LEDs are current-operated devices. To ensure uniform brightness when driving multiple LEDs in parallel, it is strongly recommended to use a current-limiting resistor in series with each individual LED (Circuit Model A). Driving LEDs in parallel without individual resistors (Circuit Model B) is not recommended, as slight variations in the forward voltage (Vf) characteristics between LEDs can cause significant differences in current sharing and, consequently, uneven brightness. The drive circuit should be designed to operate within the absolute maximum ratings, particularly the continuous forward current.

8.3 Electrostatic Discharge (ESD) Protection

The LED is sensitive to Electrostatic Discharge (ESD), which can cause immediate or latent damage, leading to failure or degraded performance. To prevent ESD damage: personnel should wear conductive wrist straps or anti-static gloves; all equipment, workbenches, and storage racks must be properly grounded; and an ionizer (ion blower) should be used to neutralize static charges that may accumulate on the plastic lens during handling. ESD-damaged LEDs may exhibit abnormal characteristics like high reverse leakage current.

9. Technical Comparison and Differentiation

The key differentiator of this product is its use of AllnGaP chip technology for orange emission. Compared to older technologies, AllnGaP offers superior luminous efficacy and thermal stability, resulting in higher brightness and more consistent color output over its lifetime and across temperature variations. The dome lens design provides a wider and more uniform viewing angle compared to flat-lens or side-view packages. Its full compliance with standard reflow profiles (both leaded and lead-free) offers greater manufacturing flexibility than devices requiring special low-temperature processes.

10. Frequently Asked Questions Based on Technical Parameters

Q: What is the difference between dominant wavelength and peak wavelength?
A: Dominant wavelength (λd) is derived from the CIE chromaticity diagram and represents the single wavelength that best matches the perceived color of the light to the human eye. Peak wavelength (λp) is the wavelength at which the spectral power distribution is maximum. They are often close but not identical.

Q: Can I drive this LED at 30 mA continuously?
A: While the absolute maximum DC forward current is 30 mA, operating at this limit may reduce long-term reliability and increase junction temperature. For optimal lifetime and stability, designing the circuit to operate at or below the typical test condition of 20 mA is advisable, applying appropriate derating if the ambient temperature exceeds 25°C.

Q: Why is a series resistor necessary for each LED in parallel?
A: The forward voltage (Vf) of LEDs has a production tolerance. Without individual resistors, LEDs with a slightly lower Vf will draw disproportionately more current than their neighbors in a parallel configuration, leading to brightness mismatch and potential overcurrent failure of the lower-Vf devices. The resistor acts as a current ballast.

11. Practical Design and Usage Case

Scenario: Designing a multi-indicator status panel. A designer needs 10 uniform orange indicators on a control panel. They select LEDs from the same intensity bin (e.g., V bin: 710-1120 mcd) and wavelength bin (e.g., Bin 2: 605-610 nm) to ensure consistency. The power supply is 5V. Using the typical Vf of 2.0V at 20mA, the required series resistor value is calculated as R = (Vsupply - Vf) / If = (5V - 2.0V) / 0.02A = 150 Ohms. The power dissipation in the resistor is P = I^2 * R = (0.02)^2 * 150 = 0.06W, so a standard 1/8W or 1/4W resistor is sufficient. Ten identical circuits, each with an LED and a 150-ohm resistor, are connected in parallel to the 5V rail. The PCB layout uses the recommended pad dimensions, and the assembly follows the Pb-free IR reflow profile.

12. Principle Introduction

Light emission in this LED is based on electroluminescence in a semiconductor. The AllnGaP chip consists of multiple layers of aluminum, indium, gallium, and phosphide compounds forming a p-n junction. When a forward voltage is applied, electrons and holes are injected across the junction and recombine in the active region. The energy released during this recombination is emitted as photons (light). The specific composition of the AllnGaP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, orange (~605 nm). The dome-shaped epoxy lens serves to protect the semiconductor chip, improve light extraction efficiency by reducing internal reflection, and shape the beam into the specified viewing angle.

13. Development Trends

The trend in indicator-type SMD LEDs continues towards higher efficiency, allowing for the same brightness at lower drive currents, which reduces power consumption and heat generation. There is also a push for improved color consistency and tighter binning tolerances to meet the demands of applications like full-color displays and automotive lighting. Packaging is evolving to offer higher reliability under harsh conditions (higher temperature, humidity) and compatibility with even more aggressive soldering processes. Furthermore, integration of ESD protection diodes within the LED package itself is becoming more common to enhance robustness during handling and assembly.