SMD LED 0201 Red AlInGaP Datasheet - Dimensions 2.0x1.25x0.8mm - Voltage 2.0V - Power 120mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature Surface Mount Device (SMD) Light Emitting Diode (LED) in the 0201 package size. The device utilizes an Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material to produce red light emission. Designed for automated assembly processes, this LED is suitable for space-constrained applications requiring reliable status indication or backlighting.

1.1 Core Advantages and Target Market

The primary advantages of this component include its extremely compact footprint, compatibility with high-volume automated pick-and-place and infrared reflow soldering equipment, and compliance with RoHS environmental directives. Its miniature size makes it ideal for integration into modern, densely packed electronic assemblies. The target applications span a wide range, including but not limited to telecommunications equipment (e.g., cellular phones), portable computing devices (e.g., notebooks), networking hardware, home appliances, and indoor signage or display panels where it can serve as a status indicator, signal luminary, or front-panel backlight.

2. Technical Parameters: In-Depth Objective Interpretation

2.1 Absolute Maximum Ratings

The device is characterized under specific environmental limits to ensure long-term reliability. The absolute maximum ratings define the stress limits beyond which permanent damage may occur. Key limits include a power dissipation of 120 mW, a continuous DC forward current of 30 mA, and a peak forward current of 100 mA under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). The maximum reverse voltage is 5 V. The operational ambient temperature range is specified from -30°C to +85°C, while the storage temperature range extends from -40°C to +100°C. Operating the device outside these ratings is not recommended.

2.2 Electro-Optical Characteristics

The performance is specified at a standard test condition of 25°C ambient temperature and a forward current (I_F) of 20 mA. The luminous intensity (I_V) typically ranges from 200 to 400 millicandelas (mcd). The viewing angle, defined as 2θ_1/2 where intensity drops to half its axial value, is approximately 110 degrees, indicating a wide viewing pattern. The peak emission wavelength (λ_p) is centered at 631 nm. The dominant wavelength (λ_d), which defines the perceived color, falls between 619 nm and 629 nm. The forward voltage (V_F) at 20 mA has a typical value of 2.0 V and a maximum of 2.4 V. The device offers an Electrostatic Discharge (ESD) withstand voltage of 2 kV (Human Body Model).

3. Bin Rank System Explanation

To ensure consistency in application design, the LEDs are sorted into bins based on key parameters. This allows designers to select components that meet specific circuit requirements for voltage drop and brightness.

3.1 Forward Voltage (V_F) Binning

The forward voltage is categorized into several bins, each with a defined minimum and maximum value measured at 20 mA. For example, bin code VA1 covers V_F from 1.8V to 1.9V, while VC2 covers 2.3V to 2.4V. A tolerance of ±0.10 V is applied within each bin. This binning is crucial for designing stable constant-current drivers and ensuring uniform brightness when multiple LEDs are connected in parallel.

3.2 Luminous Intensity (I_V) Binning

The luminous output is binned into two primary groups measured at 20 mA. Bin P1 includes LEDs with intensity from 200 mcd to 300 mcd, and bin P2 includes those from 300 mcd to 400 mcd. A tolerance of ±11% is specified for each intensity bin. This allows designers to choose the appropriate brightness level for their application, whether for high-visibility indicators or lower-power status lights.

4. Performance Curve Analysis

While specific graphical curves are referenced in the datasheet (e.g., Figure 1 for spectral distribution, Figure 5 for viewing angle), their typical behavior can be described. The relationship between forward current (I_F) and forward voltage (V_F) is exponential, characteristic of a diode. The luminous intensity is approximately proportional to the forward current within the specified operating range. The dominant wavelength may exhibit a slight negative temperature coefficient, meaning it can shift towards longer wavelengths (red shift) as the junction temperature increases. The viewing angle pattern is typically Lambertian or near-Lambertian for this package type, providing wide, even illumination.

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to the EIA standard 0201 package outline. Key dimensions include a typical body length of 2.0 mm, a width of 1.25 mm, and a height of 0.8 mm. The dimensional tolerance is typically ±0.2 mm unless otherwise noted. The lens is water clear, and the emitted color is red from the AlInGaP chip.

5.2 Recommended PCB Attachment Pad and Polarity

A land pattern design is provided for infrared or vapor phase reflow soldering. The design ensures proper solder joint formation and mechanical stability. The component has anode and cathode terminals; correct polarity must be observed during placement. The datasheet includes an illustration of the recommended pad geometry, including dimensions for the solder mask and copper pad.

6. Soldering and Assembly Guidelines

6.1 IR Reflow Soldering Profile

A suggested reflow profile compliant with J-STD-020B for lead-free processes is provided. Key parameters include a preheat temperature between 150°C and 200°C, a preheat time up to 120 seconds maximum, a peak body temperature not exceeding 260°C, and a time above 217°C (liquidus) limited to a maximum of 10 seconds. It is critical to follow PCB-specific characterization as board design and thermal mass affect the final profile.

6.2 Storage and Handling

The LEDs are moisture-sensitive. When stored in their original sealed moisture-proof bag with desiccant, they should be kept at ≤30°C and ≤70% RH and used within one year. Once the bag is opened, the storage environment should not exceed 30°C and 60% RH. Components exposed to ambient conditions for more than 168 hours are recommended to be baked at approximately 60°C for at least 48 hours before soldering to prevent popcorn cracking during reflow.

6.3 Cleaning

If cleaning is necessary after soldering, only specified alcohol-based solvents like ethyl alcohol or isopropyl alcohol should be used. The LED should be immersed at normal temperature for less than one minute. Unspecified chemical cleaners may damage the package epoxy.

7. Packaging and Ordering Information

The components are supplied packaged for automated assembly. They are mounted on 12 mm wide embossed carrier tape and wound onto 7-inch (178 mm) diameter reels. Each reel contains 4000 pieces. The tape pockets are sealed with a top cover tape. Packaging follows ANSI/EIA-481 specifications. For order quantities less than a full reel, a minimum packing quantity of 500 pieces is available for remnants.

8. Application Suggestions

8.1 Typical Application Circuits

LEDs are current-driven devices. For consistent brightness, especially when multiple LEDs are used in parallel, it is strongly recommended to drive each LED with its own current-limiting resistor connected in series. A simple circuit diagram would show a voltage source (V_CC), a resistor (R_S), and the LED in series. The resistor value is calculated as R_S = (V_CC - V_F) / I_F, where V_F is the forward voltage of the LED at the desired current I_F.

8.2 Design Considerations

Designers must consider thermal management. Although small, the 120 mW power dissipation can raise the junction temperature if the PCB thermal path is inadequate, potentially reducing light output and lifespan. The wide viewing angle (110°) makes it suitable for applications where the indicator needs to be seen from various angles. The 2 kV ESD rating is typical for consumer-grade components; additional external ESD protection may be required in harsh environments.

9. Technical Comparison and Differentiation

Compared to larger SMD LEDs (e.g., 0603, 0805), the 0201 package offers a significant reduction in board space, enabling higher density designs. The AlInGaP technology provides high luminous efficiency in the red/orange/amber spectrum range compared to older technologies like GaAsP. The specified compatibility with infrared reflow soldering and JEDEC preconditioning (Level 3) indicates suitability for standard, high-reliability assembly processes common in the industry.

10. Frequently Asked Questions Based on Technical Parameters

Q: Can I drive this LED directly from a 3.3V or 5V logic output?
A: No. An LED must be driven with a current limit. Connecting it directly to a voltage source would cause excessive current to flow, destroying the device. Always use a series resistor or a constant-current driver.

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λ_p) is the wavelength at which the spectral power distribution is highest. Dominant wavelength (λ_d) is derived from the CIE chromaticity diagram and represents the single wavelength of a pure monochromatic light that would match the perceived color of the LED. λ_d is more relevant for color specification.

Q: How does temperature affect performance?
A: Typically, as junction temperature increases, forward voltage decreases slightly, and luminous output decreases. The dominant wavelength may also shift. Operating within the specified temperature range is essential for stable performance.

11. Practical Design and Usage Case

Consider a compact wearable device requiring multiple low-power status indicators (power, Bluetooth connection, battery warning). Using 0201 red LEDs allows them to be placed in a tight array on the device's edge. A microcontroller GPIO pin, configured as an open-drain output, can sink current through each LED via a 100Ω series resistor to a 3.3V rail, providing a controlled current of approximately (3.3V - 2.0V)/100Ω = 13 mA, which is within the safe operating area and provides sufficient brightness. The wide viewing angle ensures the indicators are visible even when the device is worn.

12. Operating Principle Introduction

Light emission in this AlInGaP LED is based on electroluminescence. When a forward bias voltage is applied across the p-n junction, electrons from the n-type region and holes from the p-type region are injected into the active region. There, they recombine, releasing energy in the form of photons. The specific bandgap energy of the AlInGaP semiconductor alloy determines the wavelength (color) of the emitted light, which in this case is in the red spectrum (~631 nm peak). The epoxy lens encapsulates the semiconductor die, provides mechanical protection, and shapes the light output pattern.

13. Technology Trends

The trend in indicator LEDs continues towards miniaturization (smaller than 0201), higher efficiency (more lumens per watt), and improved reliability. Integration with onboard control circuitry (e.g., addressable RGB LEDs) is also prevalent. For monochromatic indicators, the focus remains on achieving consistent color and brightness in ultra-small packages while maintaining compatibility with standard SMT assembly processes and increasing robustness against environmental factors like humidity and thermal cycling.