SMD LED 0201 Red AlInGaP Datasheet - Dimensions 0.6x0.3x0.25mm - Voltage 1.7-2.4V - Power 72mW - English Technical Document

1. Product Overview

This document details the specifications for a miniature surface-mount device (SMD) light-emitting diode (LED) in the 0201 package size. The device utilizes Aluminum Indium Gallium Phosphide (AlInGaP) technology to produce a red light output. Its extremely compact dimensions make it suitable for automated printed circuit board (PCB) assembly processes and applications where space is at a premium.

1.1 Core Advantages

• Miniature Footprint: The 0201 package is one of the smallest standardized SMD LED footprints, enabling high-density PCB designs.
• Automation Compatibility: Designed for compatibility with high-speed automatic pick-and-place equipment and standard infrared (IR) reflow soldering processes.
• RoHS Compliance: The device is manufactured to meet Restriction of Hazardous Substances (RoHS) directives.
• IC Compatibility: The electrical characteristics allow for direct interfacing with integrated circuit outputs.

1.2 Target Markets and Applications

This LED is intended for a broad range of consumer and industrial electronics where small size and reliable indication are required.

• Portable Electronics: Status indicators in mobile phones, tablets, laptops, and wearable devices.
• Network & Communication Equipment: Link/activity lights on routers, switches, and modems.
• Home Appliances & Office Automation: Power, mode, or function indicators.
• Front Panel Backlighting: Illumination for symbols, icons, or buttons.
• General Status/Signal Luminary: Any application requiring a compact, bright visual indicator.

2. Technical Parameter Deep-Dive

This section provides an objective interpretation of the key electrical, optical, and thermal parameters defined in the datasheet.

2.1 Absolute Maximum Ratings

These are stress limits that must not be exceeded under any conditions, even momentarily. Operation beyond these limits may cause permanent damage.

• Power Dissipation (Pd): 72 mW. This is the maximum allowable power loss as heat. Exceeding this can lead to overheating and reduced lifespan.
• Peak Forward Current (I_FP): 80 mA. This is permissible only under pulsed conditions (1/10 duty cycle, 0.1ms pulse width). It is not for continuous DC operation.
• DC Forward Current (I_F): 30 mA. This is the maximum recommended continuous forward current for reliable long-term operation.
• Operating Temperature (T_opr): -40°C to +85°C. The device is guaranteed to function within this ambient temperature range.
• Storage Temperature (T_stg): -40°C to +100°C. The device can be stored without damage within this range when not powered.

2.2 Electro-Optical Characteristics

These parameters are measured at a standard test condition of 25°C ambient temperature and a forward current (I_F) of 20 mA, unless otherwise noted.

• Luminous Intensity (I_V): 170 - 340 mcd (min - max). This is the perceived brightness of the LED as measured by a sensor filtered to the human eye response (CIE curve). The wide range indicates a binning system is used (see Section 3).
• Viewing Angle (2θ_1/2): 110° (typical). This is the full angle at which the luminous intensity drops to half of its peak (on-axis) value. A 110° angle provides a very wide viewing cone.
• Peak Emission Wavelength (λ_p): 624 nm (typical). This is the wavelength at the highest point of the optical emission spectrum.
• Dominant Wavelength (λ_d): 617 - 630 nm. This is derived from the CIE chromaticity diagram and represents the single wavelength that best describes the perceived color (red).
• Spectral Line Half-Width (Δλ): 15 nm (typical). This indicates the spectral purity; a smaller value means a more monochromatic color.
• Forward Voltage (V_F): 1.7 - 2.4 V. The voltage drop across the LED when driven at 20 mA. This range is also subject to binning.
• Reverse Current (I_R): 100 μA (max) at V_R = 5V. The device is not designed for reverse bias operation; this parameter is for leakage test purposes only.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted (binned) based on key parameters. This allows designers to select parts that meet specific brightness and voltage requirements for their application.

3.1 Luminous Intensity (I_V) Binning

LEDs are categorized into bins based on their measured luminous intensity at 20 mA.

• Bin Code S1: Minimum 170.0 mcd, Maximum 240.0 mcd.
• Bin Code S2: Minimum 240.0 mcd, Maximum 340.0 mcd.
• Tolerance within each bin is ±11%.

3.2 Forward Voltage (V_F) Binning

LEDs are also binned by their forward voltage drop at 20 mA, which is important for current matching in parallel circuits and power supply design.

• Bin Code D2: Minimum 1.7 V, Maximum 2.0 V.
• Bin Code D3: Minimum 2.0 V, Maximum 2.2 V.
• Bin Code D4: Minimum 2.2 V, Maximum 2.4 V.
• Tolerance within each bin is ±0.10 V.

4. Performance Curve Analysis

While specific graphical data is referenced in the datasheet, typical performance trends for such LEDs are described below.

4.1 Current vs. Voltage (I-V) Characteristic

An LED exhibits a diode-like I-V curve. The forward voltage (V_F) increases logarithmically with current. The specified V_F range at 20 mA is critical for designing the current-limiting circuitry (usually a series resistor).

4.2 Luminous Intensity vs. Forward Current

The light output (I_V) is approximately proportional to the forward current (I_F) over a significant range. However, efficiency may drop at very high currents due to increased heat. Operating at or below the recommended 20-30 mA ensures optimal performance and longevity.

4.3 Temperature Dependence

LED performance is temperature-sensitive. Typically, the forward voltage (V_F) decreases with increasing junction temperature, while the luminous intensity also decreases. The specified operating temperature range of -40°C to +85°C defines the limits for guaranteed performance.

5. Mechanical and Package Information

5.1 Package Dimensions

The device conforms to the EIA standard 0201 package outline. Key dimensions (in millimeters) are approximately 0.6mm in length, 0.3mm in width, and 0.25mm in height. Tolerances are typically ±0.2mm. The lens is water clear, with the AlInGaP chip emitting red light.

5.2 Recommended PCB Pad Design

A land pattern (footprint) for the PCB is provided to ensure proper soldering and mechanical stability during IR reflow. The design typically includes two rectangular pads slightly larger than the device's terminals to facilitate good solder fillet formation.

5.3 Polarity Identification

For the 0201 package, polarity is usually indicated by a marking on the component body or by the internal structure of the tape and reel packaging. The cathode is typically identified. Designers must consult the tape orientation diagram to ensure correct placement.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Parameters

The device is compatible with lead-free (Pb-free) infrared (IR) reflow soldering processes. A suggested profile per J-STD-020B is provided, with key limits:

• Pre-heat: 150-200°C for a maximum of 120 seconds.
• Peak Temperature: Maximum 260°C.
• Time Above Liquidus: Recommended to be within standard profile limits to ensure proper joint formation without thermal damage.

Note: The actual profile must be characterized for the specific PCB assembly, considering board thickness, component density, and solder paste specifications.

6.2 Storage and Handling

• Moisture Sensitivity: The devices are packaged in moisture-barrier bags with desiccant. Once the original bag is opened, the components are sensitive to ambient humidity.
• Floor Life: It is recommended to complete IR reflow within 168 hours (7 days) after opening the dry-pack bag if stored at ≤ 30°C / 60% RH.
• Extended Storage: For storage beyond 168 hours, components should be rebaked (e.g., 60°C for 48 hours) before soldering to prevent "popcorning" during reflow.

6.3 Cleaning

If post-solder cleaning is necessary, only alcohol-based solvents like isopropyl alcohol (IPA) or ethyl alcohol should be used. Immersion should be at normal temperature and for less than one minute. Unspecified chemicals may damage the LED package.

7. Packaging and Ordering

7.1 Tape and Reel Specifications

The components are supplied on 12mm wide embossed carrier tape, wound onto 7-inch (178mm) diameter reels.

• Quantity per Reel: 4000 pieces.
• Minimum Order Quantity (MOQ): 500 pieces for remainder quantities.
• Packaging Standards: Compliant with ANSI/EIA-481 specifications.

8. Application Recommendations

8.1 Drive Circuit Design

LEDs are current-driven devices. To ensure uniform brightness, especially when multiple LEDs are connected in parallel, each LED should ideally have its own current-limiting resistor. Driving LEDs in series ensures identical current, promoting intensity matching.

8.2 Thermal Management

Although power dissipation is low (72mW max), proper PCB layout can help dissipate heat. Ensuring adequate copper area around the solder pads and avoiding placement in localized hot spots on the PCB contributes to long-term reliability.

8.3 Design Verification

Due to the miniature size, visual inspection after soldering may require magnification. Electrical testing should verify forward voltage and light output are within expected ranges for the selected bin codes.

9. Technical Comparison and Differentiation

The primary differentiation of this component lies in its package size. The 0201 footprint is significantly smaller than common alternatives like 0402 or 0603 SMD LEDs. This allows for higher component density and more compact end products. The trade-off can be slightly lower maximum power dissipation and the need for more precise assembly equipment compared to larger packages.

10. Frequently Asked Questions (FAQs)

10.1 Can I drive this LED directly from a 3.3V or 5V logic output?

No. A series current-limiting resistor is always required. The resistor value (R) is calculated using Ohm's Law: R = (V_supply - V_F) / I_F. Using the maximum V_F (2.4V) for a conservative design, with a 3.3V supply and target I_F of 20mA, R = (3.3 - 2.4) / 0.02 = 45Ω. A standard 47Ω resistor would be suitable.

10.2 Why is binning important?

Binning ensures color and brightness consistency within a production batch. For applications where multiple LEDs are used side-by-side (e.g., an indicator panel), specifying the same intensity and voltage bin codes is crucial to avoid visible differences in brightness or color shade.

10.3 What happens if I exceed the absolute maximum DC current?

Operating above 30 mA DC increases the junction temperature beyond safe limits. This accelerates lumen depreciation (the LED dims over time) and can lead to catastrophic failure. Always design circuits to operate within the recommended DC forward current.

11. Practical Design Case Study

Scenario: Designing a compact IoT sensor module with a single red status LED. Space is extremely limited on the 4-layer PCB.

Implementation: The 0201 LED is selected for its minimal footprint. It is placed near the edge of the board. A 47Ω, 0201-sized resistor is placed in series between the LED anode and a GPIO pin of a 3.3V microcontroller. The GPIO is configured as an open-drain output, sinking current to ground when active. The cathode is connected to the GPIO pin, and the anode is connected to 3.3V via the resistor. This configuration allows the MCU to turn the LED on by setting the GPIO low. The land pattern from the datasheet is used in the PCB layout. The assembly house is informed of the component's moisture sensitivity level (MSL) and the need for a controlled reflow profile.

12. Operating Principle

This LED is based on Aluminum Indium Gallium Phosphide (AlInGaP) semiconductor material. When a forward voltage is applied, electrons and holes are injected into the active region of the semiconductor junction. Their recombination releases energy in the form of photons (light). The specific composition of the AlInGaP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, in the red spectrum (~624 nm). The water-clear epoxy lens encapsulates the semiconductor chip and shapes the light output beam.

13. Technology Trends

The general trend in indicator LEDs continues toward smaller package sizes (like 0201 and 01005) to support the miniaturization of electronic devices. There is also a focus on increasing efficiency (more light output per unit of electrical power) and improving reliability under harsh conditions. Furthermore, integration with other passive components or drivers into multi-chip modules is an area of development, though discrete LEDs like this one remain essential for design flexibility and cost-effectiveness in many applications.