SMD LED 19-213 Reddish Orange Datasheet - Package Dimensions - Forward Voltage 2.0V - Power Dissipation 60mW - English Technical Document

1. Product Overview

The 19-213 is a surface-mount device (SMD) LED designed for high-density, miniature applications. It utilizes AlGaInP semiconductor material to emit a reddish-orange light. Its compact size and lightweight construction make it ideal for modern electronic designs where space is at a premium.

1.1 Core Advantages

The primary advantages of this component include its significantly smaller footprint compared to lead-frame type LEDs, enabling reduced board size and higher packing density. It is packaged on 8mm tape on a 7-inch diameter reel for compatibility with automated placement equipment. The device is Pb-free, RoHS compliant, compliant with EU REACH regulations, and meets halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

Typical applications include backlighting for dashboards and switches, indicator and backlighting in telecommunication devices such as telephones and fax machines, flat backlighting for LCDs, switches, and symbols, as well as general-purpose indicator use.

2. In-Depth Technical Parameter Analysis

2.1 Absolute Maximum Ratings

These ratings define the limits beyond which permanent damage to the device may occur. They are specified at an ambient temperature (Ta) of 25°C.

• Reverse Voltage (VR): 5 V. Exceeding this voltage in reverse bias can cause junction breakdown.
• Forward Current (IF): 25 mA. The maximum continuous DC current allowed through the LED.
• Peak Forward Current (IFP): 60 mA. This is the maximum pulsed current, specified at a duty cycle of 1/10 and a frequency of 1 kHz. It should not be used for continuous operation.
• Power Dissipation (Pd): 60 mW. The maximum power the package can dissipate without exceeding its thermal limits.
• Electrostatic Discharge (ESD) Human Body Model (HBM): 2000 V. This indicates the device's sensitivity to static electricity; proper ESD handling procedures are required.
• Operating Temperature (Topr): -40°C to +85°C. The ambient temperature range over which the device is guaranteed to operate.
• Storage Temperature (Tstg): -40°C to +90°C.
• Soldering Temperature (Tsol): Reflow soldering: 260°C peak for 10 seconds maximum. Hand soldering: 350°C for 3 seconds maximum per terminal.

2.2 Electro-Optical Characteristics

These parameters define the light output and electrical performance under typical operating conditions (Ta=25°C, IF=20mA).

• Luminous Intensity (Iv): 36.0 mcd (Min), 72.0 mcd (Max). The typical value falls within this range. The actual output is binned (see Section 3).
• Viewing Angle (2θ1/2): 120 degrees (Typical). This wide viewing angle makes it suitable for applications requiring broad illumination.
• Peak Wavelength (λp): 621 nm (Typical). The wavelength at which the spectral emission is strongest.
• Dominant Wavelength (λd): 605.5 nm (Min), 625.5 nm (Max). This is the perceived color of the light and is also binned.
• Spectral Bandwidth (Δλ): 18 nm (Typical). The width of the emitted spectrum at half the peak intensity.
• Forward Voltage (VF): 1.75 V (Min), 2.00 V (Typ), 2.35 V (Max) at IF=20mA. This parameter is binned and has a direct impact on power supply design.
• Reverse Current (IR): 10 μA (Max) at VR=5V. Note that the device is not designed for operation in reverse bias; this parameter is for leakage current testing only.

3. Binning System Explanation

To ensure consistency in production, LEDs are sorted into bins based on key parameters. This allows designers to select parts that meet specific performance criteria for their application.

3.1 Luminous Intensity Binning

Bins are defined by minimum and maximum luminous intensity values at IF=20mA.

• Bin N2: 36.0 mcd to 45.0 mcd
• Bin P1: 45.0 mcd to 57.0 mcd
• Bin P2: 57.0 mcd to 72.0 mcd

3.2 Dominant Wavelength Binning

Bins are defined by minimum and maximum dominant wavelength values at IF=20mA.

• Bin E1: 605.5 nm to 609.5 nm
• Bin E2: 609.5 nm to 613.5 nm
• Bin E3: 613.5 nm to 617.5 nm
• Bin E4: 617.5 nm to 621.5 nm
• Bin E5: 621.5 nm to 625.5 nm

3.3 Forward Voltage Binning

Bins are defined by minimum and maximum forward voltage values at IF=20mA.

• Bin 0: 1.75 V to 1.95 V
• Bin 1: 1.95 V to 2.15 V
• Bin 2: 2.15 V to 2.35 V

4. Performance Curve Analysis

The datasheet provides several characteristic curves that are essential for understanding device behavior under varying conditions.

4.1 Spectrum Distribution

The curve shows a typical spectral output centered around 621 nm (peak wavelength) with a bandwidth of approximately 18 nm. This confirms the monochromatic, reddish-orange emission characteristic of AlGaInP material.

4.2 Radiation Pattern

The polar diagram illustrates the spatial distribution of light intensity. The 120-degree viewing angle is confirmed, showing a near-Lambertian emission pattern where intensity is highest at 0° (perpendicular to the chip) and decreases gradually towards the edges.

4.3 Forward Current vs. Forward Voltage

This IV curve shows the exponential relationship typical of a diode. The forward voltage increases logarithmically with current. The curve is essential for determining the operating point and designing the current-limiting circuit.

4.4 Relative Luminous Intensity vs. Forward Current

This curve demonstrates that light output is approximately proportional to forward current within the specified operating range. However, efficiency may drop at very high currents due to increased heat.

4.5 Relative Luminous Intensity vs. Ambient Temperature

This is a critical curve for thermal management. Luminous intensity decreases as ambient temperature rises. The curve shows that output can drop significantly as temperature approaches the maximum operating limit, highlighting the need for adequate heat dissipation in high-temperature environments.

4.6 Forward Current Derating Curve

This graph defines the maximum allowable continuous forward current as a function of ambient temperature. To prevent overheating and ensure reliability, the forward current must be reduced when operating at high ambient temperatures. This curve is fundamental for reliable power design.

5. Mechanical and Package Information

5.1 Package Dimensions

The device features a standard SMD package. The dimensional drawing provides critical measurements including body length, width, height, and pad spacing. All unspecified tolerances are ±0.1mm. The exact dimensions are crucial for PCB footprint design and ensuring proper placement and soldering.

5.2 Polarity Identification

The cathode is typically marked on the device, often by a notch, a dot, or a green marking on the package. Correct polarity orientation during assembly is essential for proper function.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A Pb-free reflow soldering profile is recommended: pre-heating between 150-200°C for 60-120 seconds, time above liquidus (217°C) for 60-150 seconds, with a peak temperature not exceeding 260°C for a maximum of 10 seconds. The maximum ramp-up rate is 6°C/sec, and the maximum ramp-down rate is 3°C/sec. Reflow should not be performed more than twice.

6.2 Hand Soldering

If hand soldering is necessary, the soldering iron tip temperature should be less than 350°C, and contact time per terminal should not exceed 3 seconds. Use a soldering iron with a capacity of 25W or less. Allow an interval of more than 2 seconds between soldering each terminal to prevent thermal shock.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant bags with desiccant. The bag should not be opened until the components are ready for use. After opening, unused LEDs should be stored at 30°C or less and 60% relative humidity or less. The "floor life" after opening is 168 hours (7 days). If this time is exceeded or the desiccant indicator has changed color, a baking treatment at 60 ±5°C for 24 hours is required before use to remove absorbed moisture and prevent "popcorning" during reflow.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The components are supplied on 8mm wide carrier tape wound on a 7-inch diameter reel. The reel dimensions and carrier tape pocket dimensions are provided to ensure compatibility with automated pick-and-place machines. Each reel contains 3000 pieces.

7.2 Label Information

The reel label contains key information for traceability and identification: Customer's Product Number (CPN), Product Number (P/N), Packing Quantity (QTY), Luminous Intensity Rank (CAT), Chromaticity/Dominant Wavelength Rank (HUE), Forward Voltage Rank (REF), and Lot Number (LOT No).

8. Application Design Considerations

8.1 Current Limiting

Critical: An external current-limiting resistor must always be used in series with the LED. The forward voltage has a negative temperature coefficient and a tight tolerance, meaning a small increase in supply voltage can cause a large, potentially destructive increase in current. The resistor value should be calculated based on the supply voltage (Vs), the maximum forward voltage (VF_max from the bin), and the desired forward current (IF), using the formula: R = (Vs - VF_max) / IF.

8.2 Thermal Management

While the package is small, power dissipation (up to 60 mW) must be considered, especially in high ambient temperatures or when driven at high currents. Use the derating curve to select an appropriate operating current. Ensure the PCB has adequate copper area or thermal vias to conduct heat away from the LED pads, particularly in enclosed spaces or high-density layouts.

8.3 Optical Design

The 120-degree viewing angle provides wide, diffuse illumination. For applications requiring focused or directed light, secondary optics (lenses, light guides) will be necessary. The water-clear resin color ensures minimal absorption of the emitted light.

9. Technical Comparison and Differentiation

Compared to older through-hole LEDs, this SMD type offers a drastically reduced footprint and profile, enabling thinner and more compact end products. Its compatibility with automated assembly reduces manufacturing costs and improves placement accuracy. The AlGaInP technology provides high efficiency and good color purity in the orange-red spectrum. The comprehensive binning system offers designers the ability to select components with tightly controlled optical and electrical characteristics, which is crucial for applications requiring uniform appearance or precise current matching in arrays.

10. Frequently Asked Questions (FAQ)

10.1 What is the purpose of the different bin codes?

Binning ensures color and brightness consistency within a production batch. For example, in an array of LEDs, specifying the same luminous intensity (CAT) and dominant wavelength (HUE) bins will result in a uniform visual appearance. Specifying a forward voltage (REF) bin can help in designing simpler, more uniform driver circuits.

10.2 Can I drive this LED without a current-limiting resistor?

No. This is strongly discouraged and will likely lead to immediate failure. The LED's V-I characteristic is exponential, and even a regulated voltage source with slight noise or tolerance can cause the current to exceed the absolute maximum rating.

10.3 Why is there a storage time limit after opening the bag?

SMD packages can absorb moisture from the atmosphere. During the high-temperature reflow soldering process, this trapped moisture can rapidly vaporize, creating internal pressure that may crack the package ("popcorning"). The 168-hour floor life and baking instructions are critical for preventing this failure mode.

10.4 How do I interpret the Peak Forward Current rating?

The 60 mA Peak Forward Current (IFP) is for pulsed operation only, at a 10% duty cycle (1/10) and 1 kHz. It should not be used to size the DC operating current. The maximum continuous DC current is 25 mA (IF). Pulsing can be used for multiplexing or achieving higher instantaneous brightness, but the average current and power dissipation must remain within limits.

11. Design and Usage Case Study

Scenario: Designing a status indicator panel for an industrial control unit. The panel requires multiple uniform reddish-orange indicators. The designer would first select the appropriate luminous intensity bin (e.g., P1 for medium brightness) and dominant wavelength bin (e.g., E3 for a specific orange hue) to ensure visual consistency across all indicators. A constant current driver circuit set to 20 mA would be designed, with the current-limiting resistor value calculated using the maximum VF from the selected voltage bin (e.g., Bin 1: 2.15V max). The PCB layout would include adequate thermal relief for the LED pads, as the enclosure may experience elevated ambient temperatures. The production team would follow the moisture handling procedures, scheduling board assembly within the floor life after opening the reel or performing the necessary bake cycle.

12. Operating Principle

This LED is based on a semiconductor chip made of Aluminum Gallium Indium Phosphide (AlGaInP). When a forward voltage exceeding the diode's turn-on voltage (approximately 1.8-2.2V) is applied, electrons and holes are injected into the active region of the semiconductor. These charge carriers recombine, releasing energy in the form of photons. The specific composition of the AlGaInP alloy determines the bandgap energy, which directly corresponds to the wavelength (color) of the emitted light—in this case, reddish-orange (~621 nm). The chip is encapsulated in a water-clear epoxy resin that protects the semiconductor, shapes the light output beam, and provides the mechanical structure for surface mounting.

13. Technology Trends

The general trend in SMD LEDs is toward higher efficiency (more lumens per watt), smaller package sizes for increased density, and improved reliability under harsh conditions (higher temperature, humidity). There is also a focus on tighter binning tolerances to meet the demands of applications like full-color displays and automotive lighting, where color and brightness uniformity are paramount. Furthermore, advancements in packaging materials aim to improve resistance to thermal stress and blue-light/UV degradation for longer operational lifetimes. The move to Pb-free and halogen-free materials, as seen in this component, reflects broader environmental and regulatory trends in the electronics industry.