SMD Reflector LED 67-23/R6GHBHC-B05/2T Datasheet - Package 6.0x3.2x1.9mm - Voltage 2.0-3.95V - Colors Red/Green/Blue - English Technical Document

1. Product Overview

The 67-23/R6GHBHC-B05/2T is a surface-mount device (SMD) LED housed in a P-LCC-4 package with an integrated reflector. This component is designed as a multi-color optical indicator, available in brilliant red (R6), brilliant green (GH), and blue (BH) emitted colors. The package features a white resin body with a colorless clear window, enhancing light output and providing a clean aesthetic. It is a Pb-free product compliant with RoHS directives, making it suitable for modern electronic assemblies with environmental regulations.

The core advantages of this LED include its compact P-LCC-4 footprint, which is ideal for high-density PCB designs, and its integrated reflector that improves luminous intensity and viewing angle control. The primary target markets are telecommunications equipment for status indication and backlighting, consumer electronics for switch and symbol illumination, LCD flat backlighting, and general-purpose indicator applications where reliable, bright, and color-pure light sources are required.

2. Technical Parameter Deep Dive

2.1 Absolute Maximum Ratings

The Absolute Maximum Ratings define the stress limits beyond which permanent damage to the device may occur. For all three color variants (R6, GH, BH), the maximum continuous forward current (I_F) is 25 mA, with a permissible peak forward current (I_FP) of 100 mA for pulsed operation. The maximum reverse voltage (V_R) is 5 V. Power dissipation (P_d) ratings are 120 mW for the red chip and 110 mW for the green and blue chips, which is critical for thermal management design. The device can operate within a temperature range of -40°C to +85°C and be stored from -40°C to +90°C. Soldering temperature limits are specified for reflow (260°C for 10 seconds max) and hand soldering (350°C for 3 seconds max).

2.2 Electro-Optical Characteristics

The electro-optical parameters are measured at a standard test condition of 25°C ambient temperature and a forward current of 20 mA. Luminous intensity varies by chip and bin: Red (R6) ranges from 112 to 285 mcd, Green (GH) from 180 to 715 mcd, and Blue (BH) from 72 to 285 mcd. All chips share a typical viewing angle (2θ_1/2) of 120 degrees. The peak wavelengths (λ_p) are approximately 632 nm (red), 518 nm (green), and 468 nm (blue). Corresponding dominant wavelengths (λ_d) have specified ranges for each color. Forward voltage (V_F) is typically 2.0V (max 2.4V) for red and 3.4V (max 3.95V) for green and blue chips. Reverse current (I_R) at V_R=5V is 10 µA max for red and 50 µA max for green/blue.

3. Binning System Explanation

The product utilizes a binning system to categorize units based on key optical and electrical parameters, ensuring consistency in application performance.

3.1 Luminous Intensity Binning

Luminous intensity is sorted into specific bins for each chip type, defined at I_F=20mA. For the Red (R6) chip: Bin R (112-180 mcd) and Bin S (180-285 mcd). For the Green (GH) chip: Bin S (180-285 mcd), Bin T (285-450 mcd), and Bin U (450-715 mcd). For the Blue (BH) chip: Bin Q (72-112 mcd), Bin R (112-180 mcd), and Bin S (180-285 mcd). A tolerance of ±11% applies to the luminous intensity.

3.2 Dominant Wavelength Binning

Dominant wavelength is also binned to control color purity. For the Red (R6) chip: Bin FF1 (621-626 nm) and Bin FF2 (626-631 nm). For the Green (GH) chip: Bin X (520-525 nm) and Bin Y (525-530 nm). For the Blue (BH) chip: Bin X (465-470 nm) and Bin Y (470-475 nm). A tolerance of ±1 nm is specified for the dominant wavelength. Forward voltage has a tolerance of ±0.1V.

4. Performance Curve Analysis

The datasheet includes typical electro-optical characteristic curves for each chip type (R6, GH, BH). While the specific graphical data is not provided in the text, these curves typically illustrate the relationship between forward current and luminous intensity, forward voltage versus forward current, and the effect of ambient temperature on luminous intensity. Analyzing such curves is essential for designers to understand the LED's behavior under non-standard operating conditions, such as driving at different currents or in varying thermal environments. The curves help in selecting appropriate current-limiting resistors and predicting brightness and color shift over the product's operating temperature range.

5. Mechanical and Package Information

5.1 Package Dimensions

The LED is housed in a P-LCC-4 package. The overall package dimensions are 6.0mm in length, 3.2mm in width, and 1.9mm in height (typical values, refer to the dimension drawing for details). The package includes a reflector cup. The drawing indicates the anode and cathode pad locations for the red, green, and blue chips. All unspecified tolerances are ±0.1mm.

5.2 Polarity Identification

The package drawing clearly marks the polarity. Correct polarity connection is crucial to prevent reverse bias damage, which is limited to 5V. Designers must align the PCB footprint with the package drawing to ensure proper orientation during assembly.

6. Soldering and Assembly Guidelines

6.1 Reflow Soldering Profile

A Pb-free reflow soldering temperature profile is recommended. Key parameters include: a pre-heating zone at 150-200°C for 60-120 seconds with a max ramp rate of 3°C/sec; time above 217°C should be 60-150 seconds; peak temperature should not exceed 260°C, with time at this peak limited to a maximum of 10 seconds; the cooling rate should not exceed 6°C/sec. Reflow soldering should not be performed more than two times on the same device.

6.2 Storage and Handling Precautions

The LEDs are packaged in moisture-resistant bags. The bag should not be opened until the components are ready for use. Before opening, store at ≤ 30°C and ≤ 90% RH. After opening, the components have a floor life of 168 hours under conditions of ≤ 30°C and ≤ 60% RH. Unused components must be resealed in a moisture-proof package. If the moisture indicator shows activation or the storage time is exceeded, a baking treatment at 60°C ± 5°C for 24 hours is required before soldering.

6.3 Over-Current Protection

An external current-limiting resistor is mandatory. The forward voltage has a tolerance, and a slight shift can cause a large change in current, potentially leading to burnout. The resistor value must be calculated based on the supply voltage and the LED's forward voltage/current characteristics.

7. Packaging and Ordering Information

The LEDs are supplied on moisture-resistant carrier tapes, which are then wound onto reels. The standard loaded quantity is 2000 pieces per reel. The carrier tape and reel dimensions are provided in the datasheet. A label on the reel provides key information, including the Product Number (P/N), packing quantity (QTY), and the specific bin codes for Luminous Intensity Rank (CAT), Dominant Wavelength Rank (HUE), and Forward Voltage Rank (REF).

8. Application Suggestions

8.1 Typical Application Scenarios

• Telecommunication Equipment: Status indicators, message waiting lights, and keypad backlighting in telephones and fax machines.
• Consumer Electronics: Backlighting for LCD panels, illumination for membrane switches and panel symbols.
• Light Pipe Applications: The clear window and bright output make it suitable for use with light guides to transmit light to a desired location on a product housing.
• General Indication: Power status, mode selection, and other user interface feedback in a wide range of electronic devices.

8.2 Design Considerations

• Current Drive: Always use a series resistor. Consider driving below the absolute maximum current (e.g., 20mA as per test condition) for improved longevity.
• Thermal Management: Ensure the PCB layout allows for heat dissipation, especially if multiple LEDs are used or if operated at high ambient temperatures. The power dissipation rating must not be exceeded.
• Optical Design: The 120-degree viewing angle provides wide visibility. For directed light, secondary optics like lenses or light pipes may be needed.
• ESD Protection: The ESD sensitivity varies (2000V HBM for red, 150V HBM for green/blue). Implement appropriate ESD control measures during handling and assembly.

9. Technical Comparison and Differentiation

Compared to non-reflector type SMD LEDs in similar packages, the integrated reflector of the 67-23 series offers higher axial luminous intensity for the same chip drive current, as the reflector directs more light forward. The P-LCC-4 package with a clear window typically offers better light extraction efficiency than diffused packages. The availability of three distinct, brilliant primary colors (red, green, blue) in a single package type simplifies inventory and design for multi-color indication systems. The specified binning for intensity and wavelength provides designers with predictable color and brightness performance, which is an advantage over unbinned or loosely binned alternatives.

10. Frequently Asked Questions (Based on Technical Parameters)

Q: Can I drive the green and blue LEDs at 3.3V directly?
A: Possibly, but not reliably. The typical forward voltage is 3.4V, with a maximum of 3.95V. At 3.3V, the LED may not turn on fully or at all, especially at lower temperatures where V_F increases. A boost circuit or a higher supply voltage (e.g., 5V) with a current-limiting resistor is recommended.

Q: What is the difference between peak wavelength and dominant wavelength?
A: Peak wavelength (λ_p) is the wavelength at which the spectral power distribution is maximum. Dominant wavelength (λ_d) is the single wavelength of monochromatic light that matches the perceived color of the LED. λ_d is more relevant for color specification in human vision.

Q: How do I interpret the luminous intensity bins for my design?
A: Select a bin based on the minimum brightness required for your application under worst-case conditions (e.g., high temperature, end-of-life). Using a higher bin (e.g., S instead of R) provides a brightness margin. Specify the required bin code (CAT) when ordering.

11. Practical Design and Usage Case

Case: Designing a Multi-Status Indicator Panel
A product requires a single tri-color indicator to show power (steady green), standby (blinking blue), and fault (steady red). The 67-23/R6GHBHC-B05/2T is selected. The design uses a microcontroller with three GPIO pins, each connected to the cathode of one LED color via a current-limiting resistor (calculated for 20mA drive from a 5V supply: ~80 ohms for red, ~82 ohms for green/blue, considering V_F tolerance). The anodes are connected to 5V. The software controls the pins to illuminate the desired color. The wide 120-degree viewing angle ensures visibility from various angles. The designer specifies bins CAT=S for green and blue and CAT=R for red to ensure adequate brightness, and requests HUE bins consistent with the desired color appearance.

12. Operational Principle Introduction

Light Emitting Diodes (LEDs) are semiconductor devices that emit light through electroluminescence. When a forward voltage is applied across the p-n junction, electrons and holes recombine in the active region, releasing energy in the form of photons. The color of the emitted light is determined by the energy bandgap of the semiconductor material used in the active region. In this product, the Red (R6) chip uses AlGaInP material, while the Green (GH) and Blue (BH) chips use InGaN material. The integrated reflector, made of highly reflective material, surrounds the semiconductor chip and redirects side-emitted light forward, increasing the useful light output in the viewing direction. The clear epoxy resin encapsulant protects the chip and acts as a primary lens.

13. Industry Trends and Developments

The SMD LED market continues to trend towards higher efficiency (more lumens per watt), smaller package sizes for miniaturization, and improved color consistency through tighter binning. There is also a growing emphasis on reliability under higher temperature and current density conditions, driven by applications like automotive lighting and high-brightness displays. The use of advanced materials, such as novel phosphors for white LEDs and improved encapsulants for better thermal and UV stability, is ongoing. Furthermore, integration of control electronics (e.g., constant current drivers) within the LED package is a developing trend to simplify circuit design and improve performance stability.