SMD LED 19-226/R6G7C-B02/2T Datasheet - Package Dimensions - Forward Voltage 2.0V - Brilliant Red/Yellow Green - English Technical Document

1. Product Overview

The 19-226 is a compact, surface-mount LED (SMD) featuring a built-in reflector. It is designed for applications requiring high-density component placement and reliable performance in automated assembly processes. The device is available in two distinct chip types, R6 and G7, emitting Brilliant Red and Brilliant Yellow Green light, respectively. Its small footprint and lightweight construction make it ideal for modern, miniaturized electronic devices.

1.1 Core Advantages

• Miniaturization: Significantly smaller than traditional lead-frame LEDs, enabling reduced PCB size, higher packing density, and ultimately smaller end products.
• Automation Compatibility: Supplied in 8mm tape on 7-inch reels, fully compatible with high-speed automatic pick-and-place equipment.
• Robust Process Compatibility: Suitable for both infrared and vapor phase reflow soldering processes.
• Environmental Compliance: The product is Pb-free, RoHS compliant, REACH compliant, and meets halogen-free standards (Br <900 ppm, Cl <900 ppm, Br+Cl < 1500 ppm).

1.2 Target Applications

• Telecommunications: Status indicators and backlighting in telephones and fax machines.
• Display Technology: Flat backlighting for LCD panels, switch illumination, and symbol lighting.
• General Purpose Indication: Wide range of consumer and industrial electronic devices requiring reliable visual indicators.

2. Technical Parameter Analysis

This section provides a detailed, objective interpretation of the key electrical, optical, and thermal parameters specified for the 19-226 LED. All data is referenced at an ambient temperature (Ta) of 25°C.

2.1 Absolute Maximum Ratings

These ratings define the stress limits beyond which permanent damage to the device may occur. Operation at or beyond these limits is not advised.

Parameter	Symbol	R6 Rating	G7 Rating	Unit
Reverse Voltage	VR	5	5	V
Continuous Forward Current	IF	25	25	mA
Peak Forward Current (1/10 Duty @1kHz)	IFP	60	60	mA
Power Dissipation	Pd	60	60	mW
Operating Temperature	Topr	-40 to +85	°C
Storage Temperature	Tstg	-40 to +90	°C
Electrostatic Discharge (HBM)	ESD	2000	2000	V
Soldering Temperature (Reflow)	Tsol	260°C for 30 sec max.	-

Interpretation: The device is rated for a standard 25mA continuous current. The 60mA peak current rating allows for brief pulses of higher brightness but must be managed with appropriate duty cycle. The ESD rating of 2000V (Human Body Model) indicates standard handling precautions are necessary. The reflow profile is critical for Pb-free assembly.

2.2 Electro-Optical Characteristics

These are the typical performance parameters under normal operating conditions (I_F = 10mA).

Parameter	Symbol	Chip	Min.	Typ.	Max.	Unit	Condition
Luminous Intensity	Iv	R6	22.5	-	57.0	mcd	IF=10mA
		G7	7.2	-	18.0	mcd
Viewing Angle (2θ1/2)	-	Both	-	120	-	deg	IF=10mA
Peak Wavelength	λp	R6	-	632	-	nm	IF=10mA
		G7	-	575	-	nm
Dominant Wavelength	λd	R6	616	-	626	nm	IF=10mA
		G7	567	-	575	nm
Forward Voltage	VF	R6	1.7	2.0	2.4	V	IF=10mA
		G7	1.7	2.0	2.4	V
Reverse Current	IR	R6	-	-	10	µA	VR=5V
		G7	-	-	10	µA

Interpretation: The R6 (Red) chip offers significantly higher luminous intensity (22.5-57.0 mcd) compared to the G7 (Yellow Green, 7.2-18.0 mcd) at the same 10mA drive current. The wide 120-degree viewing angle is characteristic of a reflector-type package, providing a broad emission pattern. The forward voltage is relatively low and consistent between the two colors, simplifying driver design. The tight range on dominant wavelength (e.g., 616-626nm for red) ensures good color consistency within a batch.

3. Binning System Explanation

To ensure consistency in brightness and color for production applications, the LEDs are sorted into bins.

3.1 Luminous Intensity Binning

LEDs are categorized based on their measured light output at I_F = 10mA. The tolerance for luminous intensity is ±11%.

R6 (Brilliant Red):

• Bin Code 1: 22.5 mcd to 36.0 mcd
• Bin Code 2: 36.0 mcd to 57.0 mcd

G7 (Brilliant Yellow Green):

• Bin Code K: 7.20 mcd to 11.5 mcd
• Bin Code L: 11.5 mcd to 18.0 mcd

3.2 Dominant Wavelength Binning (G7 Example)

For the G7 (Yellow Green) chip, dominant wavelength is also binned to control hue. The bins provided are: 1 (567.0-570.0 nm), 2 (569.0-571.5 nm), 3 (570.5-573.5 nm), and 4 (572.5-575.0 nm). This allows designers to select LEDs with a very specific shade of yellow-green.

4. Performance Curve Analysis

The datasheet includes typical characteristic curves which are essential for understanding device behavior under varying conditions.

4.1 Forward Current vs. Luminous Intensity (I_F - I_v)

This curve shows a sub-linear relationship. Luminous intensity increases with current but the efficiency (light output per mA) typically decreases at higher currents due to thermal and other effects. Designers must balance desired brightness with efficiency and device longevity.

4.2 Forward Current vs. Forward Voltage (I_F - V_F)

This is the diode's IV curve. It demonstrates the exponential relationship characteristic of LEDs. The voltage rises sharply once the turn-on threshold is passed. The typical V_F of 2.0V at 10mA is a key parameter for calculating the necessary current-limiting resistor value in a circuit.

4.3 Ambient Temperature vs. Relative Luminous Intensity

This curve is crucial for thermal management. LED light output decreases as the junction temperature increases. The curve quantifies this derating, showing the percentage of light output remaining at elevated ambient temperatures. Proper PCB layout and heat sinking are necessary to maintain brightness in high-temperature environments.

5. Mechanical and Package Information

5.1 Package Outline Dimensions

The 19-226 package is a surface-mount device. The drawing provides critical dimensions including body length, width, height, and the location and size of the solder pads. All tolerances are ±0.1mm unless otherwise specified. The suggested pad layout is for reference and should be optimized for the specific manufacturing process and PCB characteristics.

5.2 Polarity Identification

The cathode is typically indicated by a visual marker on the LED package, such as a notch, a dot, or a green marking on the tape. Correct polarity must be observed during placement to ensure proper operation.

6. Soldering and Assembly Guidelines

Adherence to these guidelines is critical for reliability.

6.1 Reflow Soldering Profile

A lead-free reflow profile is specified:

• Pre-heating: 150-200°C for 60-120 seconds.
• Time Above Liquidus (217°C): 60-150 seconds.
• Peak Temperature: 260°C maximum, held for no more than 10 seconds.
• Heating/Cooling Rate: Maximum 6°C/sec heating, 3°C/sec cooling above 255°C.

Critical Note: Reflow soldering should not be performed more than two times on the same device.

6.2 Hand Soldering

If hand soldering is unavoidable:

• Use a soldering iron with a tip temperature < 350°C.
• Limit contact time to 3 seconds per terminal.
• Use an iron with a capacity of 25W or less.
• Allow a minimum 2-second interval between soldering each terminal.

6.3 Storage and Moisture Sensitivity

The LEDs are packaged in moisture-resistant barrier bags with desiccant.

• Before Opening: Store at ≤30°C and ≤90% RH.
• After Opening: The "floor life" is 1 year at ≤30°C and ≤60% RH. Unused devices must be resealed in a moisture-proof package.
• Baking: If the desiccant indicator changes or storage time is exceeded, bake at 60 ±5°C for 24 hours before use in a reflow process.

7. Packaging and Ordering Information

7.1 Reel and Tape Specifications

The device is supplied in standard EIA-481 compliant packaging:

• Carrier Tape Width: 8 mm.
• Reel Diameter: 7 inches.
• Quantity per Reel: 2000 pieces.

Detailed dimensions for the reel, carrier tape, and cover tape are provided in the datasheet drawings.

7.2 Label Explanation

The reel label contains several codes:

• P/N: Product Number (e.g., 19-226/R6G7C-B02/2T).
• CAT: Luminous Intensity Rank (Bin Code).
• HUE: Chromaticity Coordinates & Dominant Wavelength Rank.
• REF: Forward Voltage Rank.
• LOT No: Traceable manufacturing lot number.

8. Application Design Considerations

8.1 Current Limiting is Mandatory

LEDs are current-driven devices. An external current-limiting resistor is absolutely required. The forward voltage has a tolerance (1.7V to 2.4V), and a small change in supply voltage can cause a large, potentially destructive change in current if not properly limited. The resistor value (R) is calculated using Ohm's Law: R = (V_supply - V_F) / I_F.

8.2 Thermal Management

While the power dissipation is low (60mW max), effective thermal management on the PCB is still important. Excessive junction temperature leads to reduced light output (lumen depreciation), accelerated aging, and potential color shift. Ensure adequate copper area around the solder pads to act as a heat sink, especially when driving at or near the maximum continuous current.

8.3 ESD Protection

With an ESD rating of 2000V (HBM), standard ESD precautions should be followed during handling, assembly, and testing. Use grounded workstations and wrist straps.

9. Technical Comparison and Differentiation

The 19-226 reflector-type SMD LED offers specific advantages:

• vs. Non-Reflector SMD LEDs: The integrated reflector provides a controlled, wide (120°) viewing angle without requiring secondary optics, simplifying design.
• vs. Larger LEDs: Its primary advantage is space savings and compatibility with fully automated assembly, reducing manufacturing cost for high-volume products.
• vs. Incandescent Lamps: Offers vastly superior lifetime, lower power consumption, and higher reliability, with the trade-off of requiring DC drive circuitry.

The use of AlGaInP semiconductor material for both the red and yellow-green versions provides high efficiency and good color saturation.

10. Frequently Asked Questions (Based on Technical Parameters)

10.1 What resistor value should I use for a 5V supply?

Using the typical V_F of 2.0V and a target I_F of 10mA: R = (5V - 2.0V) / 0.01A = 300 Ohms. To account for the V_F range, calculate for the minimum V_F (1.7V) to ensure current never exceeds the maximum: R_min = (5V - 1.7V) / 0.025A = 132 Ohms. A standard 150 Ohm or 180 Ohm resistor would be a safe choice, yielding a current between ~16-22mA, well within limits.

10.2 Can I drive this LED at 20mA continuously?

Yes. The absolute maximum continuous forward current is 25mA for both chip types. Operating at 20mA is within specification. Refer to the I_F-I_v curve to estimate the luminous intensity at this current, which will be higher than the 10mA rating.

10.3 Why is the storage temperature range wider than the operating range?

The storage rating (T_stg: -40 to +90°C) refers to the non-operating, passive state of the device. The operating range (T_opr: -40 to +85°C) is narrower because it accounts for the additional heat generated internally when the LED is powered, which raises the junction temperature above the ambient.

11. Design-in Case Study

Scenario: Designing a status indicator panel for a network router. The panel requires a bright red "Power" LED and a yellow-green "Network Activity" LED. Space is extremely limited on the crowded PCB.

Solution: The 19-226 series is selected. The R6 (Brilliant Red, Bin 2 for high brightness) is used for power. The G7 (Brilliant Yellow Green, Bin L, Wavelength Bin 3 for a specific hue) is used for activity. Both are placed using the same automated pick-and-place program. A single 3.3V rail powers the system. Current-limiting resistors are calculated as 130 Ohms ((3.3V - 2.0V)/0.01A) to provide a conservative 10mA drive, ensuring long-term reliability. The wide 120-degree viewing angle ensures the indicators are visible from various angles without needing light pipes.

12. Technical Principle Introduction

The 19-226 LED is a semiconductor light source. The R6 and G7 chips are fabricated from AlGaInP (Aluminum Gallium Indium Phosphide) materials. When a forward voltage is applied across the LED's P-N junction, electrons and holes recombine in the active region, releasing energy in the form of photons (light). The specific composition of the AlGaInP alloy determines the bandgap energy, which directly defines the wavelength (color) of the emitted light—approximately 632 nm (red) for R6 and 575 nm (yellow-green) for G7. The built-in reflector cup surrounding the semiconductor die helps direct the omnidirectional light emission into a forward-facing beam, increasing the useful light output and defining the viewing angle.

13. Industry Trends and Context

The 19-226 represents a mature and widely adopted SMD LED package format. Current industry trends influencing such components include:

• Increased Miniaturization: The drive for smaller devices continues, though packages like the 19-226 remain popular for their balance of size, performance, and manufacturability.
• Higher Efficiency: Ongoing material science improvements aim to increase lumens per watt (efficacy) for AlGaInP LEDs, though this datasheet reflects standard efficiency levels.
• Supply Chain Standardization: Packaging on 8mm tape and 7-inch reels is an industry standard, ensuring compatibility across global manufacturing platforms.
• Focus on Reliability Data: While this datasheet provides essential ratings, modern applications often require more extensive lifetime and reliability data (e.g., L70, L50 lifetime projections under various conditions) which may be available in separate documentation.